Patents by Inventor Hideaki Kozu

Hideaki Kozu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead connecting structure for a semiconductor device
    Patent number: 4340901
    Abstract: An improved brazing structure is disclosed in which at least a tip end portion to be brazed of a lead is bent and this tip end portion is bonded to a metallized layer by a brazing material substantially in perpendicular to the plane of the metallized layer.
    Type: Grant
    Filed: December 21, 1979
    Date of Patent: July 20, 1982
    Assignee: Nippon Electric Co., Ltd.
    Inventors: Shinzo Anazawa, Hideaki Kozu