Abstract: A temperature calculation method for a substrate, the temperature calculation method includes: calculating, by a computer performing a circuit simulation based on a resistance equivalent to a component that joins two substrates included in a target model of an analysis, a value of a current that flows through the component or voltage values in respective end portions of the component; setting, based on model information for expressing the target model, the current value or the voltage values in a first surface and a second surface that are included in surfaces of an outer shape of the component and that are in contact with the respective substrates; and calculating a first current density distribution of the component by performing a first electrical analysis according to the setting.

Abstract: An information processing apparatus includes a memory, and a processor coupled to the memory and the processor configured to represent a shape of a component with a plurality of meshes, when a portion of the shape of the component exists in a first mesh of the plurality of meshes, exchange the first mesh with a second mesh of the plurality of meshes, which is filled with the shape of the component, and when a designated flow path overlaps with the second mesh, replace the second mesh with the first mesh in which the designated flow path exists.

Abstract: A non-transitory computer-readable recording medium has stored therein a program for causing a computer to execute a process for displaying a characteristic, the process includes displaying, on a display, a main screen indicating a first characteristic in a first area of an object to be analyzed; and displaying, on the display, a sub-screen indicating a second characteristic in a second area in the object, the second characteristic being different from the first characteristic, the second area being specified within the main screen, the sub-screen being overlapped on a portion within the main screen, the portion being corresponding to a portion of the second area in the first area.

Abstract: A non-transitory computer-readable recording medium having stored therein a program for causing a computer to execute a process for thermal conductivity calculation, the process includes receiving information indicating a surface of a first part, on which a particular part having high elasticity is disposed; receiving specification information indicating a second part in contact with the particular part; receiving information Indicating a first thickness of the particular part; calculating a second thickness of the particular part after compressed when the particular part is placed between the surface and the second part; and calculating a thermal conductivity of the compressed particular part having the second thickness, according to an amount of compression indicating a difference between the first and the second thicknesses and to a correspondence relationship between a thermal resistance of the particular part and an amount obtained by subtracting a thickness of the compressed particular part from the fir

Abstract: An information processing device includes a processor configured to extract contact surfaces from among surfaces of a first component. The respective contact surfaces are in contact with a second component. The processor is configured to calculate a ratio between an area of a first contact surface and an area of a portion of the first contact surface. The portion is in contact with the second component. The processor is configured to determine whether the calculated ratio is a predetermined reference value or more, and generate first information upon determining that the calculated ratio is the predetermined reference value or more. The first information indicates a thermal path including a partial route between the first and second components. The processor is configured to generate second information upon determining that the calculated ratio is less than the predetermined reference value. The second information indicates a thermal path not including the partial route.

Abstract: A temperature calculation method for a substrate, the temperature calculation method includes: calculating, by a computer performing a circuit simulation based on a resistance equivalent to a component that joins two substrates included in a target model of an analysis, a value of a current that flows through the component or voltage values in respective end portions of the component; setting, based on model information for expressing the target model, the current value or the voltage values in a first surface and a second surface that are included in surfaces of an outer shape of the component and that are in contact with the respective substrates; and calculating a first current density distribution of the component by performing a first electrical analysis according to the setting.

Abstract: A thermal analysis apparatus calculates an area of a predetermined range including an electronic component mounted on a printed-circuit board. The thermal analysis apparatus counts the number of via holes included in the predetermined range of which the area is calculated. The thermal analysis apparatus calculates a first physical property value using the area calculated, the number of via holes counted, and a preset physical property value of a conductor. The thermal analysis apparatus generates a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the first physical property value calculated is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board.

Abstract: An analysis apparatus for a printed circuit board. The analysis apparatus includes a processor that executes a process of rewriting physical property data of a wiring layer of a printed circuit board to a value. The value is based on physical property data of an electronic part having a heat-generating attribute. The electronic part is mounted on the portion of the wiring layer. The analysis apparatus converts the physical property data of the portion of the wiring layer that has the electronic part to physical property data of an insulating layer of the printed circuit board.

Abstract: A thermal analysis apparatus calculates an area of a predetermined range including an electronic component mounted on a printed-circuit board. The thermal analysis apparatus counts the number of via holes included in the predetermined range of which the area is calculated. The thermal analysis apparatus calculates a first physical property value using the area calculated, the number of via holes counted, and a preset physical property value of a conductor. The thermal analysis apparatus generates a thermal analysis model subject to thermal analysis in which a preset physical property value is set in the electronic component and a heat release path having the first physical property value calculated is provided in the printed-circuit board so as to extend from the electronic component in a layer direction of the printed-circuit board.

