Patents by Inventor Hideaki Ohkubo

Hideaki Ohkubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955353
    Abstract: A temperature adjustment device includes a flow path plate that includes a flow path groove, a heat transfer plate that faces the flow path groove, and a thermoelectric module plate that is connected to the heat transfer plate. A surface roughness of the flow path plate is 0.20 ?m or more and 0.25 ?m or less.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: April 9, 2024
    Assignee: KELK Ltd.
    Inventors: Atsushi Kobayashi, Hideaki Ohkubo
  • Patent number: 11935767
    Abstract: A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; a first coupling member that couples the top plate and the base plate via the thermoelectric module plate and the heat exchange plate and is fixed to each of the top plate and the base plate; and a second coupling member that couples the top plate and the base plate via the thermoelectric module plate and the heat exchange plate, is fixed to the top plate, and is movable relative to the base plate.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: March 19, 2024
    Assignee: Kelk Ltd.
    Inventors: Atsushi Kobayashi, Masato Horikoshi, Hideaki Ohkubo, Wataru Kiyosawa
  • Publication number: 20230384808
    Abstract: A temperature control system includes: a circulation channel which includes a temperature adjustment target and through which a circulation fluid that adjusts a temperature of the temperature adjustment target flows; a temperature adjuster that is arranged in the circulation channel and that adjusts a temperature of the circulation fluid supplied to the temperature adjustment target; a first temperature adjustment unit that is connected to the circulation channel via a first supply channel and that delivers a first fluid having a first temperature; a second temperature adjustment unit that is connected to the circulation channel via a second supply channel and that delivers a second fluid having a second temperature higher than the first temperature; a first valve arranged in the first supply channel; and a second valve arranged in the second supply channel.
    Type: Application
    Filed: October 13, 2021
    Publication date: November 30, 2023
    Inventors: Kazuhiro MIMURA, Atsushi KOBAYASHI, Hideaki OHKUBO
  • Patent number: 11797033
    Abstract: To control the temperature of a fluid with high accuracy, a temperature control system is equipped with: a circulation channel including a temperature control target and a tank containing a fluid adjusted to a specified temperature range including a target temperature of the temperature control target; and a first temperature controller that is arranged between the tank and the temperature control target in the circulation channel and that adjusts the temperature of the fluid to be supplied to the temperature control target.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: October 24, 2023
    Assignee: KELK Ltd.
    Inventors: Atsushi Kobayashi, Hideaki Ohkubo, Kazuhiro Mimura, Toru Suzuki
  • Patent number: 11309474
    Abstract: A thermoelectric module of the invention includes: first and second thermoelectric elements; a first electrode having a plate-shaped body whose first surface is bonded to a first end surface of the first thermoelectric element and a first end surface of the second thermoelectric element; a second electrode bonded to a second end surface of the first thermoelectric element; and a third electrode bonded to a second end surface of the thermoelectric element. The first electrode includes: a first cutout formed at a first side in a width direction; and a second cutout formed at a second side in the width direction. In the width direction, at least one of the first cutout or the second cutout is present in a section between the first side and the second side of the first electrode.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: April 19, 2022
    Assignee: KELK Ltd.
    Inventors: Shunsuke Kushibiki, Masato Horikoshi, Hideaki Ohkubo
  • Publication number: 20220011793
    Abstract: To control the temperature of a fluid with high accuracy, a temperature control system is equipped with: a circulation channel including a temperature control target and a tank containing a fluid adjusted to a specified temperature range including a target temperature of the temperature control target; and a first temperature controller that is arranged between the tank and the temperature control target in the circulation channel and that adjusts the temperature of the fluid to be supplied to the temperature control target.
    Type: Application
    Filed: December 19, 2019
    Publication date: January 13, 2022
    Inventors: Atsushi KOBAYASHI, Hideaki OHKUBO, Kazuhiro MIMURA, Toru SUZUKI
  • Publication number: 20220005727
    Abstract: A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; and a sealing member that comes into contact with each of the top plate and the base plate.
