Patents by Inventor Hideaki Tsubaki

Hideaki Tsubaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM USING THE SAME, PATTERN FORMING METHOD, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND RESIN
    Publication number: 20140272692
    Abstract: There is provided an actinic ray-sensitive or radiation-sensitive composition comprising (P) a compound having a phenolic hydroxyl group and a group formed by substituting for the hydrogen atom in a phenolic hydroxyl group by a group represented by the specific formula, a resist film formed using the specific actinic ray-sensitive or radiation-sensitive composition, a pattern forming method containing steps of exposing and developing the resist film, a manufacturing method of an electronic device, containing the pattern forming method, and an electronic device manufactured by the specific manufacturing method of an electronic device.
    Type: Application
    Filed: May 29, 2014
    Publication date: September 18, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Natsumi YOKOKAWA, Takeshi KAWABATA, Hiroo TAKIZAWA, Hideaki TSUBAKI, Shuji HIRANO
  • Pattern forming method, electron beam-sensitive or extreme ultraviolet-sensitive composition, resist film, manufacturing method of electronic device, and electronic device
    Patent number: 8822129
    Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an electron beam-sensitive or extreme ultraviolet-sensitive resin composition containing (A) a resin that contains a repeating unit having a partial structure represented by the specific formula and can decrease the solubility for a developer containing an organic solvent by the action of an acid, and (B) a compound capable of generating an acid upon irradiation with an electron beam or an extreme ultraviolet ray, (2) a step of exposing the film by using an electron beam or an extreme ultraviolet ray, and (4) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: September 2, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Hideaki Tsubaki, Shuji Hirano
  • ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM THEREFROM AND METHOD OF FORMING PATTERN
    Publication number: 20140227636
    Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (Aa) containing at least one repeating unit (Aa1) derived from monomers of general formula (aa1-1) below and at least one repeating unit (Aa2) derived from monomers of general formula (aa2-1) below and comprising a resin (Ab) that when acted on by an acid, changes its alkali solubility.
    Type: Application
    Filed: March 28, 2014
    Publication date: August 14, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Shuji HIRANO, Hiroo TAKIZAWA, Hideaki TSUBAKI
  • PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE
    Publication number: 20140212811
    Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid, (B) a compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation, (C) a resin having one or more groups selected from the specific group as defined in the specification and (D) a solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Naoki INOUE, Hiroo TAKIZAWA, Shuji HIRANO, Hideaki TSUBAKI
  • PATTERN FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET-SENSITIVE COMPOSITION, RESIST FILM, METHOD FOR MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE
    Publication number: 20140212796
    Abstract: There is provided a pattern forming method comprising (1) a step of forming a film by using an electron beam-sensitive or extreme ultraviolet-sensitive resin composition, (2) a step of exposing the film by using an electron beam or an extreme ultraviolet ray, and (3) a step of developing the exposed film by using an organic solvent-containing developer, wherein the electron beam-sensitive or extreme ultraviolet-sensitive resin composition contains (A) a resin containing (R) a repeating unit having a structural moiety capable of decomposing upon irradiation with an electron beam or an extreme ultraviolet ray to generate an acid, and (B) a solvent.
    Type: Application
    Filed: March 27, 2014
    Publication date: July 31, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Hiroo TAKIZAWA, Kaoru IWATO, Hideaki TSUBAKI
  • ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND PATTERN FORMING METHOD EACH USING THE COMPOSITION, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF RESIN
    Publication number: 20140212797
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes: (P) a resin that contains (A) a repeating unit capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid in a side chain of the resin (P) and (C) a repeating unit represented by the following formula (I) as defined in the specification, wherein a polydispersity of the resin (P) is 1.20 or less.
    Type: Application
    Filed: March 28, 2014
    Publication date: July 31, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Takeshi KAWABATA, Hideaki TSUBAKI
  • PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE
    Publication number: 20140199617
    Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid and (B) a low molecular weight compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and decomposing by an action of an acid to decrease a solubility of the low molecular weight compound (B) in an organic solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of developing the film with a developer containing an organic solvent after the exposing to form a negative pattern.
