Patents by Inventor Hideaki Murata
Hideaki Murata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145517Abstract: Provided is a solid-state image capturing element including a semiconductor substrate and first and second photoelectric conversion parts configured to convert light into electric charge. The first and the second photoelectric conversion parts each have a laminated structure including an upper electrode, a lower electrode, a photoelectric conversion film sandwiched between the upper electrode and the lower electrode, and an accumulation electrode facing the upper electrode through the photoelectric conversion film and an insulating film.Type: ApplicationFiled: December 19, 2023Publication date: May 2, 2024Applicants: SONY GROUP CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Kenichi MURATA, Masahiro JOEI, Fumihiko KOGA, Iwao YAGI, Shintarou HIRATA, Hideaki TOGASHI, Yosuke SAITO, Shingo TAKAHASHI
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Patent number: 11974444Abstract: There is provided a solid-state image sensor, a solid-state imaging device, an electronic apparatus, and a method of manufacturing a solid-state image sensor capable of improving characteristics. There is provided a solid-state image sensor including a stacked structure that includes a semiconductor substrate, a first photoelectric converter provided above the semiconductor substrate and converting light into charges, and a second photoelectric converter provided above the first photoelectric converter and converting light into charges, where the first photoelectric converter and the second photoelectric converter include a photoelectric conversion stacked structure in which a common electrode, a photoelectric conversion film, and a readout electrode are stacked so that the first photoelectric converter and the second photoelectric converter are in a line-symmetrical relationship with each other with a vertical plane perpendicular to a stacking direction of the stacked structure as an axis of symmetry.Type: GrantFiled: June 11, 2019Date of Patent: April 30, 2024Assignees: SONY CORPORATION, SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Hideaki Togashi, Iwao Yagi, Masahiro Joei, Fumihiko Koga, Kenichi Murata, Shintarou Hirata, Yosuke Saito, Akira Furukawa
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Patent number: 10784724Abstract: A wireless power supply device that wirelessly supplies power from a stator side to a plurality of power-receiving antennas disposed on a rotor rotated about an axis (O) at intervals in a circumferential direction includes: an oscillator (90) that oscillates a high-frequency signal; and an annular power transmitter (71) that has a leaky waveguide (80) in which a plurality of radiating portions (83) that radiate the high-frequency signal as a radio wave are arranged in the circumferential direction and extend in a circular arc shape in the circumferential direction.Type: GrantFiled: May 16, 2017Date of Patent: September 22, 2020Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Naoki Oyama, Hideaki Murata, Jun Yasui, Seiki Kato, Keiichi Morishita
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Publication number: 20190181689Abstract: A wireless power supply device that wirelessly supplies power from a stator side to a plurality of power-receiving antennas disposed on a rotor rotated about an axis (0) at intervals in a circumferential direction includes: an oscillator (90) that oscillates a high-frequency signal; and an annular power transmitter (71) that has a leaky waveguide (80) in which a plurality of radiating portions (83) that radiate the high-frequency signal as a radio wave are arranged in the circumferential direction and extend in a circular arc shape in the circumferential direction.Type: ApplicationFiled: May 16, 2017Publication date: June 13, 2019Inventors: Naoki OYAMA, Hideaki MURATA, Jun YASUI, Seiki KATO, Keiichi MORISHITA
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Patent number: 10228253Abstract: In a location detecting system, an on-vehicle device is provided at each vehicle a location detecting unit detecting a location of the vehicle, a communication unit, and a CPU unit controlling the location detecting unit and the communication unit. Each of the on-vehicle devices includes a GPS trajectory information processing unit acquiring GPS trajectory information of each of the vehicles, the communication unit broadcasts requests for the GPS trajectory information, the communication units of other vehicles transmit the held GPS trajectory information to the communication unit of one vehicle when a distance to the vehicle is less than a predetermined value, the GPS trajectory information processing unit passes the GPS trajectory information from the other vehicles to the location detecting unit, and the location detecting unit of the vehicle outputs the location information of the vehicle based on the GPS trajectory information.Type: GrantFiled: February 12, 2015Date of Patent: March 12, 2019Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.Inventors: Hideaki Murata, Kazuumi Kondo, Tetsuya Adachi, Ryota Hiura
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Patent number: 10094671Abstract: A vehicle position measurement method includes a process of determining whether or not position information of an own vehicle is able to be acquired with predetermined quality from the outside, a process of acquiring position information of a nearby vehicle present in an area in which the own vehicle is capable of acquiring information when the position information is determined not to be able to be acquired with the predetermined quality, and a process of replacing the position information of the own vehicle with the acquired position information of the nearby vehicle.Type: GrantFiled: January 27, 2015Date of Patent: October 9, 2018Assignee: MITSUBISHI HEAVY INDUSTRIES MACHINERY SYSTEMS, LTD.Inventors: Kazuumi Kondo, Hideaki Murata, Tetsuya Adachi
