Abstract: A device for examining an end part according to the present invention includes a light projecting portion, a light receiving portion, a displacement sensor amplifier, and a data processing apparatus. The light projecting portion projects light on the end part of a semiconductor wafer. The light receiving portion receives specular reflected light reflected from the end part of the semiconductor wafer. The displacement sensor amplifier and the data processing apparatus calculate the displacement amount of the end part of the semiconductor wafer by a change in the distribution of the quantity of the specular reflected light received by the light receiving portion. Thus, the device for examining an end part can be reduced in size and simplified. Additionally, the device for examining an end part can be obtained, with which a change of the material of the end part of a measurement target is hardly detected as defects falsely.