Abstract: An elastomer film of a thermoplastic elastomer composition comprising 30-70 weight % of an ethylene-propylene-diene copolymer and 70-30 weight % of an ethylene-vinyl acetate copolymer having a vinyl acetate content of 5-30 weight % and a melt index of 0.2-25 g/10 minutes, the elastomer film having a thickness of 10-60 .mu.m, and a draw ratio expressed by a heat shrinkage ratio at 50.degree. C. which is 5-35% in an MD direction and 5-25% in a TD direction, the ratio of the draw ratio in an MD direction to the draw ratio in a TD direction being 3 or less, is produced by an air-cooled inflation method.

Abstract: Shrinkable film and articles prepared therefrom which shrink more than 5% when heated to a temperature of 50.degree. C. are disclosed. The shrinkable film is prepared by stretching a polymer film of EPDM or EPM and EVA and talc more than 1.5 times in at least one direction at specified temperatures.

Abstract: A method of forming a heat-resistant product, produced from a polymer composition comprising 40-70 weight % of a thermoplastic elastomer containing a repeating unit derived from ethylene and a repeating unit derived from propylene and 60-30 weight % of an ethylene-vinyl acetate copolymer containing 7.5 weight % or more of a vinyl acetate repeating unit, which comprises blending the polymer composition at a temperature of 160.degree. C. or less, molding it at a temperature of 180.degree. C. or less, and then cross-linking the resulting molded product by irradiating it with an electron beam or by heating to produce a foamed product which has good shape memory characteristics.

Abstract: A heat-resistant formed product produced from a polymer composition comprising 40-70 weight % of a thermoplastic elastomer containing a repeating unit derived from ethylene and a repeating unit derived from propylene and 60-30 weight % of an ethylene-vinyl acetate copolymer containing 7.5 weight % or more of a vinyl acetate repeating unit, by blending the polymer composition at a temperature of 160.degree. C. or less, molding it at a temperature of 180.degree. C. or less, and then cross-linking the resulting molded product by irradiating electron beam or heating. The formed product also has good shape memory characteristics.