Patents by Inventor Hideaki Sakuma

Hideaki Sakuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Application distribution device distributes a program for installing an application in an image forming apparatus and non-transitory recording medium
    Patent number: 11936828
    Abstract: An application distribution device includes one or more processors and one or more memory devices storing instructions.
    Type: Grant
    Filed: March 3, 2023
    Date of Patent: March 19, 2024
    Assignee: TOSHIBA TEC KABUSHIKI KAISHA
    Inventors: Hiroshi Watanabe, Jin Kamada, Hideaki Suzuki, Sho Sakuma, Tomoki Maeda
  • Deposition method of product molded with thermoplastic resin, and a depositing electrode to be used for this deposition method
    Patent number: 6054679
    Abstract: A molded product is thermally bonded mutually with another molded product by disposing the resistance heating element (20) to the bonding face of product molded with the thermoplastic resin, making the bonding electrode (10) contact the resistance heating element (20) and by impressing the voltage for its heat generation. The heat generation temperature of the resistance heating element (20) at the voltage impressed portion (21) is suppressed to the level lower than the fusion temperature of resin by blowing the cooling gas toward the voltage impressed portion (21) from a vent hole (11) provided on the bonding electrode (10).
    Type: Grant
    Filed: May 14, 1999
    Date of Patent: April 25, 2000
    Assignee: Tohoku Munekata Co., Ltd.
    Inventors: Takeshi Ito, Hideaki Sakuma