Patents by Inventor Hideaki Nakakubo
Hideaki Nakakubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20030025571Abstract: The present invention comprises baluns 2a, 2b which convert balanced line signals and unbalanced line signals mutually, and filters 3a, 3b which are electrically connected to the baluns 2a, 2b and pass or attenuate the predetermined frequency bands. Electrode layers 15a-22a, 25a, 41, 42, 43 which compose the electrode patterns of the baluns 2a, 2b and the filters 3a, 3b, and the dielectric layers 30-39 are integrally stacked.Type: ApplicationFiled: August 2, 2002Publication date: February 6, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Tomoya Maekawa, Hiroshi Shigemura, Hideaki Nakakubo, Emiko Kawahara, Toru Yamada
-
Publication number: 20030020569Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: ApplicationFiled: September 24, 2002Publication date: January 30, 2003Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
-
Patent number: 6510607Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: June 27, 2001Date of Patent: January 28, 2003Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
-
Publication number: 20030008693Abstract: A multiband high-frequency switch that is mainly used for mobile phones, comprising a strip line formed of the series connection of first and second strip lines. A second transmitting port is connected to the connection point of the strip lines connected in series via a third diode, and a second control port is connected between the second transmitting port and the third diode. In addition, first and second receiving ports are connected to the receiving-side port of the high-frequency switch via a diplexer.Type: ApplicationFiled: May 16, 2002Publication date: January 9, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Masaharu Tanaka, Hideaki Nakakubo, Yasushi Nagata
-
Publication number: 20020158705Abstract: A radio frequency (RF) switch which is used in an RF unit of a communication apparatus and has a less insertion loss during a transmission. A strip line disposed in the RF switch is formed by combining first and second strip lines having different values of the characteristic impedance from each other.Type: ApplicationFiled: January 23, 2002Publication date: October 31, 2002Inventors: Hideaki Nakakubo, Tomoyuki Iwasaki
-
Publication number: 20020027482Abstract: The present matching circuit chip has an integrated shape comprising a first transmission line, a second transmission line and a third transmission line, wherein one end of the first transmission line, one end of the second transmission line and one end of the third transmission line are connected to one another, a first filter connection terminal is connected to the other end of the first transmission line, an antenna terminal is connected to the other end of the second transmission line, and a second filter connection terminal is connected to the other end of the third transmission line, whereby the second transmission line converts the characteristic impedances of the first and third transmission lines so that the impedance matching between the antenna terminal and the first filter connection terminal can be attained, and so that the impedance matching between the antenna terminal and the second filter connection terminal can be attained.Type: ApplicationFiled: November 9, 2001Publication date: March 7, 2002Inventors: Hiroshi Kushitani, Toru Yamada, Naoki Yuda, Toshio Ishizaki, Hideaki Nakakubo, Makoto Fujikawa
-
Patent number: 6346866Abstract: By using a method for manufacturing a dielectric laminated. device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: November 15, 1999Date of Patent: February 12, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
-
Publication number: 20020000900Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: ApplicationFiled: November 15, 1999Publication date: January 3, 2002Inventors: HIDEAKI NAKAKUBO, TOSHIO ISHIZAKI, TORU YAMADA, HIROSHI KAGATA, TATSUYA INOUE, SHOICHI KITAZAWA
-
Publication number: 20010050599Abstract: A dielectric filter, hasType: ApplicationFiled: December 27, 2000Publication date: December 13, 2001Inventors: Tomoya Maekawa, Hiroshi Kushitani, Hiroshi Shigemura, Toru Yamada, Toshio Ishizaki, Hideaki Nakakubo
-