Abstract: An analysis support system has an analysis purpose input section being able to input an analysis purpose, an analysis level designator designating an analysis level representing a range for analysis according to the inputted analysis purpose, a configuration information record section recording configuration information about other component to be combined with each component, in association with the analysis level, a purpose-specific component group generator generating a purpose-specific component group representing an analytic component that is to configure the purpose-specific analytic model on the basis of the analysis level and the configuration information, and an analytic model generator generating the purpose-specific analytic model on the basis of a basic analytic model having the analytic component corresponding to the analysis object and the purpose-specific component group. An analytic model according to an analysis purpose can be readily generated, which improves the serviceability.

Abstract: A circuit information acquisition and conversion device, a method, and a program therefor for acquiring a layer configuration, wire traces and shapes of via holes from circuit board design information; optimizing, before conversion into an analysis model, the output target range of the via holes on the basis of a package area, heat density distribution, and power consumption; and creating an analysis model that is suitable for a purpose of the analysis are provided.

Abstract: An analysis apparatus for a printed circuit board includes a converting portion that rewrites physical property data of a wiring layer in contact with a mounting surface having the part corresponding to an extracted electronic part data to a value based on the physical property data of an electronic part, and converts the physical property data of a region having the electronic part corresponding to the electronic part data extracted by the extracting portion to the physical property data of an insulating layer.

Abstract: An analysis supporting apparatus that supports a product analyzing operation, includes a model-data generating unit that generates model data regarding an analysis model of an analysis target component in association with component hierarchy data representing a hierarchy of components forming an analysis target product, and a advice-data generating unit that generates, based on a logic registered in advance, advice data from the model data to improve design with respect to the analysis target product.

Abstract: An analysis supporting apparatus includes a model-data generating unit that generates model data regarding an analysis model of an analysis target component in association with component hierarchy data representing a hierarchy of components forming an analysis target product; and a data converting unit that converts the model data generated by the model-data generating unit to generate analysis data for use in an analyzing process. When requested to generate model data of a component at a hierarchical level, the model-data generating unit refers to the component hierarchy data to specify a component at a hierarchical level higher or lower than the hierarchical level of the component, and uses model data of the specified component at the higher or lower hierarchical level to generate the requested model data.

Abstract: An analysis support system has an analysis purpose input section being able to input an analysis purpose, an analysis level designator designating an analysis level representing a range for analysis according to the inputted analysis purpose, a configuration information record section recording configuration information about other component to be combined with each component, in association with the analysis level, a purpose-specific component group generator generating a purpose-specific component group representing an analytic component that is to configure the purpose-specific analytic model on the basis of the analysis level and the configuration information, and an analytic model generator generating the purpose-specific analytic model on the basis of a basic analytic model having the analytic component corresponding to the analysis object and the purpose-specific component group. An analytic model according to an analysis purpose can be readily generated, which improves the serviceability.

Abstract: A circuit information acquisition and conversion device, a method, and a program therefor for acquiring a layer configuration, wire traces and shapes of via holes from circuit board design information; optimizing, before conversion into an analysis model, the output target range of the via holes on the basis of a package area, heat density distribution, and power consumption; and creating an analysis model that is suitable for a purpose of the analysis are provided.

Abstract: A printed circuit board design system performs, with a 3D-CAD system, a mounting design including a cabinet. In order to prepare, without mistakes in less man-hours, an accurate 3D model of a printed circuit board provided to the 3D-CAD system, a converter converts the printed circuit board into a unit-type model, a division-type model, a single-type model, and a library-type model composed of one or more models based on attributes preliminarily added to a mounting component stored in a mounting design DB storage.

Abstract: In a method of recognizing a connection of a reconstructing pattern in a printed wiring board when a circuit modification process after a printed board wiring is performed by a physical cutting, a jumper, or the like, a physical connection table is prepared which has a forward connecting direction address (KP address) indicating a forward connection order of connecting elements (a land, a via, a manual land, an external land, a line, and a jumper) with a predetermined connecting element (the land) being made a starting point and a backward connecting direction address (NKP address) indicating a backward connection order to the forward connection order, based on a pattern input information table. Also, a large area pattern is regarded as one of a peripheral line, a punching line, an imaginary line, and a cutting line of the above-mentioned lines, whereby the connecting elements are made to include the large area pattern.

Abstract: A printed circuit board design system performs, with a 3D-CAD system, a mounting design including a cabinet. In order to prepare, without mistakes in less man-hours, an accurate 3D model of a printed circuit board provided to the 3D-CAD system, a converter converts the printed circuit board into a unit-type model, a division-type model, a single-type model, and a library-type model composed of one or more models based on attributes preliminarily added to a mounting component stored in a mounting design DB storage.

Abstract: Remodeling, designing and editing method and system for a printed wiring board which makes it possible to reduce steps for remodeling operation and improving a quality of remodeled d a according to effectiveness of manual editing is provided. The method and system comprises the steps for comparing connection pattern data of the previously provided printed wiring board with that of the latest circuit, displaying an editable section, which is different from that of the latest circuit, detected on the comparison, and inputting an instruction of disconnection or wiring to the editable section displayed on the displaying step.