Patents by Inventor Hideaki Sasajima

Hideaki Sasajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fixing resin composition for use in rotor
    Patent number: 9960646
    Abstract: The fixing resin composition for use in a rotor includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), wherein the content of the inorganic filler (C) is equal to or more than 50% by mass, based on 100% by mass of the total content of the fixing resin composition.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: May 1, 2018
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Hideaki Sasajima
  • FIXING RESIN COMPOSITION FOR USE IN ROTOR
    Publication number: 20130162063
    Abstract: The fixing resin composition for use in a rotor includes a thermosetting resin (A) containing an epoxy resin, a curing agent (B), and an inorganic filler (C), wherein the content of the inorganic filler (C) is equal to or more than 50% by mass, based on 100% by mass of the total content of the fixing resin composition.
    Type: Application
    Filed: August 29, 2011
    Publication date: June 27, 2013
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventor: Hideaki Sasajima
  • Epoxy resin composition and semiconductor device
    Patent number: 8470918
    Abstract: There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.
    Type: Grant
    Filed: September 27, 2006
    Date of Patent: June 25, 2013
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Hiroshi Hirose, Hideaki Sasajima, Hitoshi Kawaguchi
  • EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
    Publication number: 20090215943
    Abstract: There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.
    Type: Application
    Filed: September 27, 2006
    Publication date: August 27, 2009
    Applicant: Sumitomo Bakelite Co., Ltd.
    Inventors: Hiroshi Hirose, Hideaki Sasajima, Hitoshi Kawaguchi