Patents by Inventor Hideaki Tokita

Hideaki Tokita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit having polysilicon fuse, method of forming the same, and method of adjusting circuit parameter thereof
    Publication number: 20050224910
    Abstract: Exemplary semiconductor integrated circuits are disclosed that include polysilicon fuses that can be programmed by supplying programming currents. The fuse is formed of a polysilicon film having a sheet resistance of 1.7 to 6 k?/sq. As a result, the polysilicon fuse has a high resistance and can be programmed with low current. Accordingly, the fuse can be programmed with a high yield even when the programming current is supplied through a wire having a high resistance.
    Type: Application
    Filed: March 28, 2005
    Publication date: October 13, 2005
    Applicant: KAWASAKI MICROELECTRONICS INC.
    Inventors: Isamu Kuno, Hideaki Tokita