Patents by Inventor Hideharu Furukawa

Hideharu Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11237207
    Abstract: A test socket assembly for a semiconductor device used for burn-in testing comprising a base assembly, a floating plate coupled to the base assembly, and a latch assembly mounted on the floating plate for the retention and movement of the semiconductor device. The base assembly further includes a pin assembly for electrically coupling to the semiconductor device for burn-in testing and at least two upstanding flex arms. In addition, the floating plate and the latch assembly move to a test position for accommodating a varying height of the semiconductor device when mating with a test fixture while the latch still effectively retains the semiconductor device. Lastly, the floating plate is held in a fixed load position due to the support provided by the upstanding flex arms when inserting the semiconductor device into the test socket.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: February 1, 2022
    Assignee: Sensata Technologies, Inc.
    Inventor: Hideharu Furukawa
  • Publication number: 20210156906
    Abstract: A test socket assembly for a semiconductor device used for burn-in testing comprising a base assembly, a floating plate coupled to the base assembly, and a latch assembly mounted on the floating plate for the retention and movement of the semiconductor device. The base assembly further includes a pin assembly for electrically coupling to the semiconductor device for burn-in testing and at least two upstanding flex arms. In addition, the floating plate and the latch assembly move to a test position for accommodating a varying height of the semiconductor device when mating with a test fixture while the latch still effectively retains the semiconductor device. Lastly, the floating plate is held in a fixed load position due to the support provided by the upstanding flex arms when inserting the semiconductor device into the test socket.
    Type: Application
    Filed: November 25, 2019
    Publication date: May 27, 2021
    Applicant: SENSATA TECHNOLOGIES, INC.
    Inventor: Hideharu Furukawa
  • Patent number: 7988500
    Abstract: A socket apparatus comprises a base portion defining an array of contact cavities. A plurality of contacts are inserted into the array of contact cavities defined in the base portion. The base portion includes a top side and a bottom side and a plurality of ribs extending from the bottom side. Each rib defines at least one sidewall that engages with an anchor of a contact to securely mount the contact. Each contact includes a mounting portion having a first anchor and a second anchor extending from the mounting portion and operable to engage a mounting surface of the base portion to securely mount the contact. The first anchor provides a first anchor force for the contact to the base portion that is substantially greater than a second anchor force provided by the second anchor to the base portion.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: August 2, 2011
    Assignee: Sensata Technologies Massachusetts, Inc.
    Inventors: Hideharu Furukawa, Haruhiko Endoh
  • Publication number: 20110143559
    Abstract: A socket apparatus comprises a base portion defining an array of contact cavities. A plurality of contacts are inserted into the array of contact cavities defined in the base portion. The base portion includes a top side and a bottom side and a plurality of ribs extending from the bottom side. Each rib defines at least one sidewall that engages with an anchor of a contact to securely mount the contact. Each contact includes a mounting portion having a first anchor and a second anchor extending from the mounting portion and operable to engage a mounting surface of the base portion to securely mount the contact. The first anchor provides a first anchor force for the contact to the base portion that is substantially greater than a second anchor force provided by the second anchor to the base portion.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 16, 2011
    Inventors: Hideharu Furukawa, Haruhiko Endoh
  • Patent number: 6548924
    Abstract: A protective device (3) for a hermetic type electromotively driven compressor (1a) includes a protector assembly (30) having a housing (32) with an electric current fuse (34) which detects a predetermined over-current. The housing (32) comprises an electrically insulating skirt member (31) formed so as to block a conductive part on the side facing an external connection terminal. By forming the electrically insulating skirt member (31) of housing (32) for a hermetic type electromotively driven compressor, insulation distance between a conductive part such as the electric current fuse (34) and an external conductive part such as a metal wall part (21) is set to be 9.5 mm or more.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: April 15, 2003
    Assignees: Texas Instruments Incorporated, Hitachi, Ltd.
    Inventors: Hideharu Furukawa, Yoshihiko Ishikawa, Toshio Shimada, Wataru Sugawara
  • Publication number: 20010048285
    Abstract: A protective device (3) for a hermetic type electromotively driven compressor (1a) includes a protector assembly (30) having a housing (32) with an electric current fuse (34) which detects a predetermined over-current. The housing (32) comprises an electrically insulating skirt member (31) formed so as to block a conductive part on the side facing an external connection terminal. By forming the electrically insulating skirt member (31) of housing (32) for a hermetic type electromotively driven compressor, insulation distance between a conductive part such as the electric current fuse (34) and an external conductive part such as a metal wall part (21) is set to be 9.5 mm or more.
    Type: Application
    Filed: May 30, 2001
    Publication date: December 6, 2001
    Inventors: Hideharu Furukawa, Yoshihiko Ishikawa, Toshio Shimada, Wataru Sugawara
  • Patent number: 6276969
    Abstract: A terminal connector (10, 60, 80, 100, 120, 142) for connecting a lead wire to a terminal which is a component of a current path so that the current path will be established. The terminal connector has a lead wire attachment portion (12, 62, 82, 102, 122, 144) which is fixed to the terminal connector with continuity maintained with respect to the lead wire, a terminal mounting portion (13, 63, 83, 103, 123, 143) mounted on the terminal, a fuse portion (14, 64, 84, 104, 124, 145) which electrically connects the lead wire fixing portion and the terminal mounting portion to each other and which melts at a predetermined overcurrent, and a reinforcement portion (15, 85, 105, 125, 146) which protects the fuse portion against external forces.
    Type: Grant
    Filed: September 11, 2000
    Date of Patent: August 21, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Mitsuru Unno, Tatsuhiko Satoh, Hideharu Furukawa
  • Patent number: 5903418
    Abstract: Motor protection for air conditioning and refrigeration compressors includes in a first embodiment a cluster block (22) having a seat for a hermetic motor protector (24, 24') and mounting a combination terminal/fusible link (26/26d, 26d') in which the motor protector and combination terminal/fusible link can be exposed to cooling fluid contained in the compressor container and the cluster block is mounted on a lead-through pin (18a) of a header (18) in the container wall. In a second embodiment the cluster block (30) is mounted on all three pins (18a, 18b, 18c) of header (18) with pin connectors received in parallel extending channels (30a, 30b, 30c) of the cluster block. In another embodiment the cluster block (40) is irregular in configuration in order to accommodate available space in certain compressor containers and has a lid (40g) to enclose the motor protector.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: May 11, 1999
    Assignee: Texas Instruments Incorporated
    Inventors: Keith F. Boivin, Hideharu Furukawa, Radi Pejouhy
  • Patent number: 5607610
    Abstract: A compact protector device having a housing 10 with a fixed electrode 18 and terminal member 12 and a movable electrode 26 and terminal member 14 contained therein. The movable electrode 26 includes a thermostatic bimetal member 26a with a movable contact 28 attached thereto positioned to engage and disengage with a fixed contact 20 attached to the fixed electrode 18 upon action of the bimetal member 26c. A positive temperature coefficient (PTC) element 24 is positioned in direct heat transfer relationship with the bimetal member 26c and electrically connected between the fixed and movable electrodes 18, 26. The protector further includes an insulating member 22 for compressively holding the movable electrode 26 in electrical contact with the PTC element 24 and forming a fulcrum point for action of said bimetal member 26c.
    Type: Grant
    Filed: April 5, 1995
    Date of Patent: March 4, 1997
    Assignee: Texas Instruments Incorporated
    Inventor: Hideharu Furukawa