Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit board and an integrated circuit chip package. The solder bump melts to remove restraint to the advancement of the inclined surface, so that the inclined surface advances into a space between the printed circuit board and the chip package in response to the melt of the solder bump. A force to lift the chip package in the direction perpendicular to the surface of the printed circuit board acts on the chip package after the solder bump has completely melted down. Detachment of an electrically conductive pad is thus reliably prevented on the printed circuit board. The chip package can solely be removed without inducing detachment of the electrically conductive pad on the printed circuit board.

Abstract: An optical module including a substrate, a plurality of optical components mounted on the substrate, and a plurality of first optical fibers connected to the optical components. The optical module further includes a fiber sheet including a first resin sheet having an adhesive layer on one side, a plurality of second optical fibers wired on the adhesive layer of the first resin sheet, and a second resin sheet attached to the first resin sheet so that the second optical fibers are sandwiched between the first and second resin sheets. The second optical fibers of the fiber sheet project from between the first and second resin sheets and are connected to the first optical fibers by fusion splicing.

Abstract: A fiber sheet including a first resin sheet having an adhesive layer on one side, first and second optical fibers wired on the adhesive layer of the first resin sheet so as to cross each other, and a plurality of spacers scattered on the adhesive layer of the first resin sheet. The fiber sheet further includes a second resin sheet attached to the first resin sheet so that the first and second optical fibers and the spacers are sandwiched between the first and second resin sheets. Preferably, each spacer is a spherical spacer.

Abstract: An optical fiber splicer for splicing a plurality of first optical fibers arranged in spaced relationship with each other and a plurality of second optical fibers arranged in opposed relationship with the first optical fibers. The optical fiber splicer includes an XY table movable in XY directions orthogonal to each other, a tray mounted on the XY table, and first and second clamps for respectively clamping a selected one of the first optical fibers and a selected one of the second optical fibers to be spliced to the selected first optical fiber. The optical fiber splicer further includes first and second electrodes extending vertically and aligned with each other, first and second cameras located so as to interpose the first electrode, and an image processing unit for processing images picked up by the first and second cameras.

Abstract: An optical fiber edge surface processing method has the steps of capturing a transmitted-light image of end portions of two optical fibers placed facing each other, and extracting, based on a brightness distribution in the transmitted-light image, edge surface information of each of the two optical fibers to be spliced together; selecting a discharge condition corresponding to the edge surface information from among a plurality of discharge conditions prestored in a storage unit; and melting the splicing edge surfaces of the two optical fibers in accordance with the selected discharge condition, and thereby shaping the splicing edge surfaces. With this method, splice loss can be reduced in a simple manner, even when the edge surface angle of each optical fiber, or the relative edge surface angle between the two optical fibers, or the amount of chipping at the splicing cross section of each optical fiber, is large.

Abstract: An optical fiber splicer for splicing a plurality of first optical fibers arranged in spaced relationship with each other and a plurality of second optical fibers arranged in opposed relationship with the first optical fibers. The optical fiber splicer includes an XY table movable in XY directions orthogonal to each other, a tray mounted on the XY table, and first and second clamps for respectively clamping a selected one of the first optical fibers and a selected one of the second optical fibers to be spliced to the selected first optical fiber. The optical fiber splicer further includes first and second electrodes extending vertically and aligned with each other, first and second cameras located so as to interpose the first electrode, and an image processing unit for processing images picked up by the first and second cameras.

Abstract: An optical module including a substrate, a plurality of optical components mounted on the substrate, and a plurality of first optical fibers connected to the optical components. The optical module further includes a fiber sheet including a first resin sheet having an adhesive layer on one side, a plurality of second optical fibers wired on the adhesive layer of the first resin sheet, and a second resin sheet attached to the first resin sheet so that the second optical fibers are sandwiched between the first and second resin sheets. The second optical fibers of the fiber sheet project from between the first and second resin sheets and are connected to the first optical fibers by fusion splicing.

Abstract: A fiber sheet including a first resin sheet having an adhesive layer on one side, first and second optical fibers wired on the adhesive layer of the first resin sheet so as to cross each other, and a plurality of spacers scattered on the adhesive layer of the first resin sheet. The fiber sheet further includes a second resin sheet attached to the first resin sheet so that the first and second optical fibers and the spacers are sandwiched between the first and second resin sheets. Preferably, each spacer is a spherical spacer.

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is removed from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.

Abstract: There is disclosed a method of surface mounting a connector which enables a connector to be automatically mounted while preserving reliability of soldered portions and without additionally providing a special apparatus. The connector is formed to be thick at a portion and thin at another portion with respect to an axis C.sub.1. In surface mounting the connector on the printed circuit board, a hook member is inserted into a through hole formed in advance through the printed circuit board. Then, the reflow process is carried out on the printed circuit board whereby terminals of the chips including the lead pins are soldered. The printed circuit board is reroved from a reflow furnace, and cooled, whereupon the hook member is bent toward a hooking portion side. This brings the hooking portion into engagement with the underside of the printed circuit board, whereby the connector is firmly fixed to the printed circuit board.