Patents by Inventor Hidehiko Kando
Hidehiko Kando has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260266971Abstract: A distance measurement system evaluates whether a frequency sweep state of a light source is normal and includes: a light source that outputs FM light; a measurement optical system that splits one beam of the FM light into two beams, one beam of which is then split into two beams and outputs a measurement beat signal; and a reference optical system that splits the other beam of the two beams of FM light into two beams and outputs a reference beat signal. A calculation device performs processing on the measurement beat signal and the reference beat signal to calculate a distance to a measurement object based on the measurement beat signal. A beat signal processing unit processes the reference beat signal to generate a desired signal, and a determination of an abnormality of the light source is made by comparing the desired signal with a reference value.Type: ApplicationFiled: October 10, 2023Publication date: September 10, 2026Inventors: Kenji MARUNO, Tatsuo HARIYAMA, Masahiro WATANABE, Hidehiko KANDO, Hirohito AKIYAMA
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Publication number: 20260243895Abstract: Provided are a distance measurement device and a distance measurement method capable of reducing a distance error induced by polarization. A distance measurement method includes: branching light generated by a laser light source into a reference optical system and a measurement optical system; detecting a reference optical path measurement beat signal from reference light that passed through the reference optical system; detecting a measurement optical path measurement beat signal from measurement light obtained in the measurement optical system via a measurement target; and measuring a distance to the measurement target based on the measurement optical path measurement beat signal and the reference optical path measurement beat signal. A polarization-induced distance error reduction element is provided in one or both of the reference optical system and the measurement optical system.Type: ApplicationFiled: May 15, 2023Publication date: August 20, 2026Inventors: Tatsuo HARIYAMA, Masahiro WATANABE, Kenji MARUNO, Hirohito AKIYAMA, Hidehiko KANDO
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Publication number: 20260227174Abstract: The shape of an object is measured with high accuracy by a probe having a measurement light optical path switching element including a first surface on which the measurement light from an optical element is incident, a second surface that reflects the measurement light incident from the first surface, a third surface that emits the measurement light reflected by the second surface to an object, a fourth surface that is in contact with the second surface, and a fifth surface that emits the measurement light having passed through the second surface to the object. An angle between a normal of the second surface and a rotation axis of the probe is greater than 45 degrees, an angle between a normal of the third surface and the rotation axis is less than 90 degrees, and a normal of the fifth surface is not parallel to the rotation axis.Type: ApplicationFiled: April 20, 2023Publication date: August 6, 2026Inventors: Kenji MARUNO, Masahiro WATANABE, Tatsuo HARIYAMA, Hirohito AKIYAMA, Hidehiko KANDO
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Publication number: 20260036416Abstract: A distance measuring device measures a distance to a target object with high accuracy by reducing stray light in a probe tip end section. In the distance measuring device, the probe tip end section has an optical path switching element that switches an optical path of measurement light incident from the optical element, at a tip end of the probe tip end section. A material of at least a part of the probe tip end section provided at a position opposite to a fifth surface absorbs the measurement light.Type: ApplicationFiled: May 24, 2023Publication date: February 5, 2026Inventors: Tatsuo HARIYAMA, Masahiro WATANABE, Kenji MARUNO, Hirohito AKIYAMA, Hidehiko KANDO
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Publication number: 20250354802Abstract: When a multi-joint robot is adopted in a shape measurement device, the shape of an object is measured with high accuracy without adding an additional drive shaft to the multi-joint robot. The shape measurement device includes a multi-joint robot having a plurality of drive shafts and a non-contact distance measuring sensor attached to the multi-joint robot, in which the multi-joint robot drives only a predetermined single shaft among the plurality of drive shafts to scan an object with measurement light emitted from the non-contact distance measuring sensor.Type: ApplicationFiled: May 29, 2023Publication date: November 20, 2025Inventors: Masahiro WATANABE, Tatsuo HARIYAMA, Kenji MARUNO, Hirohito AKIYAMA, Hidehiko KANDO
