Patents by Inventor Hideaki Shimozuru

Hideaki Shimozuru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6414271
    Abstract: There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: July 2, 2002
    Assignee: Kyocera Corporation
    Inventors: Kiyoshi Yokoyama, Takafumi Turumaru, Hiroyuki Arima, Hideaki Shimozuru
  • Publication number: 20020003137
    Abstract: There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 10, 2002
    Applicant: KYOCERA CORPORATION
    Inventors: Kiyoshi Yokoyama, Takafumi Turumaru, Hiroyuki Arima, Hideaki Shimozuru