Patents by Inventor Hideaki Oikawa

Hideaki Oikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240049733
    Abstract: Provided is a sausage sticking system capable of changing a position and an interval at which a chain of sausages is hung on a stably held stick according to a length of a casing. The sausage sticking system includes a hook conveying unit, a stick holding unit, and a pivoting imparting unit. A loop of a chain of sausages hooked on each of the pivoting hooks of the hook conveying unit is configured to be dropped onto a stick passing through the loop by which pivoting hooks are pivoted. The stick holding unit holds both ends of the stick, and includes a fixed arm and a pair of actuating arms, wherein the pair of actuating arras alternately holds the stick and avoids the loop of the chain of sausages. The pivoting imparting unit sequentially pivots the plurality of pivoting hooks at a predetermined pivoting imparting position.
    Type: Application
    Filed: March 13, 2023
    Publication date: February 15, 2024
    Inventors: Tatsuo NAKAMURA, Takayuki Fujimaki, Hideaki Oikawa, Hirokatsu Harasawa, Takashi Arai
  • Publication number: 20230068141
    Abstract: Provided is a stick turning device capable of turning a stick on which a chain of sausages is suspended while reducing defects in the sausages when delivering the stick from an upstream device to a downstream device. The stick turning device includes a turning arm unit, a turning driving unit, and an actuator unit. The turning driving unit causes the turning arm unit to turn at a predetermined angle around a turning shaft. The actuator unit lifts the turning arm unit such that both ends of the stick are horizontally picked up from the upstream device and the stick is lifted, and such that by bringing the stick close to the turning shaft, a peripheral speed of the stick is reduced with respect to a turning speed of the turning driving unit, and defects in the sausages are reduced, and lowers the stick turned by the turning driving unit.
    Type: Application
    Filed: August 29, 2022
    Publication date: March 2, 2023
    Inventors: Tatsuo NAKAMURA, Hideaki OIKAWA
  • Patent number: 6710160
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6531568
    Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: March 11, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsushi Shibuya, Tomomi Okumura, Hideaki Oikawa, Yoshihiro Sakata, Takashi Kuroki, Yuichi Okawa, Shoji Tamai
  • Publication number: 20020188090
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): 1
    Type: Application
    Filed: March 20, 2002
    Publication date: December 12, 2002
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6458912
    Abstract: A thermoplastic polyimide having good thermal stability, comprising a repeating unit represented by the chemical formula (1), a molecular terminal being composed of the chemical formula (2) and/or chemical formula (3), characterized in that: a melt viscosity ratio calculated by the numerical formula (1) and/or the numerical formula (3) is within a numerical range shown in the numerical formula (2) and/or the numerical formula (4) and 1,3-bis(4-aminophenoxy)benzene represented by the chemical formula (3) for production of the above polyimide, characterized in that the content of an azo compound is from 0.0 to 0.2%. The thermoplastic polyimide of the present invention has excellent characteristics {circle around (1)} to {circle around (4)} described below. {circle around (1)} It is superior in thermal stability on melting. That is, the degree of lowering of the fluidity on melting with a lapse of time is small and it is possible to apply to conventional melt molding.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: October 1, 2002
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Takashi Kuroki, Yoshihiro Sakata, Tomomi Okumura, Atsushi Shibuya, Yuichi Okawa, Hideaki Oikawa, Kayako Yanagihara, Yasunori Yoshida, Masaji Yoshimura, Hiroyasu Kido, Shoji Tamai
  • Patent number: 6417361
    Abstract: The invention disclose a hydrogen fluoride containing composition comprising hydrogen fluoride and a compound which is liquid in the standard state (25° C., 1 atmosphere) and has a boiling point of 120° C. or more and pka of 12 or more at 25° C., and use of the composition for a fluorination agent. The compound which can be preferably used is represented by the formula (1): wherein R1 to R4 are a substituted or unsubstituted alkyl or aryl group and can be the same or different, and R1 or R2 or R3 and R4 can bond to form a ring having a nitrogen atom or a nitrogen atom and other hetero atom, or R1 and R3 can bond to form a ring having a nitrogen atom or a nitrogen atom and other hetero atom.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: July 9, 2002
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hidetoshi Hayashi, Hiroshi Sonoda, Ken'ichi Goto, Kouki Fukumura, Junko Naruse, Hideaki Oikawa, Teruyuki Nagata, Takashi Shimaoka, Tsuyoshi Yasutake, Hideki Umetani, Toshio Kitashima
  • Patent number: 6344579
    Abstract: There is disclosed a convenient and efficient process for producing a fluorinated silicon compound which comprises reacting a silicon compound having at least one group selected from the group consisting of a hydroxyl group, an alkoxy group, and an aryloxy group bonded to silicon atom, with a compound represented by the formula (1): wherein R1, R2, R3, and R4 may be the same or different, and each represents a substituted or unsubstituted, saturated or unsaturated alkyl group, or a substituted or unsubstituted aryl group; and R1 and R2 or R3 and R4 can bond to form a ring having one or more nitrogen atoms or having one or more nitrogen atoms and other hetero atoms; or R1 and R3 can bond to form a ring having two or more nitrogen atoms or having two or more nitrogen atoms and other hetero atoms, to fluorinate the groups.
