Patents by Inventor Hideaki Urata

Hideaki Urata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMAGE SUPERIMPOSITION SYSTEM AND IMAGE SUPERIMPOSITION METHOD
    Publication number: 20240303776
    Abstract: An image superimposition system (100) according to the present disclosure includes: a control device (4) that generates face region image information indicating a face region image obtained by trimming a face region (R1) in a captured image, and generates superimposition object region image information indicating a superimposition object region image obtained by trimming a superimposition object region (R2) in a captured image; a face recognition device (2) that recognizes a face image and generates face image information indicating the face image; a superimposition object recognition device (3) that recognizes a superimposition image corresponding to the superimposition object region image; and a combining device (5) that detects the face image of the user from a combining region image that is an image of a combining region (R3) larger than the face region (R1) and the superimposition object region (R2) in a captured image, and generates combined image information indicating a combined image formed by superi
    Type: Application
    Filed: June 28, 2021
    Publication date: September 12, 2024
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Masakazu URATA, Satoshi SAKUMA, Hiroshi CHIGIRA, Tatsuya MATSUI, Masafumi SUZUKI, Hideaki IWAMOTO
  • Bonded assembly, method of jointing for preparation thereof and rivet
    Patent number: 6083604
    Abstract: The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: July 4, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kosuke Haraga, Naoki Yagi, Yoshinobu Nakashima, Yuzi Ganryu, Tsutomu Sasaki, Atsushi Takimoto, Yosiro Komazawa, Asao Okuda, Shoji Takagi, Akifumi Matsukawa, Hideaki Urata, Yasushi Kawashima, Kazumi Masuo, Kenji Honma, Isao Ikeda
  • Bonded assembly, method of jointing for preparation thereof and rivet
    Patent number: 5776584
    Abstract: The present invention relates to a bonded assembly characterized in that a board having a convexed portion on a jointing surface thereof and a board having, on a jointing surface thereof, a concaved portion or a through hole to be engaged with the convexed portion are jointed with adhesives. Also, the present invention relates to a bonded assembly characterized in that an adhesive is coated on the portion other than the convexed portion of the board so that the coating thickness is smaller than the height of the convexed portion, and then the board is jointed to another board having a concaved portion or a through hole, after making alignment of the boards. Further, the present invention relates to a rivet having means for fitting to and temporarily fixing to an inserting through hole, and a method of jointing boards which comprises a step for inserting, fitting and temporarily fixing the rivet having the means for temporarily fixing to the inserting through hole on the board.
    Type: Grant
    Filed: October 19, 1995
    Date of Patent: July 7, 1998
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kosuke Haraga, Naoki Yagi, Yoshinobu Nakashima, Yuzi Ganryu, Tsutomu Sasaki, Atsushi Takimoto, Yosiro Komazawa, Asao Okuda, Shoji Takagi, Akifumi Matsukawa, Hideaki Urata, Yasushi Kawashima, Kazumi Masuo, Kenji Honma, Isao Ikeda