Patents by Inventor Hideharu Ishihara

Hideharu Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 1,3-selenazolin derivatives and process for preparing the same
    Patent number: 7176164
    Abstract: A process for preparing novel 1,3-selanazolin derivatives represented by chemical formula 1 at high yield.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: February 13, 2007
    Assignee: Gifu University
    Inventors: Mamoru Koketsu, Hideharu Ishihara
  • Lithium aluminum hydride-based selenating reagent and preparation methods using same
    Patent number: 7033564
    Abstract: A selenating reagent obtained by reacting lithium aluminum hydride with selenium powder in an organic solvent. In addition, a method for preparing a selenating reagent includes reacting lithium aluminum hydride with selenium powder in an organic solvent. Also, a method of preparing a selenium-containing product includes reacting the selenating reagent, prepared as stated, with at least one second compound which may be acyl chloride.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: April 25, 2006
    Assignee: Gifu University
    Inventors: Mamoru Koketsu, Hideharu Ishihara
  • Method of connecting circuit boards
    Patent number: 6719187
    Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: April 13, 2004
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
  • Selenating reagent
    Publication number: 20040062706
    Abstract: A selenating reagent obtained by reacting lithium aluminum hydride with selenium powder in an organic solvent.
    Type: Application
    Filed: August 2, 2002
    Publication date: April 1, 2004
    Applicant: Gifu University
    Inventors: Mamoru Koketsu, Hideharu Ishihara
  • Method of connecting circuit boards
    Publication number: 20030205610
    Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.
    Type: Application
    Filed: June 9, 2003
    Publication date: November 6, 2003
    Inventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
  • Novel 1,3-selenazolin derivatives and process for preparing the same
    Publication number: 20030158239
    Abstract: A process for preparing novel 1,3-selanazolin derivatives represented by chemical formula 1 at high yield. This process includes a step of reacting a selenourea and an &agr;-haloacyl halide in a solvent and in the presence of a catalyst.
    Type: Application
    Filed: December 13, 2002
    Publication date: August 21, 2003
    Applicant: GIFU UNIVERSITY
    Inventors: Mamoru Koketsu, Hideharu Ishihara
  • Method of connecting circuit boards
    Patent number: 6598780
    Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another.
    Type: Grant
    Filed: December 20, 2000
    Date of Patent: July 29, 2003
    Assignee: Denso Corporation
    Inventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
  • Method of connecting circuit boards
    Publication number: 20010013535
    Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.
    Type: Application
    Filed: December 20, 2000
    Publication date: August 16, 2001
    Inventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki