Patents by Inventor Hidehiro KOGA

Hidehiro KOGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9735100
    Abstract: A semiconductor device according to the present invention includes a plurality of semiconductor chips, a plate electrode disposed on the plurality of semiconductor chips for connecting the plurality of semiconductor chips, and an electrode disposed on the plate electrode. The electrode has a plurality of intermittent bonding portions to be bonded to the plate electrode and a protruded portion which is protruded erectly from the bonding portions. The protruded portion has an ultrasonic bonding portion which is parallel with the bonding portion and is ultrasonic bonded to an external electrode.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: August 15, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hidetoshi Ishibashi, Yoshihiro Yamaguchi, Naoki Yoshimatsu, Hidehiro Koga
  • Publication number: 20140217569
    Abstract: A semiconductor device according to the present invention includes a plurality of semiconductor chips, a plate electrode disposed on the plurality of semiconductor chips for connecting the plurality of semiconductor chips, and an electrode disposed on the plate electrode. The electrode has a plurality of intermittent bonding portions to be bonded to the plate electrode and a protruded portion which is protruded erectly from the bonding portions. The protruded portion has an ultrasonic bonding portion which is parallel with the bonding portion and is ultrasonic bonded to an external electrode.
    Type: Application
    Filed: October 10, 2013
    Publication date: August 7, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hidetoshi ISHIBASHI, Yoshihiro YAMAGUCHI, Naoki YOSHIMATSU, Hidehiro KOGA