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Patent number: 8395504Abstract: An IC label for prevention of forgery includes: a label substrate which has an adhesive agent for affixing the same to an object; a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and a security function portion which is provided on the label substrate and prevents replication.Type: GrantFiled: May 16, 2007Date of Patent: March 12, 2013Assignees: Toppan Printing Co., Ltd., Hitachi, Ltd.Inventors: Kozue Furuichi, Toru Endo, Manabu Suzuki, Hidehiko Kando
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Patent number: 8376236Abstract: A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.Type: GrantFiled: November 13, 2009Date of Patent: February 19, 2013Assignees: Toppan Printing Co., Ltd., Hitachi, Ltd.Inventors: Tatsurou Ozawa, Hidemi Nakajima, Kozue Furuichi, Hidehiko Kando, Shin Kataoka
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Publication number: 20120099725Abstract: A portion of a digital signature value for authenticating the validity of ID information is also used as an ID so as to reduce the amount of data. This is achieved by using a digital signature scheme with a short signature length obtained by transforming a Schnorr signature, which is a typical example of a digital signature scheme.Type: ApplicationFiled: May 10, 2010Publication date: April 26, 2012Applicant: HITACHI, LTD.Inventors: Hisao Sakazaki, Keisuke Hakuta, Hidehiko Kando
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Publication number: 20110290892Abstract: A contactless integrated circuit (IC) label has an IC chip and is capable of exchanging data with an external reading device without contact. The contactless IC label includes: a transparent label base material; an optical variable device formed on a lower surface of the label base material; a conductive layer bonded to and formed on a lower surface of the optical variable device, and configured to function as an antenna of the IC chip; a connecting layer electrically connected to the IC chip; an insulating layer formed between the conductive layer and the connecting layer, and configured to electrically couple the conductive layer and the connecting layer; and an impedance adjusting unit formed on at least the connecting layer of the conductive layer and the connecting layer, and configured to adjust impedances of the conductive layer and the IC chip.Type: ApplicationFiled: November 13, 2009Publication date: December 1, 2011Applicants: Hitachi, Ltd., Toppan Printing Co., Ltd.Inventors: Tatsurou Ozawa, Hidemi Nakajima, Kozue Furuichi, Hidehiko Kando, Shin Kataoka
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Patent number: 8040777Abstract: An information recording method using a recording medium includes forming a plurality of recording pulses in accordance with both a reference waveform having been stored in the recording medium and data regarding a shifting value relying on material of the recording medium also having been stored in the recording medium in a table manner, and recording information included in the plurality of recording pulses to the recording medium. The recording information is arranged to be stored according to the material of the recording medium.Type: GrantFiled: June 14, 2007Date of Patent: October 18, 2011Assignee: Hitachi, Ltd.Inventors: Takeshi Maeda, Hirofumi Sukeda, Hiroyuki Minemura, Hidehiko Kando, Makoto Miyamoto
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Patent number: 8035522Abstract: A circuit chip having a loop-shaped antenna coil on a main surface and a tag sheet having an antenna pattern on a main surface are prepared, and the circuit chip is mounted on the main surface of the tag sheet so as not to place over the antenna pattern. The circuit chip is placed closely to the antenna pattern, and at least the half of the main surface is desirably faced against the antenna pattern. Thus, signals and/or power can be securely exchanged between the circuit chip (or antenna coil) and the antenna pattern. Therefore, a high-performance and rigid RFID tag can be obtained by roughly aligning the circuit chip and the tag sheet.Type: GrantFiled: September 19, 2008Date of Patent: October 11, 2011Assignee: Hitachi, Ltd.Inventors: Noriyuki Oroku, Naoya Kanda, Hidehiko Kando, Kouichi Uesaka
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Patent number: 7861938Abstract: The present invention provides a sheet-shaped material containing an RFID thread. The RFID thread comprises a strip-shaped film onto one side of which a semiconductor chip containing plural bits of memory and provided with an antenna wire is bonded. The strip-shaped film has plural openings formed therethrough except where the semiconductor chip is bonded. Since intertwining occurs between paper fibers via the openings, the RFID thread is strongly fixed in the paper.Type: GrantFiled: August 5, 2008Date of Patent: January 4, 2011Assignee: Hitachi, Ltd.Inventors: Noriyuki Oroku, Hidehiko Kando
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Patent number: 7833841Abstract: The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip which is fabricated on the wafer by the mask shift method and mask combination method.Type: GrantFiled: August 7, 2008Date of Patent: November 16, 2010Assignee: Hitachi, Ltd.Inventors: Hidehiko Kando, Isao Sakama
