Patents by Inventor Hidefumi KINDA

Hidefumi KINDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Workpiece cutting method
    Patent number: 11806805
    Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: November 7, 2023
    Assignees: Kyoritsu Chemical & Co., Ltd., HAMAMATSU PHOTONICS K.K.
    Inventors: Mikiharu Kuchiki, Hidefumi Kinda, Daisuke Kurita, Takeshi Sakamoto, Takafumi Ogiwara, Yuta Kondoh, Naoki Uchiyama
  • COMPOSITION FOR SEALING
    Publication number: 20210316405
    Abstract: A sealing composition which can be handled in a semi-cured state and can obtain a sintered body having excellent joining strength and sealing performance is provided. A sealing composition including a solder powder, coated silver particles including silver core particles and a coating agent arranged on a surface of the silver core particles, and a solvent is provided. Further, a sintering temperature (T2) of the coated silver particles and a boiling point (T3) of the solvent satisfy T2?T3.
    Type: Application
    Filed: August 30, 2019
    Publication date: October 14, 2021
    Inventors: Yu OYAMA, Hidefumi KINDA, Daisuke KURITA, Harunobu MATSUI, Daijitsu HARADA, Masaki TAKEUCHI
  • WORKPIECE CUTTING METHOD
    Publication number: 20200180075
    Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 11, 2020
    Applicants: Kyoritsu Chemical & Co., Ltd., HAMAMATSU PHOTONICS K.K.
    Inventors: Mikiharu KUCHIKI, Hidefumi KINDA, Daisuke KURITA, Takeshi SAKAMOTO, Takafumi OGIWARA, Yuta KONDOH, Naoki UCHIYAMA