Patents by Inventor Hideaki Okikawa

Hideaki Okikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat-resistant adhesive and method of adhesion by using adhesive
    Patent number: 5300620
    Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.
    Type: Grant
    Filed: June 22, 1993
    Date of Patent: April 5, 1994
    Assignee: Mitsui Toatsu Chemicals, Incorporated
    Inventors: Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma
  • Heat-resistant adhesive and method of adhesion by using adhesive
    Patent number: 5252700
    Abstract: The heat resistant adhesive of the invention comprises polyamic acid and/or polyimide which are prepared by using 1,3-bis(3-aminophenoxy)benzene as an aromatic diamine component and 3,3', 4,4'-biphenyltetracarboxylic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic dianhydride and/or 3,3',4,4'-diphenylethertetracarboxylic dianhydride as tetracarboxylic acid dianhydrides, and further by blocking the polymer chain end with dicarboxylic anhydride or a monoamine compound; or comprises a polyimide solution containing the polyimide in a good solvent.The adhesive of the invention is a heat-resistant adhesive capable of adhering under mild temperature/mild pressure conditions. The adhesive of polyimide solution can provide desired adhesion by simple procedures such as applying to the adherend and heating under pressure and exhibits excellent adhesive strength.
    Type: Grant
    Filed: April 21, 1992
    Date of Patent: October 12, 1993
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Hideaki Okikawa, Shoji Tamai, Katsuaki Iiyama, Saburo Kawashima, Akihiro Yamaguchi, Tadashi Asanuma