    Type: Application
    Filed: March 27, 2014
    Publication date: July 17, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Hideaki TSUBAKI, Hiroo TAKIZAWA, Takeshi KAWABATA
  • PATTERN-FORMING METHOD, ELECTRON BEAM-SENSITIVE OR EXTREME ULTRAVIOLET RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE USING THEM AND ELECTRONIC DEVICE
    Publication number: 20140193749
    Abstract: A pattern-forming method includes in this order: step (1) of forming a film with an electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition that contains (A) a resin having an acid-decomposable repeating unit and capable of decreasing a solubility of the resin (A) in a developer containing an organic solvent by an action of an acid, (B) a compound capable of generating an acid upon irradiation with an electron beam or extreme ultraviolet radiation and (C) a solvent; step (2) of exposing the film with an electron beam or extreme ultraviolet radiation; and step (4) of forming a negative pattern by development of the film with a developer containing an organic solvent after the exposing of the film, wherein a content of the compound (B) is 21% by mass to 70% by mass on the basis of all solids content of the composition.
    Type: Application
    Filed: March 13, 2014
    Publication date: July 10, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Hiroo TAKIZAWA, Hideaki TSUBAKI, Shuji HIRANO
  • METHOD OF FORMING PATTERNS
    Publication number: 20140080068
    Abstract: A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing the polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film, (c) exposing the resist film via an immersion medium, and (d) performing development with a negative developer.
    Type: Application
    Filed: November 19, 2013
    Publication date: March 20, 2014
    Applicant: FUJIFILM Corporation
    Inventor: Hideaki TSUBAKI
  • METHOD OF FORMING PATTERNS
    Publication number: 20140057209
    Abstract: A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer.
    Type: Application
    Filed: November 7, 2013
    Publication date: February 27, 2014
    Applicant: FUJIFILM Corporation
    Inventor: Hideaki TSUBAKI
  • Resist composition for negative tone development and pattern forming method using the same
    Patent number: 8642253
    Abstract: To provide a resist composition for negative tone development, which can form a pattern having a good profile improved in the pattern undercut and moreover, can reduce the line edge roughness and enhance the in-plane uniformity of the pattern dimension, and a pattern forming method using the same. A resist composition for negative tone development, comprising (A) a resin capable of increasing the polarity by the action of an acid to increase the solubility in a positive tone developer and decrease the solubility in a negative tone developer, (B) a compound capable of generating an acid having an acid dissociation index pKa of ?4.0 or less upon irradiation with an actinic ray or radiation, and (C) a solvent; and a pattern forming method using the same.
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: February 4, 2014
    Assignee: FUJIFILM Incorporated
    Inventor: Hideaki Tsubaki
  • ACTINIC-RAY-OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN FILM THEREFROM AND METHOD OF FORMING PATTERN USING THE COMPOSITION
    Publication number: 20140030643
    Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition including a resin (P) containing an acid-decomposable repeating unit (A), which resin when acted on by an acid, increases its solubility in an alkali developer, a compound (Q) that when exposed to actinic rays or radiation, generates an acid, and a compound (R) expressed by general formula (1) or (2) below.
    Type: Application
    Filed: September 27, 2013
    Publication date: January 30, 2014
    Applicant: FUJIFILM Corporation
    Inventors: Toshiya TAKAHASHI, Hiroo TAKIZAWA, Hideaki TSUBAKI, Shuji HIRANO, Tomotaka TSUCHIMURA
  • Actinic ray-sensitive or radiation-sensitive resin composition, and resist film and pattern forming method using the composition
    Patent number: 8637220
    Abstract: An actinic ray-sensitive or radiation-sensitive resin composition comprising (A) a guanidine compound having a logP value of 1.2 or more, and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: January 28, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Tomotaka Tsuchimura, Hideaki Tsubaki, Toshiya Takahashi
  • Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
    Patent number: 8637229
    Abstract: A pattern forming method, including: (A) coating a substrate with a positive resist composition of which solubility in a positive developer increases and solubility in a negative developer decreases upon irradiation with actinic rays or radiation, so as to form a resist film; (B) exposing the resist film; and (D) developing the resist film with a negative developer; a positive resist composition for multiple development used in the method; a developer for use in the method; and a rinsing solution for negative development used in the method.