Publication number: 20010048350Abstract: The present matching circuit chip has an integrated shape comprising a first transmission line, a second transmission line and a third transmission line, wherein one end of the first transmission line, one end of the second transmission line and one end of the third transmission line are connected to one another, a first filter connection terminal is connected to the other end of the first transmission line, an antenna terminal is connected to the other end of the second transmission line, and a second filter connection terminal is connected to the other end of the third transmission line, whereby the second transmission line converts the characteristic impedances of the first and third transmission lines so that the impedance matching between the antenna terminal and the first filter connection terminal can be attained, and so that the impedance matching between the antenna terminal and the second filter connection terminal can be attained.Type: ApplicationFiled: August 1, 2001Publication date: December 6, 2001Inventors: Hiroshi Kushitani, Toru Yamada, Naoki Yuda, Toshio Ishizaki, Hideaki Nakakubo, Makoto Fujikawa
-
Patent number: 6326863Abstract: The present matching circuit chip has an integrated shape comprising a first transmission line, a second transmission line and a third transmission line, wherein one end of the first transmission line, one end of the second transmission line and one end of the third transmission line are connected to one another, a first filter connection terminal is connected to the other end of the first transmission line, an antenna terminal is connected to the other end of the second transmission line, and a second filter connection terminal is connected to the other end of the third transmission line, whereby the second transmission line converts the characteristic impedances of the first and third transmission lines so that the impedance matching between the antenna terminal and the first filter connection terminal can be attained, and so that the impedance matching between the antenna terminal and the second filter connection terminal can be attained.Type: GrantFiled: December 18, 1998Date of Patent: December 4, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroshi Kushitani, Toru Yamada, Naoki Yuda, Toshio Ishizaki, Hideaki Nakakubo, Makoto Fujikawa
-
Patent number: 6310525Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: July 19, 1999Date of Patent: October 30, 2001Assignee: Matsushita Electric Industrial Co. Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
-
Patent number: 6304156Abstract: A dielectric antenna duplexer used in a high frequency radio device such as a portable telephone, and a dielectric filter for forming the duplexer of the SIR (stepped impedance resonator) composed by cascade connection of first transmission lines having one end grounded and second transmission lines having one end open and lower in characteristic impedance than in the first transmission lines, first transmission lines and second transmission lines are individually coupled in electromagnetic field, thereby forming an antenna duplexer and a dielectric filter of small insertion loss, high bandwidth selectivity, excellent band pass characteristic, and low cost.Type: GrantFiled: August 24, 1999Date of Patent: October 16, 2001Inventors: Toshio Ishizaki, Atsushi Sasaki, Yuki Satoh, Hiroshi Kushitani, Hideaki Nakakubo, Toshiaki Nakamura, Kimio Aizawa, Takashi Fujino
-
Patent number: 6222431Abstract: The present invention relates to a balanced dielectric filter used in high-frequency circuits, such as those used for radio apparatuses, and provides a balanced dielectric filter having balanced input/output terminals. Namely, the balanced dielectric filter comprises two resonators, each comprising plural strip-line resonating elements, disposed in parallel and mutually coupled electro-magnetically, and input and output terminals coupled to each resonator so as to function as a pair of balanced input terminals and a pair of balanced output terminals, wherein the two resonators are located in a ceramic dielectric to face each other and to be mirror images of each other. The resonating element is a quarter-wavelength resonating element, the end of the strip line thereof is grounded. The strip lines and coupling electrodes are arranged among ceramic layers, whereby the filter is integrated into a ceramic-multilayered structure.Type: GrantFiled: February 23, 1999Date of Patent: April 24, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Ishizaki, Toru Yamada, Hideaki Nakakubo, Shoichi Kitazawa
-
Patent number: 6140891Abstract: A dielectric laminated filter has a first dielectric laminated block including a first strip line electrode and a second dielectric laminated block including a second strip line electrode and a coupling element, wherein the first and the second dielectric laminated blocks are laminated via a first shield electrode and wherein the first and the second strip lines are connected via a third strip line. This configuration allows the unwanted electromagnetic coupling between a resonator and the coupling element to be neglected, and uses the third strip line electrode to form the first and the second strip line electrodes so that they extend across different layers, thereby enabling the size of the resonator to be reduced. In addition, since the third strip line electrode serves to adjust the filter characteristics, a small high-performance dielectric laminated filter that can be designed easily can be provided.Type: GrantFiled: October 20, 1997Date of Patent: October 31, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Shoichi Kitazawa, Hiroshi Kushitani
