Patents by Inventor Hideaki Ootsuki

Hideaki Ootsuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging semiconductor device
    Patent number: 4942140
    Abstract: In a method of packaging a semiconductor device, the semiconductor device and a mounting body are positioned in such a manner that electrodes of the semiconductor device and leads of the mounting body are brought into slidable mechanical contact with each other, the electrodes being not bonded to the leads. Next, an insulating resin that shrinks on setting is supplied in such a manner that the contacted portions of the electrodes and the leads are covered. Subsequently, the resin is set while keeping the electrodes and the leads in contact with each other to bond the electrodes to the leads whereby the resin, when set, applies a compressive force between the electrodes and the leads.
    Type: Grant
    Filed: June 9, 1989
    Date of Patent: July 17, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideaki Ootsuki, Mitsuyuki Takada, Toru Kokogawa, Hayato Takasago