Patents by Inventor Hideharu Yoshikawa

Hideharu Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6848155
    Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining a first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.
    Type: Grant
    Filed: May 11, 2004
    Date of Patent: February 1, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Kuratani, Takao Mukai, Tomoyasu Miyata, Hideharu Yoshikawa
  • Publication number: 20040207289
    Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining a first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.
    Type: Application
    Filed: May 11, 2004
    Publication date: October 21, 2004
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Kuratani, Takao Mukai, Tomoyasu Miyata, Hideharu Yoshikawa
  • Patent number: 6791238
    Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: September 14, 2004
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yasuhiro Kuratani, Takao Mukai, Tomoyasu Miyata, Hideharu Yoshikawa
  • Publication number: 20030071539
    Abstract: A method of manufacturing an edge reflection type surface acoustic wave device using a Shear Horizontal type surface acoustic wave includes the steps of making a first half cut defining first end surface portions having a smooth surface, that is, opposing two end surfaces which function as reflection end surfaces, from the upper surface of a piezoelectric substrate after at least one of a plurality of IDTs has been formed on the upper surface of the piezoelectric substrate, making a second half cut for forming second end surface portions having a rough surface after making the first cut, and making a full cut for cutting the piezoelectric substrate so as to reach the lower surface of the piezoelectric substrate outside of the second end surface portions in the surface acoustic wave propagation direction.
    Type: Application
    Filed: September 13, 2002
    Publication date: April 17, 2003
    Inventors: Yasuhiro Kuratani, Takao Mukai, Tomoyasu Miyata, Hideharu Yoshikawa