    Type: Grant
    Filed: May 7, 2001
    Date of Patent: February 5, 2002
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Kouki Fukumura, Takashi Shimaoka, Hideaki Oikawa, Hiroshi Sonoda, Ken'ichi Goto, Junko Naruse, Hidetoshi Hayashi, Tsuyoshi Yasutake
  • Patent number: 6242654
    Abstract: A preparation process of a fluorine substituted aromatic compound comprising reacting an alkali metal or alkali earth metal salt of an aromatic compound having a hydroxy group with an organic fluorinating agent is disclosed. As a representative fluorinating agent, a bis-dialkylamino-difluoromethane compound, for example, 2,2′-difluoro-1,3-dimethylimidazolidine, is exemplified. According to the process, an industrially useful fluorinated aromatic compound, for example, a fluorobenzene, a fluorine substituted benzophenone, a fluorine substituted diarylsulfone can be prepared with ease in economy without specific equipment.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: June 5, 2001
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Kenichi Goto, Kouki Fukumura, Hiroshi Sonoda, Junko Naruse, Hidetoshi Hayashi, Hideaki Oikawa
  • Patent number: 6103860
    Abstract: There is disclosed an organic optical component prepared from a resin essentially comprising one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## This invention provides an organic optical component with excellent transparency, heat resistance and mechanical strength as well as a low birefringence. This invention also provides a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.
    Type: Grant
    Filed: June 14, 1999
    Date of Patent: August 15, 2000
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Tomomi Yoshimura, Atsushi Shibuya, Yoshihiro Sakata, Hideaki Oikawa, Masahiro Ohta
  • Patent number: 6103806
    Abstract: A polyimide resin composition is disclosed herein which comprises 5 to 60% by weight of a polyimide [polyimide (1)] having a repeating unit represented by the chemical formula 1 and 40 to 95% by weight of a polyimide [polyimide (2)] having a repeating unit represented by the chemical formula 2.
    Type: Grant
    Filed: December 21, 1998
    Date of Patent: August 15, 2000
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hiroyasu Kido, Masaji Yoshimura, Yasunori Yoshida, Kayako Yanagihara, Hideaki Oikawa, Shoji Tamai, Tomohito Koba
  • Patent number: 6080833
    Abstract: A low-birefringent organic optical component comprising a polymer prepared by polymerizing a racemic mixture of the monomer with an asymmetric spiro ring represented by general formula (1) as an essential ingredient; wherein ring A represents a monocyclic or polycyclic organic group, wherein two ring As are mutually bound each other via a spiro bond to form a spiro ring which has a molecular asymmetric structure; n is an integer of 0 to 10; X.sub.1 and Y.sub.1 are binding groups; and Z.sub.1 is a polymerization-active group. The component has excellent transparency, mechanical strength and heat resistance, as well as a low birefringence.
    Type: Grant
    Filed: July 17, 1997
    Date of Patent: June 27, 2000
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Atsuo Otsuji, Keisuke Takuma, Rihoko Suzuki, Tatsuhiro Urakami, Toshihiro Motoshima, Wataru Yamashita, Tomomi Yoshimura, Atsushi Shibuya, Yoshihiro Sakata, Hideaki Oikawa, Masahiro Ohta, Masanobu Ajioka, Masatoshi Takagi, Akio Karasawa
  • Patent number: 5990261
    Abstract: A low birefringent organic optical component prepared from a resin consisting essentially of one or more repetitive structural units selected from the group consisting of structures represented by general formula (1); ##STR1## wherein A is either of the groups below. ##STR2## The organic optical component can exhibit excellent transparency, heat resistance and mechanical strength as well as a low birefringence. Also provided is a novel aromatic polyamide with a low permitivity and excellent transparency, processability and thermal stability, besides excellent heat resistance inherent in an aromatic polyamide.
