Abstract: The present invention relates to a radiation sensitive resin composition comprising [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound and [C] a radical trapping agent. The radiation sensitive resin composition can provide an interlayer insulating film which satisfies general requirements for an interlayer insulating film such as high light transmittance and has excellent heat-resistant dimensional stability, heat discoloration resistance and adhesion to a substrate along with the improvement of process efficiency for improving product yield at a high resolution and has excellent storage stability.

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: The present invention relates to a radiation sensitive resin composition comprising [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound and [C] a radical trapping agent. The radiation sensitive resin composition can provide an interlayer insulating film which satisfies general requirements for an interlayer insulating film such as high light transmittance and has excellent heat-resistant dimensional stability, heat discoloration resistance and adhesion to a substrate along with the improvement of process efficiency for improving product yield at a high resolution and has excellent storage stability.

Abstract: The present invention provides a positive-type radiation-sensitive composition containing (A) a siloxane polymer, and (B) a quinone diazide compound, in which the content of aryl groups relative to Si atoms in the siloxane polymer (A) is greater than 60% by mole and no greater than 95% by mole.

Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Abstract: A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portion 5 of an optical waveguide 1, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, R1 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.

Abstract: A photosensitive resin composition for optical waveguide formation, comprising: (A) a di(meth)acrylate having the structure represented by the following general formula (1): (wherein R1 is —(OCH2CH2)m—, —(OCH(CH3)CH2)m—, or —OCH2CH(OH)CH2—; X is —C(CH3)2—, —CH2—, —O—, or —SO2—; Y is a hydrogen atom or a halogen atom; m is an integer of 0 to 4); (B) a mono(meth)acrylate having the structure represented by the following general formula (2): (wherein R2 is —(OCH2CH2)p—, —(OCH(CH3)CH2)p—, or —OCH2CH(OH)CH2—; Y is a hydrogen atom, a halogen atom, Ph-C(CH3)2—, Ph-, or an alkyl group having 1 to 20 carbon atoms; p is an integer of 0 to 4; Ph is a phenyl group); and (C) a photoradical polymerization initiator. The composition has excellent patterning ability, refractive index, heat resistance, and transmission characteristic.

Abstract: An optical waveguide chip including a core portion as an optical waveguide, a clad portion composed of a lower clad layer and an upper clad layer, and an optical fiber guide portion which is formed integrally with the clad portion for positioning a single-mode optical fiber which is to be connected with the core portion. Each portion of the optical waveguide chip is formed by creating a layer of a radiation-sensitive polysiloxane composition by photolithography. At least two kinds of radiation-sensitive polysiloxane compositions are used so that the core portion has a higher refractive index than the clad portion.

Abstract: A radiation-sensitive composition for forming optical waveguides, which can stably exhibit low transmission loss, high heat resistance, and high adhesion to a substrate such as a silicon wafer and the like, over a long period of time even under severe conditions is provided. The composition comprises: from 5 to 50 mass percent of a (meth)acrylate having an adamantyl group represented by general formula (1) or (2); (in the formula, R1 is a hydrogen atom or a methyl group; R2 is —CH2CH2—, —CH2CH(CH3)—, or —CH2CH(OH)CH2—; n is an integer from 0 to 10) (in the formula, R1 is a hydrogen atom or a methyl group; R2 is —CH2CH2—, —CH2CH(CH3)—, or —CH2CH(OH)CH2—; R3 is a hydrogen atom, a methyl group, or an ethyl group; n is an integer from 0 to 10); from 40 to 94.99 mass percent of other photopolymerizable compounds; and from 0.01 to 10 mass percent of a photopolymerization initiator.

Abstract: A radiation-sensitive resin composition for forming optical waveguides, which comprises (A) a novolac type epoxy resin and (B) a photo-acid generator. The composition is used as materials for a core portion 5 of an optical waveguide 1, and the like. In the composition, component (A) is represented by the following general formula (1). (In the formula, R1 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aralkyl group; and n is an integer from 0 to 10.) The composition is excellent in patterning properties and the like in curing process, and is also excellent in heat resistance, transmission characteristics, and long-term reliability after the optical waveguide has been formed.

Abstract: An optical waveguide chip having an optical waveguide which can keep good transmission characteristics stably over a long period of time without separations or cracks even in severe use conditions, and an optical fiber guide portion formed without cracks firmly with a shape and a size corresponding to those of an optical fiber is provided. An optical waveguide chip 1 has a support 2, an optical waveguide 3 having a core portion 7, clad layers 6 and 8, an optical fiber guide portion 4 for positioning an optical fiber to be connected with the optical waveguide 3, and a cover member (glass plate) 5. The optical waveguide 3 is made of a radiation-sensitive polysiloxane composition. The optical fiber guide portion 4 is made of the same or a different radiation-sensitive polysiloxane composition as/from the material of the optical waveguide 3. The optical waveguide 3 and the optical fiber guide portion 4 are formed by separate processes.

