Patents by Inventor Hideaki Maeta

Hideaki Maeta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing semiconductor devices
    Patent number: 5677246
    Abstract: In the disclosed method of manufacturing semiconductor devices with a single-sided resin-sealed package structure, when resin is filled into between the chip and the substrate, the occurrence of variations in the finishing dimensions of the package or defects in the outward appearance of the package is prevented.
    Type: Grant
    Filed: November 28, 1995
    Date of Patent: October 14, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideaki Maeta, Katsuhiko Oyama, Hiroshi Iwasaki, Yumiko Ohshima, Takahito Nakazawa
  • Semiconductor package having semiconductor chip mounted on board in face-down relation
    Patent number: 5677575
    Abstract: The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.
    Type: Grant
    Filed: May 30, 1996
    Date of Patent: October 14, 1997
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideaki Maeta, Hiroshi Iwasaki