Abstract: Provided herein is an ultraviolet-curable adhesive composition that causes little damage to an optical base material, and with which an optical member can be obtained with desirable curability and adhesion and good productivity while achieving high whitening resistance, and improving bonding strength even when an optical base material is laminated after the ultraviolet irradiation of the coating layer formed by applying the ultraviolet-curable adhesive composition to the optical base material. An optical member producing method using the composition is also provided. The composition contains a monofunctional acrylate (A) represented by the following formula (1), a photopolymerizable oligomer (B), a photopolymerizable monomer (C) other than (A), and a photopolymerization initiator (D), wherein R1 represents a hydrogen atom or the like, and n represents an integer of 1 to 3.

Abstract: Disclosed is an ultraviolet-curable resin composition containing a polyurethane compound (A), a photopolymerization initiator (B), and an ethylenically unsaturated compound (C) other than the compound (A). The polyurethane compound (A) is obtained by reacting an epoxycarboxylate compound (c), which is obtained by reacting an epoxy compound (a) having two or more epoxy groups in a molecule with a monocarboxylic acid compound (b) having an ethylenically unsaturated group in a molecule, with a diisocyanate compound (d).

Abstract: Disclosed is an ultraviolet-curable resin composition containing a polyurethane compound (A), a photopolymerization initiator (B), and an ethylenically unsaturated compound (C) other than the compound (A). The polyurethane compound (A) is obtained by reacting an epoxycarboxylate compound (c), which is obtained by reacting an epoxy compound (a) having two or more epoxy groups in a molecule with a monocarboxylic acid compound (b) having an ethylenically unsaturated group in a molecule, with a diisocyanate compound (d).

Abstract: The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C).

Abstract: [PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof.