Patents by Inventor Hideaki Kataho
Hideaki Kataho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11460478Abstract: In a first transfer station, a second transfer station, and a third transfer station, a plurality of sample containers are transferred while being stored from a transfer source rack to a transfer destination rack row. In this case, for each of the sample containers to be a transfer target, a specific transfer destination rack is selected from the transfer destination rack row based on a content of processing to be applied in the future to a sample within the sample container.Type: GrantFiled: February 4, 2020Date of Patent: October 4, 2022Assignees: Hitachi, Ltd., Hitachi Industrial Equipment Systems Co., Ltd.Inventors: Kenta Sugiyama, Shigeki Okuno, Kunihiro Fujiki, Yoshinori Takeyama, Hidehiko Fushimi, Hideaki Kataho
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Publication number: 20200256883Abstract: In a first transfer station, a second transfer station, and a third transfer station, a plurality of sample containers are transferred while being stored from a transfer source rack to a transfer destination rack row. In this case, for each of the sample containers to be a transfer target, a specific transfer destination rack is selected from the transfer destination rack row based on a content of processing to be applied in the future to a sample within the sample container.Type: ApplicationFiled: February 4, 2020Publication date: August 13, 2020Applicant: Hitachi, Ltd.Inventors: Kenta SUGIYAMA, Shigeki OKUNO, Kunihiro FUJIKI, Yoshinori TAKEYAMA, Hidehiko FUSHIMI, Hideaki KATAHO
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Patent number: 8158209Abstract: Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.Type: GrantFiled: December 17, 2009Date of Patent: April 17, 2012Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 8047835Abstract: A method of transcribing a shape of a surface of a stamper on a transcription surface of a transcription object by pressing the stamper on the transcription object, which comprises steps of: having one of the stamper and the transcription object positioned opposite a plate surface and the other of the stamper and the transcription object placed on one surface of a pressure plate; and having the one of the stamper and the transcription object pressed onto the plate surface by applying a fluid on the other surface of the pressure plate, wherein an area of the one surface of the pressure plate is larger than a contact area in which the other of the stamper and the transcription object is in contact with the pressure plate.Type: GrantFiled: April 17, 2007Date of Patent: November 1, 2011Assignee: Hitachi High-Technologies CorporationInventors: Mitsuru Hasegawa, Masahiko Ogino, Takashi Ando, Hideaki Kataho
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Patent number: 8034277Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mold is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: GrantFiled: October 1, 2009Date of Patent: October 11, 2011Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 7964135Abstract: Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.Type: GrantFiled: March 9, 2010Date of Patent: June 21, 2011Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20100156006Abstract: Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.Type: ApplicationFiled: March 9, 2010Publication date: June 24, 2010Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20100092684Abstract: Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.Type: ApplicationFiled: December 17, 2009Publication date: April 15, 2010Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20100015380Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: ApplicationFiled: October 1, 2009Publication date: January 21, 2010Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Patent number: 7600993Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: GrantFiled: August 17, 2007Date of Patent: October 13, 2009Assignee: Hitachi High-Technologies CorporationInventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20080229948Abstract: An imprint device transfers a micropattern created on a stamper onto a material to be transferred, by bringing the stamper and the material to be transferred into contact with each other. The imprint device has a flow passage for discharging a fluid to a rear surface of the stamper or the material to be transferred, to thereby bend the stamper or the material to be transferred.Type: ApplicationFiled: January 25, 2008Publication date: September 25, 2008Inventors: Ryuta Washiya, Takashi Ando, Masahiko Ogino, Hideaki Kataho, Akihiro Miyauchi, Kosuke Kuwabara
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Publication number: 20080223237Abstract: An imprint device transfers a micropattern created on a stamper onto a material to be transferred, by bringing the stamper and the material to be transferred in contact with each other and separating the stamper from the material to be transferred. The stamper has a recessed part on a portion of an outer circumferential part thereof around a surface with the micropattern. An outer diameter of the stamper is larger than that of the material to be transferred. The outer diameter of the material to be transferred is larger than that of the surface with the micropattern.Type: ApplicationFiled: January 25, 2008Publication date: September 18, 2008Inventors: Takashi ANDO, Masahiko Ogino, Hideaki Kataho
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Publication number: 20080075908Abstract: An apparatus for transferring a pattern of minute surface structures, using a pair of press members which are located opposingly for movements toward and away from each other. One press member is adapted to support thereon a mold having on a transfer surface a master pattern of minute structures to be transferred, while the other press member is adapted to support thereon an annular substrate plate having a curable resin layer coated thereon and to press the resin layer against the transfer surface of the mold to transfer said minute structures to the resin layer. The mod is provided with a circular center hole defining at least three small-diameter segments and three large-diameter segments alternately and at uniform angular intervals along an inner periphery of the mold. The annular substrate plate has an inside diameter exactly matching with the small-diameter segments at the inner periphery of the mold.Type: ApplicationFiled: August 17, 2007Publication date: March 27, 2008Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20080018024Abstract: Disclosed herein is a method for transferring a pattern of minute dents and projections to an energy ray-setting resin layer coated on a substrate plate by pressing a master pattern on a transfer mold, followed by irradiation of energy rays. The pattern transfer method comprises the steps of pressing a master pattern on a transfer mold against the resin layer under a predetermined imprinting pressure, irradiating the resin layer under the imprinting pressure with energy rays, interrupting the irradiation of energy rays and at the same time cancelling application of the imprinting pressure and holding the resin layer and the transfer mold in a non-pressed state to relieve the resin layer of internal stresses, and recommencing irradiation of the resin layer with energy rays to complete hardening of the resin layer which is held in contact with the transfer mold in a non-pressed state.Type: ApplicationFiled: July 19, 2007Publication date: January 24, 2008Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20070289530Abstract: Method and apparatus for coating a surface of a work with a thin resin or plastic film suitable for use in imprinting a pattern by impressing a master pattern on a transfer surface of a mold on the coated resin film. A curable resin liquid is coated on a work by the use of an inkjet feed means having a plural number of inkjet nozzle holes in a row or rows on a nozzle assembly, in association with actuators to propel droplets of resin liquid from the respective inkjet nozzle holes in controlled timings while moving the inkjet feed means and the work relative to each other.Type: ApplicationFiled: May 23, 2007Publication date: December 20, 2007Inventors: Hideaki Kataho, Hiroshi Okada, Kenya Wada, Hisayoshi Ichikawa
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Publication number: 20070243281Abstract: A method of transcribing a shape of a surface of a stamper on a transcription surface of a transcription object by pressing the stamper on the transcription object, which comprises steps of: having one of the stamper and the transcription object positioned opposite a plate surface and the other of the stamper and the transcription object placed on one surface of a pressure plate; and having the one of the stamper and the transcription object pressed onto the plate surface by applying a fluid on the other surface of the pressure plate, wherein an area of the one surface of the pressure plate is larger than a contact area in which the other of the stamper and the transcription object is in contact with the pressure plate.Type: ApplicationFiled: April 17, 2007Publication date: October 18, 2007Inventors: Mitsuru Hasegawa, Masahiko Ogino, Takashi Ando, Hideaki Kataho
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Patent number: 6887330Abstract: Carrier tapes, each carrying electronic circuitry parts at predetermined intervals on a carrier portion, are successively and continuously fed to a punching station from a tape feeding station with at least a pair of tape supply reels. While a carrier tape from a first supply reel is being fed to the punching station, a carrier tape from a second supply reel is set in a standby position. As soon as the carrier tape from the first supply reel is consumed to a last electronic part, a head end of the carrier tape from the second supply reel is spliced to a tail end of the carrier tape of the first supply reel by means of tape holder members located in the course of a tape supply route between the tape feeding station and the tape punching station, thereby make replacement of the tape supply reel quicker and easier.Type: GrantFiled: July 7, 2003Date of Patent: May 3, 2005Assignee: Hitachi High-Tech Electronics Engineering Co., Ltd.Inventors: Jun Onoshiro, Kenya Wada, Hideaki Kataho
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Publication number: 20040069112Abstract: At a tape feeding station which is arranged to reel off an electronic parts carrier tape having a large number of electronics circuitry parts formed successively in a predetermined pitch on its carrier tape portion, at least a couple of reel support shafts are provided to replaceably support tape supply reels thereon. A carrier tape from one of the two supply reels is fed to a tape punching station along a predetermined tape supply route to punch out electronic circuitry parts successively from the tape. While a carrier tape is being supplied from one supply reel, the other supply reel is set in a standby position. A fore end portion of the carrier tape from the standby reel is disengageably retained on a tape switching means.Type: ApplicationFiled: July 7, 2003Publication date: April 15, 2004Inventors: Jun Onoshiro, Kenya Wada, Hideaki Kataho