Patents by Inventor Hidehiko Shimizu
Hidehiko Shimizu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11950368Abstract: A flexible printed circuit includes: a chip component serving as an electronic component having a first electrode and the like; a base film; a conductive first pattern layer which is laminated on a portion of the base film and has a bonding region to which the electrode is, for example, soldered; and a coverlay laminated on the base film or the first pattern layer via an adhesive and having an opening for externally exposing a portion of the first pattern layer including the bonding region, and the chip component. The first pattern layer has a groove that opens in a range between the bonding region and an edge of the opening on a surface of the first pattern layer.Type: GrantFiled: June 28, 2022Date of Patent: April 2, 2024Assignee: YAZAKI CORPORATIONInventors: Hidehiko Shimizu, Tomohiro Sugiura
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Publication number: 20230389187Abstract: A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a metal plate that includes a frame part surrounding the electronic component and being fixed to the flexible printed wiring board; and a potting agent that is filled in a region surrounded by the frame part to cover the electronic component.Type: ApplicationFiled: May 19, 2023Publication date: November 30, 2023Inventor: Hidehiko Shimizu
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Publication number: 20230389188Abstract: A conductive module includes: a flexible printed wiring board; an electronic component that is mounted on the flexible printed wiring board and connected to a circuit pattern of the flexible printed wiring board; a first potting agent that covers a connection part between the electronic component and the flexible printed wiring board; and a second potting agent that overlaps the first potting agent from the opposite side of the flexible printed wiring board, and covers the first potting agent and the electronic component. The first potting agent has higher flexibility as compared with the second potting agent.Type: ApplicationFiled: May 19, 2023Publication date: November 30, 2023Inventor: Hidehiko Shimizu
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Publication number: 20230007779Abstract: A flexible printed circuit includes: a chip component serving as an electronic component having a first electrode and the like; a base film; a conductive first pattern layer which is laminated on a portion of the base film and has a bonding region to which the electrode is, for example, soldered; and a coverlay laminated on the base film or the first pattern layer via an adhesive and having an opening for externally exposing a portion of the first pattern layer including the bonding region, and the chip component. The first pattern layer has a groove that opens in a range between the bonding region and an edge of the opening on a surface of the first pattern layer.Type: ApplicationFiled: June 28, 2022Publication date: January 5, 2023Applicant: Yazaki CorporationInventors: Hidehiko SHIMIZU, Tomohiro SUGIURA
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Patent number: 11483924Abstract: A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.Type: GrantFiled: May 12, 2021Date of Patent: October 25, 2022Assignee: YAZAKI CORPORATIONInventors: Keitaroh Nozawa, Hidehiko Shimizu, Shinji Kawai
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Publication number: 20220272829Abstract: An objective of the present invention is to prevent a copper foil used as a recognition mark from being stripped from a base film in a flexible printed board while preventing the recognition accuracy for the recognition mark from being reduced. A flexible printed board includes a base film; a copper foil pattern on the base film, wherein the copper foil pattern has a hollow shape with an outer circumferential section and an inner circumferential section and is configured to function as a recognition mark; a coverlay having an opening formed therein, wherein the coverlay is bonded to the base film and covers the outer circumferential section of the copper foil pattern such that an edge of the opening is positioned between the outer circumferential section and the inner circumferential section of the copper foil pattern.Type: ApplicationFiled: January 19, 2022Publication date: August 25, 2022Applicant: Yazaki CorporationInventors: Hidehiko Shimizu, Tomohiro Sugiura
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Patent number: 11302984Abstract: A pair of end plates is a pair of members provided at both ends of a battery cell assembly in an array direction to clamp the battery cell assembly from both sides in the array direction. The pair of end plates has a plate upper surface and a recess. The plate upper surface is positioned on the same side as that of an electrode mounting surface. The recess is recessed from the plate upper surface and accommodates at least part of a coupling connector. With this configuration, a battery module and a battery monitoring unit mounting structure can prevent the battery module from increasing in size.Type: GrantFiled: December 19, 2019Date of Patent: April 12, 2022Assignee: YAZAKI CORPORATIONInventors: Haruhiko Yoshida, Kimihiro Matsuura, Hidehiko Shimizu, Yuki Chiyajo, Keitaro Nozawa
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Publication number: 20220037735Abstract: A battery connection module includes a plurality of bus bars provided on a battery stack in which a plurality of battery packs are assembled, and attached to electrodes of the battery packs, a flexible printed wiring board provided on the battery stack, and a first electronic component electrically connected to the flexible printed wiring board. The flexible printed wiring board includes a side surface portion which extends outward from above the battery stack and is bent so as to be fixed to a side surface of the battery stack, and the first electronic component is provided on the side surface portion.Type: ApplicationFiled: July 28, 2021Publication date: February 3, 2022Applicant: Yazaki CorporationInventors: Hidehiko SHIMIZU, Keitaroh NOZAWA, Shuhei URAKAMI, Shinji KAWAI
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Publication number: 20210360769Abstract: A substrate support structure includes: a substrate support including: a support body; and a protrusion including a base portion and a leading-end portion, the protrusion protruding from the support body; and a substrate having: a substrate body; a through hole provided at the substrate body; and a protruded portion surrounding the through hole, the protruded portion protruding from a first face of the substrate body, in which the base portion of the protrusion passes through the through hole, and the leading-end portion protrudes from the first face of the substrate body inside the protruded portion and engages with the substrate body such that the through hole is covered.Type: ApplicationFiled: May 12, 2021Publication date: November 18, 2021Applicant: Yazaki CorporationInventors: Keitaroh NOZAWA, Hidehiko Shimizu, Shinji Kawai
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Publication number: 20200295323Abstract: A battery module includes a cell module including a plurality of battery cells, a smoke exhaust duct protruding from an electrode arrangement surface of the cell module and extending along an alignment direction of the plurality of battery cells, and a circuit board arranged so as to cover the smoke exhaust duct and the electrode arrangement surface. The circuit board is arranged in an inclined state to be non-parallel to the electrode arrangement surface.Type: ApplicationFiled: March 9, 2020Publication date: September 17, 2020Inventors: Keitaro Nozawa, Kimihiro Matsuura, Hidehiko Shimizu, Haruhiko Yoshida, Yuki Chiyajo
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Patent number: 10693247Abstract: A fixation structure includes an electrical wire, a board, and a stapler. The electrical wire includes a core wire and a cover member. The electrical wire includes a core-wire covered part covered by the cover member, and a core-wire exposed part exposed from the core-wire covered part. The board includes a junction part electrically connected with the core-wire exposed part. The stapler includes a contact part and a fixation part. The contact part has a plate shape, and is positioned at a boundary between the core-wire exposed part and the core-wire covered part while contacting the core-wire exposed part and the core-wire covered part from a side opposite to the board when the core-wire exposed part is connected with the junction part. A pair of the fixation parts are provided on both sides of the contact part and fix the contact part and the board.Type: GrantFiled: June 19, 2019Date of Patent: June 23, 2020Assignee: YAZAKI CORPORATIONInventors: Yuki Chiyajo, Hidehiko Shimizu, Haruhiko Yoshida, Keitaro Nozawa
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Publication number: 20200127259Abstract: A pair of end plates is a pair of members provided at both ends of a battery cell assembly in an array direction to clamp the battery cell assembly from both sides in the array direction. The pair of end plates has a plate upper surface and a recess. The plate upper surface is positioned on the same side as that of an electrode mounting surface. The recess is recessed from the plate upper surface and accommodates at least part of a coupling connector. With this configuration, a battery module and a battery monitoring unit mounting structure can prevent the battery module from increasing in size.Type: ApplicationFiled: December 19, 2019Publication date: April 23, 2020Applicant: Yazaki CorporationInventors: Haruhiko Yoshida, Kimihiro Matsuura, Hidehiko Shimizu, Yuki Chiyajo, Keitaro Nozawa
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Publication number: 20190393623Abstract: A fixation structure includes an electrical wire, a board, and a stapler. The electrical wire includes a core wire and a cover member. The electrical wire includes a core-wire covered part covered by the cover member, and a core-wire exposed part exposed from the core-wire covered part. The board includes a junction part electrically connected with the core-wire exposed part. The stapler includes a contact part and a fixation part. The contact part has a plate shape, and is positioned at a boundary between the core-wire exposed part and the core-wire covered part while contacting the core-wire exposed part and the core-wire covered part from a side opposite to the board when the core-wire exposed part is connected with the junction part. A pair of the fixation parts are provided on both sides of the contact part and fix the contact part and the board.Type: ApplicationFiled: June 19, 2019Publication date: December 26, 2019Applicant: Yazaki CorporationInventors: Yuki Chiyajo, Hidehiko Shimizu, Haruhiko Yoshida, Keitaro Nozawa
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Patent number: 10197635Abstract: By configuring low-pass filters each with a resistor and a capacitor, noise is removed. Based on a reference value of DC voltage that appears at output terminals of a battery pack circuit, a lowering portion of capacitance that arises in the respective capacitors is estimated in advance, and a compensation value is included in the resistance value of the respective resistors such that the cutoff frequencies of the low-pass filters are within an intended range. Even when a high voltage is handled, the variance in cutoff frequencies can be prevented from arising and the noise in an unnecessary frequency domain can be adequately reduced.Type: GrantFiled: December 14, 2015Date of Patent: February 5, 2019Assignee: YAZAKI CORPORATIONInventors: Yuki Chiyajo, Hidehiko Shimizu, Yasutaka Wakasugi