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Patent number: 9660705Abstract: An on-board unit includes a first antenna and a second antenna, a traffic data service communicating section corresponding to a traffic data service; a billing service communicating section corresponding to a billing service, a switch which switches a connection relation between each of the first antenna and the second antenna and the traffic data service communicating section and the billing service communicating section, a control section which controls the switch. When the operation mode is switched from the traffic data service mode to the billing service mode, the on-board unit is set to a switching communication mode in which one of the first antenna and the second antenna is connected with the traffic data service communicating section and the other is connected with the billing service communicating section.Type: GrantFiled: December 16, 2013Date of Patent: May 23, 2017Assignee: MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, LTD.Inventors: Takeshi Nagata, Yoshifumi Hayakawa, Hisaji Takeuchi, Jun Yasui, Hideaki Murata
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Patent number: 9560213Abstract: A communication system includes an on-board unit adapted to a vehicle-vehicle communication and roadside equipment 10 performing a roadside-vehicle communication. In communications in service channels of the vehicle-vehicle communication, one reception-only service channel in which the on-board unit only performs a reception operation is provided for a plurality of the service channels and communications in the reception-only service channel is performed at the same frequency as that of the control channels of the roadside-vehicle communication. When the vehicle-vehicle communication is performed, the on-board unit performs switching to the roadside-vehicle communication in response to detection of reception in the reception-only service channel of a radio signal transmitted from the roadside equipment 10 in a control channel of the roadside-vehicle communication.Type: GrantFiled: December 26, 2013Date of Patent: January 31, 2017Assignee: MITSUBISHI HEAVY INDUSTRIES MECHATRONICS SYSTEMS, LTD.Inventors: Takeshi Nagata, Yoshifumi Hayakawa, Hisaji Takeuchi, Jun Yasui, Hideaki Murata
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Publication number: 20160370189Abstract: In a location detecting system, an on-vehicle device is provided at each vehicle a location detecting unit detecting a location of the vehicle, a communication unit, and a CPU unit controlling the location detecting unit and the communication unit. Each of the on-vehicle devices includes a GPS trajectory information processing unit acquiring GPS trajectory information of each of the vehicles, the communication unit broadcasts requests for the GPS trajectory information, the communication units of other vehicles transmit the held GPS trajectory information to the communication unit of one vehicle when a distance to the vehicle is less than a predetermined value, the GPS trajectory information processing unit passes the GPS trajectory information from the other vehicles to the location detecting unit, and the location detecting unit of the vehicle outputs the location information of the vehicle based on the GPS trajectory information.Type: ApplicationFiled: February 12, 2015Publication date: December 22, 2016Inventors: Hideaki MURATA, Kazuumi KONDO, Tetsuya ADACHI, Ryota HIURA
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Publication number: 20160341557Abstract: A vehicle position measurement method includes a process of determining whether or not position information of an own vehicle is able to be acquired with predetermined quality from the outside, a process of acquiring position information of a nearby vehicle present in an area in which the own vehicle is capable of acquiring information when the position information is determined not to be able to be acquired with the predetermined quality, and a process of replacing the position information of the own vehicle with the acquired position information of the nearby vehicle.Type: ApplicationFiled: January 27, 2015Publication date: November 24, 2016Inventors: Kazuumi KONDO, Hideaki MURATA, Tetsuya ADACHI
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Publication number: 20150358481Abstract: A communication system includes an on-board unit adapted to a vehicle-vehicle communication and roadside equipment 10 performing a roadside-vehicle communication. In communications in service channels of the vehicle-vehicle communication, one reception-only service channel in which the on-board unit only performs a reception operation is provided for a plurality of the service channels and communications in the reception-only service channel is performed at the same frequency as that of the control channels of the roadside-vehicle communication. When the vehicle-vehicle communication is performed, the on-board unit performs switching to the roadside-vehicle communication in response to detection of reception in the reception-only service channel of a radio signal transmitted from the roadside equipment 10 in a control channel of the roadside-vehicle communication.Type: ApplicationFiled: December 26, 2013Publication date: December 10, 2015Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Takeshi NAGATA, Yoshifumi HAYAKAWA, Hisaji TAKEUCHI, Jun YASUI, Hideaki MURATA
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Publication number: 20150326283Abstract: An on-board unit includes a first antenna and a second antenna, a traffic data service communicating section corresponding to a traffic data service; a billing service communicating section corresponding to a billing service, a switch which switches a connection relation between each of the first antenna and the second antenna and the traffic data service communicating section and the billing service communicating section, a control section which controls the switch. When the operation mode is switched from the traffic data service mode to the billing service mode, the on-board unit is set to a switching communication mode in which one of the first antenna and the second antenna is connected with the traffic data service communicating section and the other is connected with the billing service communicating section.Type: ApplicationFiled: December 16, 2013Publication date: November 12, 2015Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Takeshi NAGATA, Yoshifumi HAYAKAWA, Hisaji TAKEUCHI, Jun YASUI, Hideaki MURATA
