Patents by Inventor Hideharu Hashimukai

Hideharu Hashimukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11827773
    Abstract: Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600° C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: November 28, 2023
    Assignee: CEMEDINE CO., LTD.
    Inventors: Naoko Ishihara, Atsushi Ikeda, Tomonori Saito, Hideharu Hashimukai
  • Publication number: 20230313002
    Abstract: A two-component adhesive includes agent A containing an epoxy resin and agent B containing a polymer having a crosslinkable silicon group and an epoxy resin curing agent, wherein agent A and/or agent B contain(s) a core-shell rubber particle, and a condensation catalyst for the crosslinkable silicon group. Another adhesive contains an epoxy resin, a core-shell rubber particle, a polymer having a crosslinkable silicon group, an epoxy resin curing agent, and a condensation catalyst for the crosslinkable silicon group, wherein a cured product of the adhesive has a breaking strength (tensile strength at rupture) of 5 MPa or more and an elongation at break (elongation at rupture) of 30% or more, and has storage elastic moduli at 1 Hz in tensile mode of 100 to 1000 MPa at 20° C. and 50 to 1000 MPa at 80° C.
    Type: Application
    Filed: July 30, 2021
    Publication date: October 5, 2023
    Inventors: Shingo YANO, Yu TOKITA, Atsuhiko SUZUKI, Hideharu HASHIMUKAI
  • Publication number: 20200347233
    Abstract: Provided is a curable composition which forms a cured product that has excellent fireproof performance, while having excellent shape retainability even in cases where the expansion ratio of the cured product after firing is set to a high value. This curable composition includes a shape retention agent, while having fluidity when applied; and if a cured product that is obtained by curing this curable composition is fired in 600° C. air atmosphere for 30 minutes, the cured product after firing has shape retainability.
    Type: Application
    Filed: August 31, 2018
    Publication date: November 5, 2020
    Applicant: CEMEDINE CO., LTD.
    Inventors: Naoko ISHIHARA, Atsushi IKEDA, Tomonori SAITO, Hideharu HASHIMUKAI
  • Patent number: 6306966
    Abstract: A moisture curable composition excellent in transparency, operating efficiency and storage stability, and is suitable for use as an adhesive and a sealing material is provided. The moisture curable composition produced by blending 100 parts by weight of a mixture (A) and 2 parts by weight to 300 parts by weight of amorphous powder (B). The mixture (A) comprises (1) a copolymer having reactive silicon groups which can be cross-linked by hydrolysis, whose molecular chain substantially consists of (i) alkylacrylate and/or alkylmethacrylate monomeric units having an alkyl group with 1 to 8 carbon atoms, and (ii) alkylacrylate and/or alkylmethacrylate monomeric units having an alkyl group with 10 or more carbon atoms, and (2) a polymer substantially consisting of oxyalkylene including reactive silicon groups which can be cross-linked by hydrolysis. The amorphous powder (B) has a grain diameter ranging from 0.01 &mgr;m to 300 &mgr;m.
    Type: Grant
    Filed: October 21, 1999
    Date of Patent: October 23, 2001
    Assignee: Cemedine Co., Ltd.
    Inventors: Yasunobu Horie, Yoshinobu Egawa, Yuichi Oshima, Hideharu Hashimukai, Tomokazu Wakaume, Hiroshi Aoki
  • Patent number: RE41805
    Abstract: A moisture curable composition excellent in transparency, operating efficiency and storage stability, and is suitable for use as an adhesive and a sealing material is provided. The moisture curable composition produced by blending 100 parts by weight of a mixture (A) and 2 parts by weight to 300 parts by weight of amorphous powder (B). The mixture (A) comprises (1) a copolymer having reactive silicon groups which can be cross-linked by hydrolysis, whose molecular chain substantially consists of (i) alkylacrylate and/or alkylmethacrylate monomeric units having an alkyl group with 1 to 8 carbon atoms, and (ii) alkylacrylate and/or alkylmethacrylate monomeric units having an alkyl group with 10 or more carbon atoms, and (2) a polymer substantially consisting of oxyalkylene including reactive silicon groups which can be cross-linked by hydrolysis. The amorphous powder (B) has a grain diameter ranging from 0.01 ?m to 300 ?m.
    Type: Grant
    Filed: October 23, 2003
    Date of Patent: October 5, 2010
    Assignee: Cemedine Co., Ltd.
    Inventors: Yasunobu Horie, Yoshinobu Egawa, Yuichi Oshima, Hideharu Hashimukai, Tomokazu Wakaume, Hiroshi Aoki