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Patent number: 10067195Abstract: A first pattern and a second pattern are stacked with each other. In a pattern of a first circuit for high voltage, a GND is formed as a solid pattern. In a pattern of a second circuit for low voltage, a GND is formed as a solid pattern. The solid pattern of the GND of the pattern of the first circuit for high voltage and the solid pattern of the GND of the pattern of the second circuit for low voltage partially face each other, thereby improving noise-resistant performance of the circuit for high voltage.Type: GrantFiled: December 10, 2015Date of Patent: September 4, 2018Assignee: YAZAKI CORPORATIONInventors: Yuki Chiyajo, Hidehiko Shimizu, Yasutaka Wakasugi
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Patent number: 9767683Abstract: A battery monitoring device which is mounted in a vehicle and detects state information of a battery including a plurality of cells connected in series, the battery monitoring device is provided with a detection unit mounted on the battery, and a mounting member mounted on the battery. The detection unit comprises a board including a circuit for detecting the state information of the battery, and a first non-contact communication unit which is mounted on the board and performs non-contact communication via electromagnetic wave. The mounting member comprises a second non-contact communication unit which performs non-contact communication via the electromagnetic wave. The first non-contact communication unit transfers the state information of the battery to the second non-contact communication unit, and the second non-contact communication unit transfers the state information of the battery transferred from the first non-contact communication unit to a host device.Type: GrantFiled: February 18, 2016Date of Patent: September 19, 2017Assignee: YAZAKI CORPORATIONInventors: Hidehiko Shimizu, Haruhiko Yoshida, Ryohtaroh Murata, Yoichi Ido
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Publication number: 20160247389Abstract: A battery monitoring device which is mounted in a vehicle and detects state information of a battery including a plurality of cells connected in series, the battery monitoring device is provided with a detection unit mounted on the battery, and a mounting member mounted on the battery. The detection unit comprises a board including a circuit for detecting the state information of the battery, and a first non-contact communication unit which is mounted on the board and performs non-contact communication via electromagnetic wave. The mounting member comprises a second non-contact communication unit which performs non-contact communication via the electromagnetic wave. The first non-contact communication unit transfers the state information of the battery to the second non-contact communication unit, and the second non-contact communication unit transfers the state information of the battery transferred from the first non-contact communication unit to a host device.Type: ApplicationFiled: February 18, 2016Publication date: August 25, 2016Inventors: Hidehiko Shimizu, Haruhiko Yoshida, Ryohtaroh Murata, Yoichi Ido
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Patent number: 9310443Abstract: A voltage detection apparatus includes a plurality of voltage detection units, each of which detects cell voltages of plural cells in each of blocks in a battery module. Each of blocks includes the plural cells connected in series. The plurality of voltage detection units are respectively supplied with power via power supply lines connected to the blocks. The plurality of voltage detection units are respectively provided with a plurality of current increase units for increasing dark currents so that the dark currents flowing through the power supply lines respectively become a same target value.Type: GrantFiled: February 28, 2012Date of Patent: April 12, 2016Assignees: YAZAKI CORPORATION, HONDA MOTOR CO., LTD.Inventors: Hidehiko Shimizu, Kimihiro Matsuura, Yusuke Tatara, Shintaro Uchida, Takayuki Yamamoto
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Publication number: 20160097818Abstract: By configuring low-pass filters each with a resistor and a capacitor, noise is removed. Based on a reference value of DC voltage that appears at output terminals of a battery pack circuit, a lowering portion of capacitance that arises in the respective capacitors is estimated in advance, and a compensation value is included in the resistance value of the respective resistors such that the cutoff frequencies of the low-pass filters are within an intended range. Even when a high voltage is handled, the variance in cutoff frequencies can be prevented from arising and the noise in an unnecessary frequency domain can be adequately reduced.Type: ApplicationFiled: December 14, 2015Publication date: April 7, 2016Applicant: YAZAKI CORPORATIONInventors: Yuki CHIYAJO, Hidehiko SHIMIZU, Yasutaka WAKASUGI
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Publication number: 20160097817Abstract: A first pattern and a second pattern are stacked with each other. In a pattern of a first circuit for high voltage, a GND is formed as a solid pattern. In a pattern of a second circuit for low voltage, a GND is formed as a solid pattern. The solid pattern of the GND of the pattern of the first circuit for high voltage and the solid pattern of the GND of the pattern of the second circuit for low voltage partially face each other, thereby improving noise-resistant performance of the circuit for high voltage.Type: ApplicationFiled: December 10, 2015Publication date: April 7, 2016Applicant: Yazaki CorporationInventors: Yuki CHIYAJO, Hidehiko SHIMIZU, Yasutaka WAKASUGI