Abstract: Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected.

Abstract: Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe card 1 has: a wiring substrate 2 having wiring 4 therein or on a surface thereof or the like; a plurality of probes 3; and a dielectric film 6. The dielectric film 6 is disposed to be spaced a distance away from a main surface 8 of the wiring substrate 2 at a position spaced away further from the wiring substrate 2 than the needle tip parts 13 of the probes 3, so that one surface 21 of the dielectric film 6 faces the needle tip parts 13 and faces the main surface 8 that is a probe installation surface of the wiring substrate 2. The probe card 1 configures a state in which the needle tip parts 13 face an electrode of an object to be inspected with the dielectric film 6 interposed between the probe card 1 and the needle tip parts 13, during an inspection of the object to be inspected.

Abstract: A probe card having uniform temperature distribution under control to a desired temperature is provided, so as to provide an inspection apparatus and an inspection method. The probe card includes a supporting substrate, a wiring layer arranged including a wiring on a main surface of the supporting substrate, a probe arranged on a surface serving as an opposite side to a side of the supporting substrate of the wiring layer so as to be connected to the wiring, and a plurality of heaters. Further, the probe card is virtually divided into heater regions according to a plurality of heater regions arrayed in vertical and horizontal directions in plan view, and at least one of a plurality of heaters is arranged in each of the plurality of heater regions. An inspection apparatus is configured including the probe card, and an object to be inspected is inspected by use of the inspection apparatus.

Abstract: A probe card having uniform temperature distribution under control to a desired temperature is provided, so as to provide an inspection apparatus and an inspection method. The probe card includes a supporting substrate, a wiring layer arranged including a wiring on a main surface of the supporting substrate, a probe arranged on a surface serving as an opposite side to a side of the supporting substrate of the wiring layer so as to be connected to the wiring, and a plurality of heaters. Further, the probe card is virtually divided into heater regions according to a plurality of heater regions arrayed in vertical and horizontal directions in plan view, and at least one of a plurality of heaters is arranged in each of the plurality of heater regions. An inspection apparatus is configured including the probe card, and an object to be inspected is inspected by use of the inspection apparatus.

Abstract: An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

Abstract: An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.

Abstract: A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.

Abstract: An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.

Abstract: An apparatus includes a probe card having a probe board with a conductive path electrically connected to a tester and probes enabling to respectively contact connection pads of a semiconductor wafer on a chuck top and moving relatively to the chuck top, and an elastic heat conducting member arranged between a working surface of the chuck top or the semiconductor wafer on the working surface and the probe board. The elastic heat conducting member can abut on the working surface of the chuck top or the semiconductor wafer on the working surface and the probe board when the probes do not abut on the respective corresponding connection pads and is elastically deformable not to prevent abutment between the probes and the respective corresponding connection pads.

Abstract: A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal.

Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.

Abstract: The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing of the probe assembly caused by the temperature difference between the upper surface and the lower surface of the probe assembly. An electrical connecting apparatus 10 comprises a probe assembly having a plurality of contactors 14 on a lower surface and a plurality of electronic elements 18 arranged on an upper surface, a cover 32 arranged on the upper surface of the probe assembly so as to close a space 30 in which the electronic elements are arranged, and two grippers 42 attached to the cover. Each gripper 42 has one end 42a and the other end 42a, has a region ranging from one end to the other end formed approximately in a U-shape, and is attached to a main body portion 33 of the cover at both the ends.

Abstract: An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: A mounting apparatus that does not compromise the strength of a probe board. The apparatus comprises a probe board spaced from a support member by a spacer. A fixed portion with a female screw hole is mounted on one surface of the probe board. A male screw member is threaded into the screw hole for the purpose of tightening the support member to the probe board at a fixed distance defined by the length of the spacer. The probe board has a support plate. Pluralities of conductive paths penetrate the support plate. A wiring plate wherein wiring paths are connected to corresponding conductive paths, and whose one surface is fixed to the support plate. The other surface is provided with probes corresponding to the wiring paths. The fixed portion includes a female screw member at an area where no conductive paths are formed.

Abstract: The object of the present invention is to prevent an operator from touching electronic elements arranged on an upper surface of a probe assembly of an electrical connecting apparatus at the time of carrying the electrical connecting apparatus and to restrict bowing of the probe assembly caused by the temperature difference between the upper surface and the lower surface of the probe assembly. An electrical connecting apparatus 10 comprises a probe assembly having a plurality of contactors 14 on a lower surface and a plurality of electronic elements 18 arranged on an upper surface, a cover 32 arranged on the upper surface of the probe assembly so as to close a space 30 in which the electronic elements are arranged, and two grippers 42 attached to the cover. Each gripper 42 has one end 42a and the other end 42a, has a region ranging from one end to the other end formed approximately in a U-shape, and is attached to a main body portion 33 of the cover at both the ends.

Abstract: A wiring path of a circuit board has a first vertical path portion penetrating the circuit board at its outer edge in its thickness direction and connected to a connector on one surface, a second vertical path portion penetrating the circuit board in its thickness direction and connected to the electric coupler on the other surface, and a lateral path portion connecting both vertical portions, and the second vertical path portion is formed within an arrangement area (S1) of a reinforcing plate. One connecting end portion (electric coupler side) of the wiring path of the circuit board is disposed within the arrangement area (S1) of the reinforcing plate. On the other hand, the other connecting end portion (probe side) of the wiring path of the circuit board is disposed to be dispersed in an arrangement area (S2) wider than the arrangement area (S1) of the reinforcing plate.

Abstract: A probe assembly for use in electrical measurement of a device under test. The probe assembly comprises a plate-like probe base plate with bending deformation produced in a free state without load, and a plurality of probes formed on one face of the probe base plate to project from the face. All the tips of the probes are positioned on the same plane parallel to an imaginary reference plane of the probe base plate.

Abstract: The present invention provides an electrical connecting apparatus that does not cause lack of mechanical strength in a probe board. The electrical connecting apparatus comprises a probe board spaced from a support member and arranged with its one surface opposed to the support member. On one surface of the probe board is provided a fixed portion having an opened screw hole at its top portion, and on the other surface are provided probes that are connected to a tester. The electrical connecting apparatus comprises a cylindrical spacer keeping a distance from the support member to a top surface of the fixed portion and a male screw member screwed in the screw hole for the purpose of tightening the support member and the probe board at a distance in accordance with the length of the spacer.

Abstract: An electrical connecting apparatus comprising: a circuit board on which a reinforcing plate is mounted and a plurality of first electric connections are provided; a probe board on which second electric connections corresponding to the first electric connections are provided, with a plurality of probes electrically connected to the corresponding second electric connections; an elastic connector having plural pairs of both contacts capable of contacting the first and second electric connections corresponding to each other of both boards therebetween and receiving a biasing force in directions for both contacts to separate from each other; screw members for integrally combining them; and a spacer member for holding the probe tips substantially on the same plane by tightening of the screw members. Between the reinforcing plate and the probe board, a spacer plate is inserted for adjusting a distance from the other surface of the probe board to the probe tips.