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Patent number: 7835258Abstract: Conventionally, as in the case of switching between a DVD-R and a DVD-RAM, when the method of record mark arrangement in a track is changed, the physical format of the disk is also changed. This makes it difficult to ensure compatibility between pieces of data recorded by a plurality of different methods of record mark arrangement. According to the present invention, sector address data and block address data are recorded in each sector by using wobbling or deformation of a recording groove. Then, depending on which address is used, sector data structure is modified, thereby making it possible to select an address data detection and a data structure on a disk in a single physical format depending on the purpose.Type: GrantFiled: May 29, 2008Date of Patent: November 16, 2010Assignee: Hitachi, Ltd.Inventors: Hidehiko Kando, Harukazu Miyamoto, Takeshi Maeda
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Publication number: 20100027399Abstract: An information recording medium and information recording method using an optical recording medium in which at least one recording pulse is formed for recording information on the optical recording medium, and the information is recorded to the optical recording medium by irradiating the at least one recording pulse on the optical recording medium. A duration of the at least one recording pulse is determined by a combination of (1) a length of M (n) of a mark being currently written, (2) a length S(n?1) of a space precedent to the mark, and (3) a length S(n+1) of a space subsequent to the mark.Type: ApplicationFiled: October 7, 2009Publication date: February 4, 2010Inventors: Takeshi Maeda, Hirofumi Sukeda, Hiroyuki Minemura, Hidehiko Kando, Makoto Miyamoto
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Publication number: 20090303044Abstract: An IC label for prevention of forgery includes: a label substrate which has an adhesive agent for affixing the same to an object; a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and a security function portion which is provided on the label substrate and prevents replication.Type: ApplicationFiled: May 16, 2007Publication date: December 10, 2009Applicants: TOPPAN PRINTING CO., LTD., HITACHI., LTD.Inventors: Kozue Furuichi, Toru Endo, Manabu Suzuki, Hidehiko Kando
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Patent number: 7609602Abstract: A method of generating a recording pulse train in accordance with a NRZI signal for recording information to a recording medium by irradiating a pulse chain including a first pulse, a middle pulse chain, a last pulse and a negative pulse following the last pulse, including adjusting an average power of the first pulse to a designated peak power level, adjusting an average power of the middle pulse chain to a designated peak power level, adjusting an average power of the last pulse to a designated power level, adjusting an average power of the negative pulse to a designated power level that is lower than the peak power level, and controlling a leading edge of the first pulse of the recording pulse train to start with a variable lapse of time from a leading edge of the NRZI signal, with a duration of the first pulse being fixed.Type: GrantFiled: August 2, 2005Date of Patent: October 27, 2009Assignee: Hitachi, Ltd.Inventors: Hidehiko Kando, Hiroyuki Minemura
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Publication number: 20090159881Abstract: The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip 10 within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip 10 which is fabricated on the wafer by the mask shift method and mask combination method.Type: ApplicationFiled: August 7, 2008Publication date: June 25, 2009Inventors: Hidehiko KANDO, Isao Sakama
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Publication number: 20090090784Abstract: The present invention provides a sheet-shaped material containing an RFID thread. The RFID thread comprises a strip-shaped film onto one side of which a semiconductor chip containing plural bits of memory and provided with an antenna wire is bonded. The strip-shaped film has plural openings formed therethrough except where the semiconductor chip is bonded. Since intertwining occurs between paper fibers via the openings, the RFID thread is strongly fixed in the paper.Type: ApplicationFiled: August 5, 2008Publication date: April 9, 2009Inventors: Noriyuki Oroku, Hidehiko Kando
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Publication number: 20090079574Abstract: A circuit chip having a loop-shaped antenna coil on a main surface and a tag sheet having an antenna pattern on a main surface are prepared, and the circuit chip is mounted on the main surface of the tag sheet so as not to place over the antenna pattern. The circuit chip is placed closely to the antenna pattern, and at least the half of the main surface is desirably faced against the antenna pattern. Thus, signals and/or power can be securely exchanged between the circuit chip (or antenna coil) and the antenna pattern. Therefore, a high-performance and rigid RFID tag can be obtained by roughly aligning the circuit chip and the tag sheet.Type: ApplicationFiled: September 19, 2008Publication date: March 26, 2009Inventors: Noriyuki Oroku, Naoya Kanda, Hidehiko Kando, Kouichi Uesaka