Patents by Inventor Hidefumi Hayashi

Hidefumi Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
    Publication number: 20060246314
    Abstract: A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a molybdenum-copper composite and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10?6/K at 30-800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
    Type: Application
    Filed: June 23, 2006
    Publication date: November 2, 2006
    Inventors: Mitsuo Osada, Norio Hirayama, Tadashi Arikawa, Yoshinari Amano, Hidetoshi Maesato, Hidefumi Hayashi, Hiroshi Murai
  • Method of producing a heat dissipation substrate of molybdenum powder impregnated with copper with rolling in primary and secondary directions
    Patent number: 7083759
    Abstract: A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10?6/K at 30–800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: August 1, 2006
    Assignee: A.L.M.T. Corp.
    Inventors: Mitsuo Osada, Norio Hirayama, Tadashi Arikawa, Yoshinari Amano, Hidetoshi Maesato, Hidefumi Hayashi, Hiroshi Murai
  • Material of heat-dissipating plate on which semiconductor is mounted, method for fabricating the same, and ceramic package produced by using the same
    Publication number: 20020191377
    Abstract: A material for a semiconductor-mounting heat dissipation substrate comprises a copper-molybdenum rolled composite obtained by impregnating melted copper into a void between powder particles of a molybdenum powder compact to obtain a composite of molybdenum and copper and then rolling the composite. In a final rolling direction of a plate material, the coefficient of linear expansion is 8.3×10−6/K at 30-800° C. The material for a semiconductor-mounting heat dissipation substrate is superior in thermal conductivity to a CMC clad material and easy in machining by a punch press. The substrate material is used as a heat dissipation substrate (13) of a ceramic package (11).
    Type: Application
    Filed: December 13, 2001
    Publication date: December 19, 2002
    Inventors: Mitsuo Osada, Norio Hirayama, Tadashi Arikawa, Yoshinaro Amano, Hidetoshi Maesato, Hidefumi Hayashi, Hiroshi Murai
  • Taste masking pharmaceutical composition
    Patent number: 5707646
    Abstract: A composition for oral preparations, having a complex formed by dispersing or dissolving an unpleasantly tasting basic drug and a functional polymer compound in a substance having a low melting point, 10 to 70% by weight, based on the composition, of sugar alcohol and 0.1 to 7% by weight, based on the composition, of basic oxide. The composition for oral preparation is excellent in masking unpleasantly tasting basic drugs and has excellent performance in biological use.
    Type: Grant
    Filed: September 9, 1994
    Date of Patent: January 13, 1998
    Assignee: Taisho Pharmaceutical Co., Ltd.
    Inventors: Toshio Yajima, Kuniaki Ishii, Nobuo Umeki, Shigeru Itai, Hidefumi Hayashi, Kimihide Shimano, Ikuo Koyama
  • Composition for solid pharmaceutical preparations containing vitamin D3 derivative
    Patent number: 5328903
    Abstract: A composition for solid pharmaceutical preparations containing a vitamin D.sub.3 derivative capable of permitting the derivative to be uniformly distributed in the composition while being stabilized. The composition contains an excipient consisting of mannitol and sugar, a degradative agent consisting of hydroxypropyl cellulose, and a binder consisting of polyvinyl pyrrolidone and hydroxypropylmethyl cellulose.
    Type: Grant
    Filed: February 10, 1993
    Date of Patent: July 12, 1994
    Assignees: Taisho Pharmaceutical Co. Ltd., Sumitomo Pharmaceuticals Co. Ltd., Wisconsin Alumni Research Foundation
    Inventors: Kuniaki Ishii, Yumiko Toriumi, Shigeru Itai, Hidefumi Hayashi, Masami Nemoto