Patents by Inventor Hideaki Ohkura

Hideaki Ohkura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7875807
    Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.
    Type: Grant
    Filed: February 12, 2007
    Date of Patent: January 25, 2011
    Assignee: Ricoh Company, Ltd.
    Inventors: Takeshi Sano, Hirofumi Kobayashi, Hideaki Ohkura
  • Patent number: 7748114
    Abstract: The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: July 6, 2010
    Assignee: Ricoh Company, Ltd.
    Inventors: Takeshi Sano, Hideaki Ohkura, Hirofumi Kobayashi, Kunio Ikeda
  • Patent number: 7364769
    Abstract: A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.
    Type: Grant
    Filed: May 13, 2004
    Date of Patent: April 29, 2008
    Assignee: Ricoh Company, Ltd.
    Inventors: Yoshihiro Yoshida, Takeshi Sano, Hideaki Ohkura, Hirofumi Kobayashi
  • Publication number: 20070132098
    Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.
    Type: Application
    Filed: February 12, 2007
    Publication date: June 14, 2007
    Inventors: Takeshi Sano, Hirofumi Kobayashi, Hideaki Ohkura
  • Patent number: 7157800
    Abstract: A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: January 2, 2007
    Assignee: Ricoh Company, Ltd.
    Inventors: Takeshi Sano, Yoshihiro Yoshida, Hideaki Ohkura, Hirofumi Kobayashi
  • Publication number: 20060250452
    Abstract: The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.
    Type: Application
    Filed: April 20, 2006
    Publication date: November 9, 2006
    Inventors: Takeshi Sano, Hideaki Ohkura, Hirofumi Kobayashi, Kunio Ikeda
  • Publication number: 20050252398
    Abstract: A pattern form object and its manufacturing method are disclosed. The pattern form object includes a pattern constituted by an aggregate of grains, a supporting member for supporting the pattern, and a mixed layer formed at a boundary of the pattern and the supporting member. The mixed layer is constituted by a mixture of the grains and the supporting member. Dimensions of the grains in a region other than the mixed layer are greater than dimensions of the grains in the mixed layer.
    Type: Application
    Filed: April 26, 2005
    Publication date: November 17, 2005
    Inventors: Hideaki Ohkura, Takeshi Sano, Hirofumi Kobayashi
  • Publication number: 20050062168
    Abstract: A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.
    Type: Application
    Filed: September 9, 2004
    Publication date: March 24, 2005
    Inventors: Takeshi Sano, Yoshihiro Yoshida, Hideaki Ohkura, Hirofumi Kobayashi
  • Publication number: 20050009327
    Abstract: A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.
    Type: Application
    Filed: May 13, 2004
    Publication date: January 13, 2005
    Inventors: Yoshihiro Yoshida, Takeshi Sano, Hideaki Ohkura, Hirofumi Kobayashi
  • Publication number: 20040108133
    Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.
    Type: Application
    Filed: July 16, 2003
    Publication date: June 10, 2004
    Inventors: Takeshi Sano, Hirofumi Kobayashi, Hideaki Ohkura
  • Patent number: 4709898
    Abstract: A fluid-sealed engine mounting has a connector adapted to be connected to an engine, a base adapted to be connected to a vehicle frame, an elastic member joined between the connector and the base and elastically deformable in response to vibrations transmitted thereto, the connector, the base, and the elastic member jointly defining a fluid chamber in which a fluid is sealed, and a partition dividing the fluid chamber into a first chamber adjacent to the connector and a second chamber adjacent to the base, the partition having an orifice through which the first and second chambers communicate with each other. The engine mounting also includes a diaphragm mounted on the base or the connector for varying the volume of one of the first and second chambers when vibrations are transmitted to the engine mounting.
    Type: Grant
    Filed: October 4, 1985
    Date of Patent: December 1, 1987
    Assignee: Hokushin Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Yoshida, Takefumi Toyoshima, Tomio Iwabori, Hideaki Ohkura, Yasuo Miyamoto, Izumi Nishimura, Toshiyuki Oikawa, Kenji Sekijima, Makoto Ohashi
  • Patent number: 4573656
    Abstract: A fluid-sealed engine mounting has a connector adapted to be connected to an engine, a base adapted to be connected to a vehicle frame, an elastic member joined between the connector and the base and elastically deformable in response to vibrations transmitted thereto, the connector, the base, and the elastic member jointly defining a fluid chamber in which a fluid is sealed, and a partition dividing the fluid member into a first chamber adjacent to the connector and a second chamber adjacent to the base, the partition having an orifice through which the first and second chambers communicate with each other. The engine mounting also includes a diaphragm mounted on the base or the connector for varying the volume of one of the first and second chambers when vibrations are transmitted to the engine mounting.
    Type: Grant
    Filed: July 23, 1984
    Date of Patent: March 4, 1986
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Hokushin Kogyo Kabushiki Kaisha
    Inventors: Hiroshi Yoshida, Takefumi Toyoshima, Tomio Iwabori, Hideaki Ohkura, Yasuo Miyamoto, Izumi Nishimura, Toshiyuki Oikawa, Kenji Sekijima, Makoto Ohashi