Patents by Inventor Hideharu Kobashi
Hideharu Kobashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230215770Abstract: A semiconductor manufacturing apparatus includes an imaging device that images a die; a lighting device having a light source that is a point light source or a line light source; and a controller configured to apply a light beam to a part of the die by the light source to form a bright field area on the die, and repeat moving the bright field area at a predetermined pitch and imaging of the die to inspect an inside of the bright field area.Type: ApplicationFiled: December 19, 2022Publication date: July 6, 2023Inventors: Hideharu KOBASHI, Keita YAMAMOTO, Akio MATSUZOE
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Patent number: 11692947Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.Type: GrantFiled: July 16, 2021Date of Patent: July 4, 2023Assignee: Fasford Technology Co., Ltd.Inventors: Yuta Ono, Hideharu Kobashi, Koji Hosaka, Masaaki Yoshiyama
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Publication number: 20220199433Abstract: A die bonding apparatus includes a control device for controlling an imaging device. The control device is configured to: detect the dicing grooves by photographing the wafer using the imaging device; roughly determine a central position of the die by calculating the center coordinate of the die on the basis of the detected dicing grooves; move a center of the die to a center of an optical axis of the imaging device on the basis of the center coordinate; photograph the moved die by the imaging device and detect positions of pads possessed by the die on the basis of an image of the photographed die; detect a specific pad arrangement having a unique pitch on the basis of the detected dispositions of the pads; and register the detected specific pad arrangement as a template model.Type: ApplicationFiled: December 10, 2021Publication date: June 23, 2022Inventors: Hideharu Kobashi, Masayuki Mochizuki
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Publication number: 20220034823Abstract: A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.Type: ApplicationFiled: July 16, 2021Publication date: February 3, 2022Inventors: Yuta ONO, Hideharu KOBASHI, Koji HOSAKA, Masaaki YOSHIYAMA
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Publication number: 20140265094Abstract: For providing a die bonder, a bonding head device and a collet position adjusting method for enabling an automatic correction (adjustment) of errors, including height and inclination thereof, when exchanging a collet, with a simple structure thereof, in the bonding head device, having a holder 41h for guiding a vacuum for suction in an inside thereof, a shank 41s and a collet 41c, detachably attached at a tip of the holder, for adjusting the position of the collet after exchange of the collet, a reverse-side surface of that collet is photographed, before exchanging it, by a reverse-side surface photographing camera 42, which is disposed below the bonding head device, and after the exchange of the collet, the reverse-side surface of that collet exchanged, and then correction is made on positions of the collets, so that pictures photographed before/after the exchange thereof come to be coincident with.Type: ApplicationFiled: September 12, 2013Publication date: September 18, 2014Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.Inventors: Hideharu KOBASHI, Keisuke NADAMOTO, Yoshihisa NAKAJIMA
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Publication number: 20140078289Abstract: A die bonder comprises a storage unit which stores the image of the wafer taken by an imaging unit, a recognition pattern included the outline of a die formed on the wafer, and a recognition program, and a monitor-processing unit which gets the position on the wafer, of the die whose map data indicates normal, in the way that the die is matched with the recognition pattern by executing the recognition program, and that the center position of the die is gotten. Thus, the die bonder can recognize the position of the die without regard to the condition of dies on the wafer.Type: ApplicationFiled: February 28, 2013Publication date: March 20, 2014Applicant: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.Inventors: Ryo OMORI, Hideharu KOBASHI
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Patent number: 8574933Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: GrantFiled: January 10, 2013Date of Patent: November 5, 2013Assignee: Renesas Electronics CorporationInventors: Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Patent number: 8367433Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: GrantFiled: July 21, 2010Date of Patent: February 5, 2013Assignee: Renesas Electronics CorporationInventors: Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Publication number: 20100285615Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: ApplicationFiled: July 21, 2010Publication date: November 11, 2010Inventors: HIDEHARU KOBASHI, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Patent number: 7824932Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: GrantFiled: May 6, 2009Date of Patent: November 2, 2010Assignee: Renesas Electronics CorporationInventors: Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Publication number: 20090215204Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: ApplicationFiled: May 6, 2009Publication date: August 27, 2009Inventors: Hideharu KOBASHI, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita
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Publication number: 20080057599Abstract: A technique is provided which can exactly recognize a chip to be picked up when picking up the chip from a wafer sheet in a process of die bonding a thin chip. A camera is coupled to one end of a lens barrel, an objective lens is attached to an opposite end of the lens barrel, and an image of a main surface of a chip is photographed through the objective lens. A surface-emitting lighting unit, a diffusing plate and a half mirror are internally provided between the lens barrel and the chip. Further, another lens barrel having a coaxial drop lighting function of radiating light to the main surface of the chip along the same optical axis as that of the camera is disposed.Type: ApplicationFiled: September 5, 2007Publication date: March 6, 2008Inventors: Hideharu Kobashi, Hiroshi Maki, Masayuki Mochizuki, Yoshiaki Makita