Patents by Inventor Hideharu Takeuchi

Hideharu Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10392465
    Abstract: A polymerized rosin compound includes a rosin dimer component (A) including a bifunctional rosin dimer component (a1) represented by formula (1): ROOC—X—COOR. In this formula, X represents a rosin dimer residue derived from abietic acid, neoabietic acid, or palustric acid, which are resin acids having conjugated double bonds; and R represents hydrogen, an alkyl group of I to 5 carbon atoms, or a benzyl group. The rosin dimer component (A) contains a bifunctional rosin dimer component (a1) in the amount of 80% by weight or more and a rosin trimer or higher oligomer component (B) in the range from 1.5 to 3.
    Type: Grant
    Filed: August 20, 2013
    Date of Patent: August 27, 2019
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Yoshimasa Sato, Naoki Kamatani, Kouji Takahashi, Kohei Hatakeda, Hideharu Takeuchi
  • Publication number: 20170152341
    Abstract: The polymerized rosin compound of the invention includes a rosin dimer component (A) including a bifunctional rosin dimer component (a1) represented by formula (1): ROOC—X—COOR, wherein X represents a rosin dimer residue, and R represents hydrogen, an alkyl group of 1 to 5 carbon atoms, or a benzyl group, wherein the rosin dimer component (A) contains a content of the bifunctional rosin dimer component (a1) of 80% by weight or more and the polymerized rosin compound contains a content of the rosin dimer component (A) of 80% by weight or more. The polymerized rosin compound contains a large amount of the bifunctional rosin dimer component and makes it possible to obtain linear polymer with a high molecular weight.
    Type: Application
    Filed: August 20, 2013
    Publication date: June 1, 2017
    Inventors: Yoshimasa Sato, Naoki Kamatani, Kouji Takahashi, Kohei Hatakeda, Hideharu Takeuchi
  • Publication number: 20150232604
    Abstract: The polymerized rosin compound of the invention includes a rosin dimer component (A) including a bifunctional rosin dimer component (a1) represented by formula (1): ROOC—X—COOR, wherein X represents a rosin dimer residue, and R represents hydrogen, an alkyl group of 1 to 5 carbon atoms, or a benzyl group, wherein the rosin dimer component (A) contains a content of the bifunctional rosin dimer component (a1) of 80% by weight or more and the polymerized rosin compound contains a content of the rosin dimer component (A) of 80% by weight or more. The polymerized rosin compound contains a large amount of the bifunctional rosin dimer component and makes it possible to obtain linear polymer with a high molecular weight.
    Type: Application
    Filed: August 20, 2012
    Publication date: August 20, 2015
    Inventors: Yoshimasa Sato, Naoki Kamatani, Kouji Takahashi, Kohei Hatakeda, Hideharu Takeuchi
  • Patent number: 8263686
    Abstract: The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: September 11, 2012
    Assignee: Arakawa Chemical Industries, Ltd.
    Inventors: Hideharu Takeuchi, Kouki Hamata, Masaki Kobayashi, Minoru Murata, Takahiro Koshimizu
  • Publication number: 20100171146
    Abstract: The present invention provides an optical semiconductor encapsulating composition comprising (A) an epoxy compound, (B) a carboxylic anhydride curing agent, (C) a curing accelerator, and (D) surface-coated silica particles having an average particle diameter of 5 to 50 nm in which 0.2 to 3 mmol of a silane coupling agent (D2) that contains an epoxy group-containing silane coupling agent (d1) is reacted with 1 g of silica particles (D1) to surface-coat the silica particles, the epoxy group being converted into a hydroxyl group through ring opening; and an optical semiconductor device in which an optical semiconductor is encapsulated with the composition.
    Type: Application
    Filed: July 1, 2008
    Publication date: July 8, 2010
    Inventors: Hideharu Takeuchi, Kouki Hamata, Masaki Kobayashi, Minoru Murata, Takahiro Koshimizu
  • Patent number: 4959509
    Abstract: A grommet assembly for wire harnesses comprises a main grommet unit having a thick large diameter tubular portion and a thin small diameter tubular portion and provided with an opening in the part of a flange thereof including the thick large diameter portion and an auxiliary grommet unit having a thick large diameter tubular portion and a thin small diameter tubular portion and adapted to be fitted into the opening of the main grommet unit. A main wire harness is put through the main grommet unit, while an auxiliary wire harness is put through the auxiliary grommet unit. A hard plate is embedded in the part of the flange confronting the outer periphery of the opening.
    Type: Grant
    Filed: December 26, 1989
    Date of Patent: September 25, 1990
    Assignee: Sumitomo Wiring System, Ltd.
    Inventors: Hideharu Takeuchi, Tsutomu Sakata