Abstract: A polymer optical waveguide of the present invention has a lower clad layer, a core layer and an upper clad layer that are provided on a substrate, and a cover member that covers at least one part of the upper clad layer. The upper clad layer and the cover member are fixed together by a radiation-curable adhesive. The cover member comprises quartz or glass. According to this polymer optical waveguide, moisture absorption through the upper clad layer can be prevented, deterioration in adhesive property to the substrate or changes in characteristics due to moisture absorption of materials can be suppressed even under severe environmental conditions, and there is no deterioration in optical characteristics between before and after reliability tests, and hence sufficient reliability can be secured, and the polymer optical waveguide has stable transmission characteristics.

Abstract: A radiation-curable composition containing (A) hydrolyzates of hydrolyzable silane compounds represented by general formula (1): (R1)p(R2)qSi(X)4-p-q (wherein R1 is a non-hydrolyzable organic group having 1 to 12 carbon atoms that contains fluorine atoms, R2 is a non-hydrolyzable organic group having 1 to 12 carbon atoms (but excluding ones that contain fluorine atoms), X is a hydrolyzable group, p is an integer of 1 or 2, and q is an integer of 0 or 1) and condensates of such hydrolyzates, and (B) a photo acid generator, wherein the ratio of silanol (Si—OH) groups in the composition is 0.1 to 0.5 out of all the bonding groups on Si. With such a composition, the waveguide loss is low for light having a wavelength in a broad range from the visible region to the near infrared region, and moreover the cracking resistance, the patterning ability upon irradiation with radiation, and so on are excellent.

Abstract: To provide a radiation-sensitive curable liquid resin composition having excellent applicability and capable of producing a film excelling in hardness, scratch resistance, adhesion, transparency, and appearance of the surface of the film. A curable liquid resin composition comprising: (A) particles prepared by bonding at least one oxide of an element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium to a specific organic compound which comprises a polymerizable unsaturated group and a group shown by —X—C(?Y)—NH— (wherein X is NH, O, or S, and Y is O or S), and preferably a silanol group, (B) a compound having two or more polymerizable unsaturated groups in the molecule, (C) a specific alkylene glycol organic solvent, and preferably (D) a polymerization initiator.

Abstract: A radiation-curable composition containing (A) hydrolyzates of hydrolyzable silane compounds represented by general formula (1): (R1)p(R2)qSi(X)4-p-q (wherein R1 is a non-hydrolyzable organic group having 1 to 12 carbon atoms that contains fluorine atoms, R2 is a non-hydrolyzable organic group having 1 to 12 carbon atoms (but excluding ones that contain fluorine atoms), X is a hydrolyzable group, p is an integer of 1 or 2, and q is an integer of 0 or 1) and condensates of such hydrolyzates, and (B) a photo acid generator, wherein the ratio of silanol (Si—OH) groups in the composition is 0.1 to 0.5 out of all the bonding groups on Si. With such a composition, the waveguide loss is low for light having a wavelength in a broad range from the visible region to the near infrared region, and moreover the cracking resistance, the patterning ability upon irradiation with radiation, and so on are excellent.

Abstract: The invention relates to a curable resin composition, cured products thereof, and laminated materials. The curable composition comprises: (A-1) acicular oxide particles, the oxide being an oxide of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium, (B) a compound having two or more polymerizable unsaturated groups, (C) a photopolymerization initiator is provided. After cure, the composition has excellent scratch resistance. In addition, it may have excellent antistatic characteristics and transparency. In a preferred embodiment the composition also comprises (A-2) particles other than the acicular particles (A-1), being oxide of at least one element selected from the group consisting of silicon, aluminum, zirconium, titanium, zinc, germanium, indium, tin, antimony, and cerium.

Abstract: A photosensitive resin composition for optical waveguide formation, comprising: (A) a di(meth)acrylate having the structure represented by the following general formula (1): (wherein R1 is —(OCH2CH2)m—, —(OCH(CH3)CH2)m—, or —OCH2CH(OH)CH2—; X is —C(CH3)2—, —CH2—, —O—, or —SO2—; Y is a hydrogen atom or a halogen atom; m is an integer of 0 to 4); (B) a mono(meth)acrylate having the structure represented by the following general formula (2): (wherein R2 is —(OCH2CH2)p—, —(OCH(CH3)CH2)p—, or —OCH2CH(OH)CH2—; Y is a hydrogen atom, a halogen atom, Ph-C(CH3)2—, Ph-, or an alkyl group having 1 to 20 carbon atoms; p is an integer of 0 to 4; Ph is a phenyl group); and (C) a photoradical polymerization initiator. The composition has excellent patterning ability, refractive index, heat resistance, and transmission characteristic.

Abstract: To provide a photocurable liquid resin composition that can produce cured products exhibiting a high refractive index, good shape restorability, and superior adhesion to substrates. The photocurable resin composition comprises (A) 20-80 wt % of a urethane (meth) acrylate obtained by reacting a polyether polyol having an alkyleneoxy structure in the molecule, an organic polyisocyanate compound, and a (meth) acrylate containing a hydroxyl group, (B) 10-70 wt % of a monofunctional ethylenically unsaturated compound, (C) 5-25 wt % of a (meth) acrylate monomer having four or more functional groups, and (D) 0.1-10 wt % of a photoinitiator. Cured products are useful for forming an optical part such as a lens of a lens sheet or a back light using the lens sheet.