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Patent number: 8786867Abstract: An inspection device and an inspection method for boiler furnace water wall tubes. The inspection device includes a scanner including columns placed upright and fixed by magnets onto the surfaces of multiple water wall tubes extending in the up-down direction on the inner wall surfaces of the boiler furnace, a support frame fixed to the columns to support a displacement sensor producing laser light to be irradiated onto the surface of a water wall tube, and a moving mechanism for moving the displacement sensor in the axial direction of the water wall tube relative to the support frame. A signal processing unit calculates the amount of reduced wall thickness of the water wall tube from a difference between the cross-sectional surface shape of the water wall tube based on a signal from the displacement sensor and a reference shape without reduction in wall thickness.Type: GrantFiled: July 9, 2009Date of Patent: July 22, 2014Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Hirotoshi Matsumoto, Keiji Ida, Hideaki Murata, Kai Zhang
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Publication number: 20110279828Abstract: There are provided an inspection device and an inspection method for boiler furnace water wall tubes, which can inspect reduced wall thickness conditions of multiple water wall tubes, extending in an up-down direction along inner wall surfaces of a boiler furnace and arranged adjacent to each other, accurately and efficiently over a wide range based on surface shapes of the water wall tubes measured by a laser displacement sensor. A scanner 14 including columns 20 placed upright and fixed by magnets onto the surfaces of multiple water wall tubes 4 extending the up-down direction on the inner wall surfaces of the boiler furnace, a support frame 28 fixed to the columns 20 to support a displacement sensor 12 producing laser light to be irradiated onto the surface of a water wall tube 4, and a moving mechanism 31 for moving the displacement sensor 12 in the axial direction of the water wall tube 4 relative to the support frame 28.Type: ApplicationFiled: July 9, 2009Publication date: November 17, 2011Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Hirotoshi Matsumoto, Keiji Ida, Hideaki Murata, Kai Zhang
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Patent number: 6900526Abstract: A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.Type: GrantFiled: May 22, 2003Date of Patent: May 31, 2005Assignee: The Furukawa Electric Co., Ltd.Inventors: Takahiro Okada, Hideaki Murata
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Patent number: 6777052Abstract: The present invention provides a plastic container containing albumin solution and a packaged plastic container containing an albumin solution. The plastic container containing an albumin solution having an albumin concentration of 1 to 500 mg/ml, has at least one inlet/outlet for a liquid, and has a water vapor permeability of 1.5 g/m2/day·1013.25 hPa or less when the vapor permeability is measured at a pressure of 1013.25 hPa per surface area of 1 m2 for 24 hours at a temperature of 25° C. and at a relative humidity of 60%. The plastic container containing an albumin solution can be packaged with an outer packaging material to provide the packaged plastic container.Type: GrantFiled: March 27, 2002Date of Patent: August 17, 2004Assignee: Nipro CorporationInventors: Toshiya Kai, Hideaki Murata, Makoto Sato
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Publication number: 20030209795Abstract: A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.Type: ApplicationFiled: May 22, 2003Publication date: November 13, 2003Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Takahiro Okada, Hideaki Murata
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Patent number: 6597060Abstract: A semiconductor device package is comprised of a metal base for receiving a semiconductor device, a metal frame joined at its lower face to the metal base, a seal ring joined at its lower face to an upper face of the metal frame, and a metal lid joined to an upper face of the seal ring. The upper face of the seal ring is formed, at its at least two sides facing each other, into a concavely warped shape as viewed in vertical cross section, and the maximum warpage of the upper face of the seal ring is not more than 0.2% of the length of the side of the upper face.Type: GrantFiled: February 28, 2001Date of Patent: July 22, 2003Assignee: The Furukawa Electric Co., Ltd.Inventors: Takahiro Okada, Hideaki Murata
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Publication number: 20020192411Abstract: The present invention provides a plastic container containing albumin solution and a packaged plastic container containing an albumin solution. The plastic container containing an albumin solution having an albumin concentration of 1 to 500 mg/ml, has at least one inlet/outlet for a liquid, and has a water vapor permeability of 1.5 g/m2/day·1013.25 hPa or less when the vapor permeability is measured at a pressure of 1013.25 hPa per surface area of 1 m2 for 24 hours at a temperature of 25° C. and at a relative humidity of 60%. The plastic container containing an albumin solution can be packaged with an outer packaging material to provide the packaged plastic container.Type: ApplicationFiled: March 27, 2002Publication date: December 19, 2002Inventors: Toshiya Kai, Hideaki Murata, Makoto Sato
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Patent number: 6440778Abstract: An optical semiconductor element package including a housing, electric signal input and output wiring boards, and external leads. The housing has a metal frame and a metal bottom plate, for storing optical semiconductor elements. The electric signal input and output wiring boards are arranged in the housing at positions so that the optical semiconductor elements are not existent right above and right below the boards. The external leads are drawn to the outside through the side wall of the metal frame. The wiring boards are connected to the external leads and to the optical semiconductor elements by bonding wires. The input and output of an electric signal between the outside and the optical semiconductor elements are carried out through the bonding wires, the wiring boards and the external leads.Type: GrantFiled: July 11, 2000Date of Patent: August 27, 2002Assignee: The Furukawa Electric Co., Ltd.Inventors: Takahiro Okada, Hideaki Murata, Masato Sakata