Abstract: A chip thermistor includes a chip element assembly having a substantially rectangular shape and three pairs of side surfaces facing each other, and a pair of external electrodes each having a main electrode portion and a side-surface electrode portion, wherein the external electrodes have gaps therebetween, each main electrode portion is disposed on each of a first pair of the side surfaces having a substantially rectangular shape, each side-surface electrode portion is disposed on an end portion of each of four side surfaces which define a second and third pair of the side surfaces, the end portion that is connected with each of the first pair of the substantially rectangular side surfaces each having the main electrode portion thereon, and each of the gaps is on each of the four side surfaces.

Abstract: A thermistor element has a pair of electrodes formed in ohmic contact with and mutually opposite to each other on one of the surfaces of a thermistor body. These electrodes each have a thin-film contact layer and an external electrode layer which is formed either directly or indirectly over the contact layer and only on the surface on which these electrodes are formed opposite each other and is of a metallic material such as Au, Ag, Pd, Pt, Sn and their alloys.

Abstract: A thermistor element has a pair of electrodes formed in ohmic contact with and mutually opposite to each other on one of the surfaces of a thermistor body. These electrodes each have a thin-film contact layer and an external electrode layer which is formed either directly or indirectly over the contact layer and only on the surface on which these electrodes are formed opposite each other and is of a metallic material such as Au, Ag, Pd, Pt, Sn and their alloys.

Abstract: A thermistor device includes a thermistor element body, an ohmic electrode which is provided on a major surface of the thermistor element body with its outer peripheral edge positioned within that of the thermistor element, thereby defining a gap, and an insulating coating which is formed so as to cover a portion where the outer peripheral edge of the ohmic electrode is in contact with the thermistor element body.

Abstract: A thermistor device manufactured at low cost in which atoms of Ag do not migrate substantially into the thermistor body. The device comprises a disk-like thermistor body and annular first electrodes formed in peripheral portions of the front and back surfaces, respectively, of the thermistor body. The first electrodes are made from a conductive material not containing silver. Second electrodes are formed in central portions of the front and back surfaces, respectively, of the thermistor body. The second electrodes are in ohmic contact with the thermistor body, and are made from a conductive material made mostly of silver.

Abstract: A chip-type thermistor has a pair of electrically conductive planar comb-shaped surface electrodes facing each other on one of principal surfaces of a thermistor block, and an insulating layer covers these surface electrodes. A pair of outer electrodes are formed on end surfaces of the thermistor block, each electrically connected to an associated one of the surface electrodes.