    Type: Grant
    Filed: August 31, 2010
    Date of Patent: January 28, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Shinichi Kanna
  • Negative resist pattern forming method, developer and negative chemical-amplification resist composition used therefor, and resist pattern
    Patent number: 8637222
    Abstract: A resist pattern forming method including in the following order, (1) a step of forming a film by using a negative chemical-amplification resist composition capable of undergoing negative conversion by a crosslinking reaction, (2) a step of exposing the film, and (4) a step of developing the exposed film by using a developer containing an organic solvent; a developer and a negative chemical-amplification resist composition used therefor; and a resist pattern formed by the pattern forming method.
    Type: Grant
    Filed: January 29, 2010
    Date of Patent: January 28, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Toru Tsuchihashi, Tadateru Yatsuo, Koji Shirakawa, Hideaki Tsubaki, Akira Asano
  • Method of forming patterns
    Patent number: 8632942
    Abstract: A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film having a receding contact angle of 70 degrees or above with respect to water, wherein the resist composition for negative development contains a resin capable of increasing the polarity by the action of an acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) exposing the resist film via an immersion medium, and (c) performing development with a negative developer.
    Type: Grant
    Filed: November 29, 2011
    Date of Patent: January 21, 2014
    Assignee: FUJIFILM Corporation
    Inventor: Hideaki Tsubaki
  • Method of forming patterns
    Patent number: 8617794
    Abstract: A method of forming patterns includes (a) coating a substrate with a resist composition for negative development to form a resist film, wherein the resist composition contains a resin capable of increasing the polarity by the action of the acid and becomes more soluble in a positive developer and less soluble in a negative developer upon irradiation with an actinic ray or radiation, (b) forming a protective film on the resist film with a protective film composition after forming the resist film and before exposing the resist film, (c) exposing the resist film via an immersion medium, and (d) performing development with a negative developer.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: December 31, 2013
    Assignee: FUJIFILM Corporation
    Inventor: Hideaki Tsubaki
  • Pattern forming method, and resist composition, developer and rinsing solution used in the pattern forming method
    Patent number: 8603733
    Abstract: A pattern forming method comprising a step of applying a resist composition whose solubility in a negative tone developer decreases upon irradiation with an actinic ray or radiation and which contains a resin having an alicyclic hydrocarbon structure and a dispersity of 1.7 or less and being capable of increasing the polarity by the action of an acid, an exposure step, and a development step using a negative tone developer; a resist composition for use in the method; and a developer and a rinsing solution for use in the method, are provided, whereby a pattern with reduced line edge roughness and high dimensional uniformity can be formed.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: December 10, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Shinji Tarutani, Hideaki Tsubaki, Kazuyoshi Mizutani, Kenji Wada, Wataru Hoshino
  • Active light ray sensitive or radioactive ray sensitive resin composition, and active light ray sensitive or radioactive ray sensitive film and pattern forming method using the same
    Patent number: 8603727
    Abstract: An active light ray sensitive or radioactive ray sensitive resin composition which satisfies high sensitivity, high resolution, good pattern configuration, and good line edge roughness at the same time to a great extent, while having sufficiently good outgassing performance during exposure, and an active light ray sensitive or radioactive ray sensitive film formed by using the composition, and a pattern-forming method, are provided. The active light ray sensitive or radioactive ray sensitive resin composition according to the present invention includes a resin (P) containing a repeating unit (A) which decomposes by irradiation with active light ray or radioactive ray to generate an acid, and a repeating unit (C) containing a primary or secondary hydroxyl group.
    Type: Grant
    Filed: October 4, 2011
    Date of Patent: December 10, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Takeshi Kawabata, Hidenori Takahashi, Tomotaka Tsuchimura, Shuji Hirano, Hideaki Tsubaki
  • Organic solvent development or multiple development pattern-forming method using electron beams or EUV rays
    Patent number: 8546063
    Abstract: Provided is a pattern-forming method including, in the following order: (1) a process of forming a film with an actinic ray-sensitive or radiation-sensitive resin composition comprising a resin which contains an acid-decomposable repeating unit and is capable of decreasing the solubility in an organic solvent by the action of an acid; (2) a process of exposing the film with an electron beam or an EUV ray; and (4) a process of developing the film with a developer containing an organic solvent.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: October 1, 2013
    Assignee: FUJIFILM Corporation
    Inventors: Hideaki Tsubaki, Koji Shirakawa, Toru Tsuchihashi