Patents by Inventor Hidefumi Nakamura

Hidefumi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150188024
    Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.
    Type: Application
    Filed: December 22, 2014
    Publication date: July 2, 2015
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Yukihiko SHIOHARA, Taku KAWASAKI, Fumiaki AKAHANE
  • Patent number: 9045632
    Abstract: A method for producing a composition for injection molding which contains an inorganic powder composed of at least one of a metal material and a ceramic material and a binder containing a polyacetal-based resin and a glycidyl group-containing polymer. The method includes: cryogenically grinding a first resin containing the polyacetal-based resin as a main component; cryogenically grinding a second resin containing the glycidyl group-containing polymer as a main component; mixing a powder obtained by grinding the first resin, a powder obtained by grinding the second resin, and the inorganic powder, thereby obtaining a mixed powder; and kneading the mixed powder.
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: June 2, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Hidefumi Nakamura, Nobuyuki Hamakura
  • Publication number: 20150130326
    Abstract: A method of manufacturing a vibrator which includes a method of manufacturing a wiring board includes disposing one granular conductor within each of through holes of a ceramic substrate having the through holes formed therein, supplying a glass paste into the through holes, baking the glass paste, forming an electrode, and disposing a vibrator element and a lid. When a maximum diameter of the granular conductor is set to d1 and a minimum diameter of each of the through holes is set to d2, d1/d2 is preferably equal to or greater than 0.8 and equal to or less than 1.
    Type: Application
    Filed: November 11, 2014
    Publication date: May 14, 2015
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Yukihiko SHIOHARA, Tetsuya OTSUKI, Tetsuro MIYAO
  • Publication number: 20150114178
    Abstract: A metal powder for powder metallurgy contains Fe as a principal component, Cr in a proportion of 10% by mass or more and 30% by mass or less, C in a proportion of 0.15% by mass or more and 1.5% by mass or less, Si in a proportion of 0.3% by mass or more and 1% by mass or less, Zr in a proportion of 0.01% by mass or more and 0.5% by mass or less, Nb in a proportion of 0.01% by mass or more and 0.5% by mass or less, and Mn and Ni in a total proportion of 0.05% by mass or more and 1.6% by mass or less. Further, the metal powder for powder metallurgy preferably has a crystal structure of martensite-based stainless steel.
    Type: Application
    Filed: October 30, 2014
    Publication date: April 30, 2015
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Yukihiko SHIOHARA
  • Publication number: 20150104346
    Abstract: A laser sintering powder to be sintered by irradiation with a laser light is provided. The sintering powder includes a plurality of metal particles and a binder which binds the metal particles to one another. The binder is sublimated by the irradiation with the laser light. The average particle diameter of the metal particles is 5 ?m or more and 10 ?m or less, and the average particle diameter of the laser sintering powder is 30 ?m or more and 50 ?m or less. Further, after a powder layer is formed using the laser sintering powder, this powder layer may be compressed in the thickness direction before or after irradiation with the laser light.
    Type: Application
    Filed: October 10, 2014
    Publication date: April 16, 2015
    Inventors: Hidefumi NAKAMURA, Yu MAEDA
  • Publication number: 20150093721
    Abstract: A dental blank is provided for yielding a metal frame having a desired shape according to a dental CAD/CAM system and a machining process. The dental blank is formed from a metal powder sintered body and contains Co as a main component, Cr in a proportion of 26% by mass or more and 35% by mass or less, Mo in a proportion of 5% by mass or more and 12% by mass or less, and Si in a proportion of 0.5% by mass or more and 1.0% by mass or less. Further, part of the Si is silicon oxide, and the ratio of the silicon oxide to the total amount of Si is preferably 10% by mass or more and 90% by mass or less.
    Type: Application
    Filed: September 26, 2014
    Publication date: April 2, 2015
    Inventors: Hidefumi NAKAMURA, Yukihiko SHIOHARA
  • Publication number: 20150070855
    Abstract: A circuit board includes a ceramics substrate composed of ceramics and a conductor portion provided on the ceramics substrate. The conductor portion is composed of a stacked body including, in order from the ceramics substrate side, an under layer that contains a Group 6 element and a glass material, and a metal layer that contains a low-melting-point metal. A portion of the low-melting-point metal constituting the metal layer migrates to the under layer.
