Abstract: A green alga variant having a dual-specificity tyrosine-phosphorylation regulated protein kinase activity that is reduced compared to a dual-specificity tyrosine-phosphorylation regulated protein kinase activity of a parental strain is provided. The green alga variant increases a total amount of a lipid production per unit time and per unit culture area compared to a total amount of a lipid production of the parental strain. A dual-specificity tyrosine-phosphorylation regulated protein kinase of the parental strain is a protein having an amino acid sequence with at least 50% sequence identity with the amino acid sequence of an active site and a substrate recognition site of SEQ ID NO: 4 and having the dual-specificity tyrosine-phosphorylation regulated protein kinase activity.

Abstract: A green alga variant having a dual-specificity tyrosine-phosphorylation regulated protein kinase activity that is reduced compared to a dual-specificity tyrosine-phosphorylation regulated protein kinase activity of a parental strain is provided. The green alga variant increases a total amount of a lipid production per unit time and per unit culture area compared to a total amount of a lipid production of the parental strain. A dual-specificity tyrosine-phosphorylation regulated protein kinase of the parental strain is a protein having an amino acid sequence with at least 50% sequence identity with the amino acid sequence of an active site and a substrate recognition site of SEQ ID NO: 4 and having the dual-specificity tyrosine-phosphorylation regulated protein kinase activity.

Abstract: A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.

Abstract: A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.