    Type: Application
    Filed: October 30, 2019
    Publication date: January 6, 2022
    Inventors: Atsushi KOBAYASHI, Masato HORIKOSHI, Hideaki OHKUBO, Wataru KIYOSAWA
  • Publication number: 20210398799
    Abstract: A temperature adjustment device includes: a pair of flow path plates, each of the pair of flow path plates including a flow path groove provided on a front surface of the each of the pair of flow path plates and at least a part of the front surface; a spacer member that includes a support surface projecting from the front surface, and connects the pair of flow path plates such that a back surface of one of the pair of flow path plates and a back surface of the other of the pair of flow path plate face each other; and a heat transfer plate that faces the flow path groove, and is supported by the support surface.
    Type: Application
    Filed: October 30, 2019
    Publication date: December 23, 2021
    Inventors: Atsushi KOBAYASHI, Hideaki OHKUBO
  • Publication number: 20210391192
    Abstract: A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; a first coupling member that couples the top plate and the base plate via the thermoelectric module plate and the heat exchange plate and is fixed to each of the top plate and the base plate; and a second coupling member that couples the top plate and the base plate via the thermoelectric module plate and the heat exchange plate, is fixed to the top plate, and is movable relative to the base plate.
    Type: Application
    Filed: October 30, 2019
    Publication date: December 16, 2021
    Inventors: Atsushi KOBAYASHI, Masato HORIKOSHI, Hideaki OHKUBO, Wataru KIYOSAWA
  • Publication number: 20210358776
    Abstract: A temperature adjustment device includes a flow path plate that includes a flow path groove, a heat transfer plate that faces the flow path groove, and a thermoelectric module plate that is connected to the heat transfer plate. A surface roughness of the flow path plate is 0.20 ?m or more and 0.25 ?m or less.
    Type: Application
    Filed: October 30, 2019
    Publication date: November 18, 2021
    Inventors: Atsushi KOBAYASHI, Hideaki OHKUBO
  • Publication number: 20200168778
    Abstract: A thermoelectric module of the invention includes: first and second thermoelectric elements; a first electrode having a plate-shaped body whose first surface is bonded to a first end surface of the first thermoelectric element and a first end surface of the second thermoelectric element; a second electrode bonded to a second end surface of the first thermoelectric element; and a third electrode bonded to a second end surface of the thermoelectric element. The first electrode includes: a first cutout formed at a first side in a width direction; and a second cutout formed at a second side in the width direction. In the width direction, at least one of the first cutout or the second cutout is present in a section between the first side and the second side of the first electrode.
    Type: Application
    Filed: May 9, 2018
    Publication date: May 28, 2020
    Inventors: Shunsuke KUSHIBIKI, Masato HORIKOSHI, Hideaki OHKUBO
  • Publication number: 20100295201
    Abstract: The present invention is a process for producing a thermosetting resin foamed plate, comprising a step of discharging a resin composition obtained by mixing at least a thermosetting resin, a foaming agent and a curing agent onto a surface material and foaming and curing the resin composition, wherein the resin composition is supplied into a die from a plurality of inlets of the die by a plurality of branched channels to reside, and the resin composition is discharged from a die lip outlet onto the surface material into a plate form.
    Type: Application
    Filed: November 14, 2008
    Publication date: November 25, 2010
    Applicant: Asahi Kasei Construction Materials Corporation
    Inventors: Hisashi Mihori, Hideaki Ohkubo
  • Patent number: 7639107
    Abstract: It is an object to provide is an overcurrent relay having less number of parts and a smaller space to implement an automatic reset function and a manual reset function. A contact point mechanism 110 includes a movable contactor support 10 for supporting a movable contactor composing a part of the usually-closed contact point while being maintained in the movable iron core 5, and a reset bar 14 arranged in a manner that is switchable between an automatic reset setting and a manual reset setting. The reset bar 14 does not engage with the movable contactor support 10 in an operation range of the movable contactor support 10 in the automatic reset setting.
    Type: Grant
    Filed: April 20, 2005
    Date of Patent: December 29, 2009
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideaki Ohkubo, Tomokazu Sakamoto
  • Publication number: 20080272866
    Abstract: It is an object to provide is an overcurrent relay having less number of parts and a smaller space to implement an automatic reset function and a manual reset function. A contact point mechanism 110 includes a movable contactor support 10 for supporting a movable contactor composing a part of the usually-closed contact point while being maintained in the movable iron core 5, and a reset bar 14 arranged in a manner that is switchable between an automatic reset setting and a manual reset setting. The reset bar 14 does not engage with the movable contactor support 10 in an operation range of the movable contactor support 10 in the automatic reset setting.
