Abstract: A Manufacturing method for a semiconductor device is provided and includes examining a semiconductor element on a semiconductor wafer, by an on-wafer test, storing on-semiconductor-wafer coordinate position data of the semiconductor devices and a result of the on-wafer test, and incorporating the semiconductor element, divided as individual pieces by dicing the semiconductor wafer, in packages followed by conducting a final test. When the semiconductor element is incorporated in the package, generated and stored is association data of the on-semiconductor-wafer coordinate position data with a mark on the package. Determined is the wafer test result of the semiconductor element in the package by referring the association data based on the mark of the package when conducting the final test. Skipped to perform is a test item, in which the result of the on-wafer test can be utilized, among test items to perform in the final test.

Abstract: A spin-on coater comprises: a turntable that supports thereon and rotates a substrate to be processed; a rotation-drive section that rotatively drives the turntable; and an eccentric slide mechanism that moves a center of the substrate from a center point of rotation up to an eccentric point distant from the center point of rotation, wherein the substrate is rotatively driven so that the center of the substrate is located between the center point of rotation and the eccentric point therefrom.

Abstract: A Manufacturing method for a semiconductor device is provided and includes examining a semiconductor element on a semiconductor wafer, by an on-wafer test, storing on-semiconductor-wafer coordinate position data of the semiconductor devices and a result of the on-wafer test, and incorporating the semiconductor element, divided as individual pieces by dicing the semiconductor wafer, in packages followed by conducting a final test. When the semiconductor element is incorporated in the package, generated and stored is association data of the on-semiconductor-wafer coordinate position data with a mark on the package. Determined is the wafer test result of the semiconductor element in the package by referring the association data based on the mark of the package when conducting the final test. Skipped to perform is a test item, in which the result of the on-wafer test can be utilized, among test items to perform in the final test.

Abstract: Image signal processing has the steps of: judging from four pixels adjacent to an object pixel whether the object pixel constitutes a single edge; judging whether the single edge is horizontal or vertical, if it is judged that the object pixel constitutes the single edge; and interpolating the object pixel in accordance with at least right and left two pixels adjacent to the object pixel in a horizontal direction, if it is judged that the single edge is horizontal, and interpolating the object pixel in accordance with at least upper and lower two pixels adjacent to the object pixel in a vertical direction, if it is judged that the single edge is vertical.