-
Patent number: 6020798Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.Type: GrantFiled: July 15, 1997Date of Patent: February 1, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Nakakubo, Toshio Ishizaki, Toru Yamada, Hiroshi Kagata, Tatsuya Inoue, Shoichi Kitazawa
-
Patent number: 6020799Abstract: A dielectric antenna duplexer used in a high frequency radio device such as a portable telephone, and a dielectric filter for forming the duplexer of the SIR (stepped impedance resonator) composed by cascade connection of first transmission lines having one end grounded and second transmission lines having one end open and lower in characteristic impedance than in the first transmission lines, first transmission lines and second transmission lines are individually coupled in electromagnetic field, thereby forming an antenna duplexer and a dielectric filter of small insertion loss, high bandwidth selectivity, excellent band pass characteristic, and low cost.Type: GrantFiled: November 7, 1997Date of Patent: February 1, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Ishizaki, Atsushi Sasaki, Yuki Satoh, Hiroshi Kushitani, Hideaki Nakakubo, Toshiaki Nakamura, Kimio Aizawa, Takashi Fujino
-
Patent number: 5719539Abstract: A dielectric antenna duplexer used in a high frequency radio device such as a portable telephone, and a dielectric filter for forming the duplexer of the SIR (stepped impedance resonator) composed by cascade connection of first transmission lines having one end grounded and second transmission lines having one end open and lower in characteristic impedance than in the first transmission lines, first transmission lines and second transmission lines are individually coupled in electromagnetic field, thereby forming an antenna duplexer and a dielectric filter of small insertion loss, high bandwidth selectivity, excellent band pass characteristic, and low cost.Type: GrantFiled: August 23, 1994Date of Patent: February 17, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Ishizaki, Atsushi Sasaki, Yuki Satoh, Hiroshi Kushitani, Hideaki Nakakubo, Toshiaki Nakamura, Kimio Aizawa, Takashi Fujino
-
Patent number: 5654681Abstract: In a laminated dielectric resonator, twomo strip line is formed and resonant frequency is lowered. Accordingly, the length of the resonator is reduced, and the length of the strip line becomes shorter than one fourth of the wavelength with the lowered resonant frequency, which leads to further reduction of the length of the resonator. By lowering the resonant frequency, dielectric material with less relative permittivity can be used, with a result of resonator with high unloaded Q and excellent temperature characteristic. Further, at least one coupling electrode is formed as external or internal electrode to compose a capacitor together with a second strip line, and a laminated dielectric resonator is connected to an external circuit via the coupling electrode. A dielectric filter such as band pass filter, band elimination filter is so composed that the dielectric resonators are cascade-connected to one another.Type: GrantFiled: September 22, 1995Date of Patent: August 5, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Ishizaki, Hideaki Nakakubo
-
Patent number: 5644275Abstract: In a laminated dielectric resonator, two-fold strip line is formed and resonant frequency is lowered. Accordingly, the length of the resonator is reduced, and the length of the strip line becomes shorter than one fourth of the wavelength with the lowered resonant frequency, which leads to further reduction of the length of the resonator. By lowering the resonant frequency, dielectric material with less relative permittivity can be used, with a result of resonator with high unloaded Q and excellent temperature characteristic. Further, at least one coupling electrode is formed as external or internal electrode to compose a capacitor together with a second strip line, and a laminated dielectric resonator is connected to an external circuit via the coupling electrode. A dielectric filter such as band pass filter, band elimination filter is so composed that the dielectric resonators are cascade-connected to one another.Type: GrantFiled: September 22, 1995Date of Patent: July 1, 1997Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Toshio Ishizaki, Hideaki Nakakubo