    Type: Application
    Filed: April 20, 2005
    Publication date: November 6, 2008
    Inventors: Hideaki Ohkubo, Tomokazu Sakamoto
  • Publication number: 20040085702
    Abstract: A thermal overcurrent relay includes a bimetal curved according to a primary circuit current, an interlocking plate for transmitting a displacement of the bimetal, an adjusting lever supported by a shaft protruding from a case, freely rotating in a predetermined range according to a range of the primary circuit current capable of being used, an operation lever supported by the adjusting lever, rotated by a force given from the interlocking plate, acting on an inverting mechanism section to invert an opening and closing state of a contact, and an adjusting knob for changing a distance of the displacement of the interlocking plate necessary for the start of inversion, wherein the support shaft of the adjusting lever is a substantially sectorial protrusion, the sectional profile of which has a central angle open to an inner wall of the case existing in the proceeding direction of the interlocking plate, and the adjusting lever has a substantially sectorial shaft hole, which is inserted into the support shaft, ha
    Type: Application
    Filed: September 26, 2003
    Publication date: May 6, 2004
    Inventor: Hideaki Ohkubo
  • Patent number: 6666031
    Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.
    Type: Grant
    Filed: March 5, 2003
    Date of Patent: December 23, 2003
    Assignee: Komatsu, Ltd.
    Inventors: Hideaki Ohkubo, Kazuhiko Kubota
  • Publication number: 20030172657
    Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.
    Type: Application
    Filed: March 5, 2003
    Publication date: September 18, 2003
    Inventors: Hideaki Ohkubo, Kazuhiko Kubota
  • Patent number: 6477844
    Abstract: A sealing structure of the thermoelectric conversion device, which has high sealing capability and is easy to manufacture, is provided. A thermoelectric conversion circuit utilizing Peltier effect is interposed between two metal heat exchanger plates. The O-ring interposed between the outer edge portions of the heat exchanger plates seals the gap formed between the outer edge portions of the heat exchanger plates along the whole periphery. The connector for connecting the thermoelectric conversion circuit to the external power supply is inserted into the through hole formed on the heat exchanger plate. The O-ring fitted on the connector seals the gap between the connector and the through hole spontaneously, when the connector is inserted into the through hole.
    Type: Grant
    Filed: November 6, 2001
    Date of Patent: November 12, 2002
    Assignee: Komatsu Ltd.
    Inventors: Hideaki Ohkubo, Masanobu Seki, Mineo Tokuda
  • Publication number: 20020062649
    Abstract: A sealing structure of the thermoelectric conversion device, which has high sealing capability and is easy to manufacture, is provided. A thermoelectric conversion circuit utilizing Peltier effect is interposed between two metal heat exchanger plates. The O-ring interposed between the outer edge portions of the heat exchanger plates seals the gap formed between the outer edge portions of the heat exchanger plates along the whole periphery. The connector for connecting the thermoelectric conversion circuit to the external power supply is inserted into the through hole formed on the heat exchanger plate. The O-ring fitted on the connector seals the gap between the connector and the through hole spontaneously, when the connector is inserted into the through hole.
    Type: Application
    Filed: November 6, 2001
    Publication date: May 30, 2002
    Inventors: Hideaki Ohkubo, Masanobu Seki, Mineo Tokuda
  • Patent number: 6374616
    Abstract: A heat exchanger for executing heat exchange between heat exchange between heat exchange bodies (6) on a heat radiation side and heat exchange bodies (3) on a heat absorption side, having low thermal resistance and high performance of heat conduction includes heat exchange bodies 6 on a heat radiation side and heat exchange bodies 3 on a heat absorption side, each being disposed hierarchically, thermoelectric conversion element modules 2 interposed between the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side through an insulating coat 16, and having a plurality of thermoelectric conversion elements 12, 13, wherein the insulating coat 16 is formed integrally on a surface of at least one of the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side, and a metal coat 17 keeping electric contact with a surface of the thermoelectric conversion elements 12, 13 on either the heat radiation side or the heat absor
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: April 23, 2002
    Assignees: Komatsu Ltd., Komatsu Electronics Inc.
    Inventors: Hideaki Ohkubo, Norio Takahashi, Tetsuo Ohnishi