    Type: Grant
    Filed: August 26, 1997
    Date of Patent: November 23, 1999
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Tomomi Yoshimura, Atsushi Shibuya, Yoshihiro Sakata, Hideaki Oikawa, Keisuke Takuma, Masahiro Ohta
  • Patent number: 5708128
    Abstract: Novel thermoset polyimide and composite materials comprising the thermoset polyimides and a fibrous reinforcement are prepared according to this invention. The thermoset polyimides are obtained by heat-treating a linear polyamic acid or a linear polyimide prepared by using 4,4'-bis(3-aminophenoxy)biphenyl and pyromellitic dianhydride as essential monomers or by adding 4,4'-diaminodiphenyl ether or 3,3',4,4'-biphenyltetracarboxylic dianhydride to the essential monomers and by end-capping the molecular chain end with an aromatic dicarboxylic anhydride having a carbon-carbon triple bond. The thermoset polyimides have essential excellent properties of thermoplastic polyimide and additionally has enhanced heat resistance and improved mechanical properties. The thermoset polyimide can be used to provide various kinds of composite materials for aircraft matrices, electric and electronic appliances and others.
    Type: Grant
    Filed: June 24, 1996
    Date of Patent: January 13, 1998
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Hideaki Oikawa, Shoji Tamai, Masahiro Ohta, Akihiro Yamaguchi
  • Patent number: 5506311
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: November 3, 1994
    Date of Patent: April 9, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5494996
    Abstract: A polyimide resin composition substantially comprising 1 99.9.about.50 parts by weight of polyimide having recurring structural units of the formula ##STR1## and 2 0.1.about.50 parts by weight of a polyimide which improved melt flowability and is prepared by using 1,3-bis(3-aminophenoxy)benzene or 6,6'-bis(3-aminophenoxy)-3,3,3',3'-tetramethyl-1,1'-spirobiindane as essential diamine component, or polyether pyridine having recurring structural units of the formula: ##STR2## is disclosed. Further, a polyimide based resin composition comprising the polyimide resin composition or a polyimide copolymer obtained by using the above diamines and a fibrous reinforcement is disclosed. These compositions have remarkably good processability, excellent heat stability and repeated fatigue characteristics.
    Type: Grant
    Filed: July 20, 1994
    Date of Patent: February 27, 1996
    Assignee: Mitsui Toatsu Chemicals Inc.
    Inventors: Shoji Tamai, Yuichi Okawa, Wataru Yamashita, Yoshihiro Sakata, Hideaki Oikawa, Keizaburo Yamaguchi, Tadashi Asanuma, Akihiro Yamaguchi, Mitsunori Matsuo
  • Patent number: 5480965
    Abstract: This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.
    Type: Grant
    Filed: July 26, 1994
    Date of Patent: January 2, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Wataru Yamashita, Yuichi Okawa, Hideaki Oikawa, Tadashi Asanuma, Yuko Ishihara, Mitsunori Matsuo, Keizaburo Yamaguchi, Akihiro Yamaguchi, Shoji Tamai
  • Patent number: 5459233
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: December 7, 1993
    Date of Patent: October 17, 1995
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5380805
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: January 10, 1995
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi, Kouji Ohkoshi, Masao Yoshikawa
  • Patent number: 5354839
    Abstract: A polyimide comprising a requisite structural unit having one or more recurring structural units of the formula: ##STR1## such as the structural units of the formula ##STR2## The polyimide can have an extremely low dielectric constant and is colorless, transparent and excellent in processability and heat resistance, and also provides an aromatic diamine which is useful as a raw material monomer of the polyimide or a raw material of other various engineering plastics.
    Type: Grant
    Filed: March 31, 1993
    Date of Patent: October 11, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Wataru Yamashita, Yoshihiro Sakata, Toshiyuki Kataoka, Yuichi Okawa, Hideaki Oikawa, Tadashi Asanuma, Mitsunori Matsuo, Tsutomu Ishida, Keizaburo Yamaguchi, Akihiro Yamaguchi