Abstract: An object of the present invention is to provide a compound that is useful as a hole transport material for providing a device for converting light into electricity that is capable of extracting current with high efficiency, and a device for converting light into electricity and a solar cell that include the compound in a hole transport layer and have favorable light/electricity conversion characteristics. The present invention provides a compound represented by the general formula (1) below. In the formula, R1 to R20 each represent a hydrogen atom, an alkoxy group having 1 to 20 carbon atoms, or the like, and Y represents an oxygen atom or CR21R22, where R21 and R22 each represent a nitrile group, an acyl group having 1 to 10 carbon atoms, or the like.

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract: The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.

Abstract: A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract: A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.

Abstract: The present invention discloses a method of forming a conductive pattern including the steps of a) printing a conductive pattern onto a surface of a base material having a liquid repellent property, b) providing a lyophilic property to a predetermined area of the surface of the base material which area does not have the conductive pattern printed thereon, and c) forming an insulating layer that covers the conductive pattern.

Abstract: A pattern form object and its manufacturing method are disclosed. The pattern form object includes a pattern constituted by an aggregate of grains, a supporting member for supporting the pattern, and a mixed layer formed at a boundary of the pattern and the supporting member. The mixed layer is constituted by a mixture of the grains and the supporting member. Dimensions of the grains in a region other than the mixed layer are greater than dimensions of the grains in the mixed layer.

Abstract: A disclosed bonded structure includes a first electric structure having a first electrode, a second electric structure having a second electrode, and a middle section for electrically and mechanically bonding the first electrode and the second electrode. The middle section consists of conductive adhesives, wherein fusion bonding of metal particles is provided to at least one of the first electrode and the second electrode. The metal particles are capable of fusion bonding at a temperature lower than a thermal hardening temperature of the conductive adhesives. The conductive adhesives contain conductive filler pieces that have a particle size at which fusion bonding does not take place at a temperature lower than the thermal hardening temperature of the conductive adhesives.

Abstract: A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.

Abstract: An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

Abstract: A fluid-sealed engine mounting has a connector adapted to be connected to an engine, a base adapted to be connected to a vehicle frame, an elastic member joined between the connector and the base and elastically deformable in response to vibrations transmitted thereto, the connector, the base, and the elastic member jointly defining a fluid chamber in which a fluid is sealed, and a partition dividing the fluid chamber into a first chamber adjacent to the connector and a second chamber adjacent to the base, the partition having an orifice through which the first and second chambers communicate with each other. The engine mounting also includes a diaphragm mounted on the base or the connector for varying the volume of one of the first and second chambers when vibrations are transmitted to the engine mounting.

Abstract: A fluid-sealed engine mounting has a connector adapted to be connected to an engine, a base adapted to be connected to a vehicle frame, an elastic member joined between the connector and the base and elastically deformable in response to vibrations transmitted thereto, the connector, the base, and the elastic member jointly defining a fluid chamber in which a fluid is sealed, and a partition dividing the fluid member into a first chamber adjacent to the connector and a second chamber adjacent to the base, the partition having an orifice through which the first and second chambers communicate with each other. The engine mounting also includes a diaphragm mounted on the base or the connector for varying the volume of one of the first and second chambers when vibrations are transmitted to the engine mounting.