    Type: Application
    Filed: September 10, 2014
    Publication date: March 12, 2015
    Inventors: Tetsuro MIYAO, Tetsuya OTSUKI, Hideki ISHIGAMI, Yukihiko SHIOHARA, Hidefumi NAKAMURA
  • Publication number: 20150000468
    Abstract: There is provided a metal powder for powder metallurgy including Zr and Si in a manner such that following conditions of (A) and (B) are satisfied, wherein a remainder thereof includes at least one element selected from the group consisting of Fe, Co and Ni, (A) the mass ratio of a content of Zr to a content of Si is 0.03 to 0.3, and (B) the content of Si is 0.35 to 1.5% by mass.
    Type: Application
    Filed: September 17, 2014
    Publication date: January 1, 2015
    Inventor: Hidefumi NAKAMURA
  • Publication number: 20130256957
    Abstract: A translucent alumina has an alumina content of 99.98% by mass or more and a density of 3.97 g/cm3 or more, and in which the volume percentage of crystal textures having an aspect ratio of 1.5 or less and a long axis length of 10 ?m or less is 93% or more.
    Type: Application
    Filed: March 26, 2013
    Publication date: October 3, 2013
    Applicant: Seiko Epson Corporation
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Junichi HAYASHI
  • Publication number: 20120252322
    Abstract: A polishing media is formed of a sintered body in which a metal structure and a ceramic structure are intermingled with each other. The polishing media is preferably produced by molding a mixed powder of a metal powder and a ceramic powder by an injection molding method and sintering the resulting molded article. Further, the ceramic structure is preferably formed of aluminum oxide, and the metal structure is preferably formed of tungsten.
    Type: Application
    Filed: March 29, 2012
    Publication date: October 4, 2012
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hideki ISHIGAMI, Hidefumi NAKAMURA, Junichi HAYASHI
  • Publication number: 20110314965
    Abstract: There is provided a metal powder for powder metallurgy including Zr and Si in a manner such that following conditions of (A) and (B) are satisfied, wherein a remainder thereof includes at least one element selected from the group consisting of Fe, Co and Ni, (A) the mass ratio of a content of Zr to a content of Si is 0.03 to 0.3, and (B) the content of Si is 0.35 to 1.5% by mass.
    Type: Application
    Filed: May 24, 2011
    Publication date: December 29, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Hidefumi NAKAMURA
  • Publication number: 20110314964
    Abstract: There is disclosed a compound for powder metallurgy including a binder composition for powder metallurgy and a metal powder. The binder composition for powder metallurgy includes a hydrocarbon-based resin and wax, wherein the content of oxygen is 20 mass % or less. The content of the hydrocarbon-based resin in the compound for powder metallurgy is 1 to 2 times the content of the wax, by mass ratio. It is preferable that the binder composition further includes a copolymer formed through a copolymerization of a first monomer including a cyclic ether group with a second monomer.
    Type: Application
    Filed: June 24, 2011
    Publication date: December 29, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hideki ISHIGAMI, Masaaki SAKATA, Junichi HAYASHI, Hidefumi NAKAMURA
  • Publication number: 20110280759
    Abstract: In a method for producing a sintered compact, a composition containing metal powder and an organic binder is formed into a given shape. When baking is performed by using a baking furnace inside of which a jig containing silica is provided, a furnace atmosphere of the baking furnace is set to be an atmosphere of inert gas, a furnace pressure is controlled to be 0.1 kPa or more but 100 kPa or less, and the furnace pressure during baking is increased at a time when the process is in the middle of heating-up.
    Type: Application
    Filed: May 10, 2011
    Publication date: November 17, 2011
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Hidefumi NAKAMURA, Hideki ISHIGAMI
  • Publication number: 20070231181
    Abstract: A method of manufacturing a sintered body includes a first process of forming a metal powder containing carbon into a compact having a predetermined shape and a second process of baking the compact in a hermetically sealed space so as to produce a sintered body. The hermetically sealed space has an atmosphere having a pressure of 60 kPa to 140 kPa and contains a hydrogen gas and an oxygen gas. The sum of partial pressures of the hydrogen gas and the oxygen gas is not more than 3 Pa.
    Type: Application
    Filed: March 26, 2007
    Publication date: October 4, 2007
    Inventor: Hidefumi Nakamura