Abstract: An on-vehicle motor-driven compressor includes a compression unit, an electric motor, and an inverter device. The inverter device includes an inverter circuit and a noise reducer. The noise reducer includes a common-mode choke coil and a smoothing capacitor. The common-mode choke coil includes a loop-shaped core, a first winding wound around the core, a second winding wound around the core, the second winding being spaced apart from and opposed to the first winding, and a loop-shaped conductor that covers the core while extending over the first winding and the second winding. The core includes an exposed portion that is not covered with the conductor. Parts of the conductor that are opposed to each other between the first winding and the second winding are spaced apart from each other.

Abstract: An on-vehicle motor-driven compressor includes a compression unit, an electric motor, and an inverter device. The inverter device includes an inverter circuit and a noise reducer. The noise reducer includes a common-mode choke coil and a smoothing capacitor. The common-mode choke coil includes a loop-shaped core, a first winding wound around the core, a second winding wound around the core, the second winding being spaced apart from and opposed to the first winding, and a loop-shaped conductor that covers the core while extending over the first winding and the second winding. The core includes an exposed portion that is not covered with the conductor. Parts of the conductor that are opposed to each other between the first winding and the second winding are spaced apart from each other.

Abstract: A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.

Abstract: A method of manufacturing metal matrix composite with ceramic particles as a disperse phase includes the steps of holding the single metal matrix composite or the plurality of layered metal matrix composites between a pair of pressing dies, pressing the metal matrix composite by the pressing dies, and heating the metal matrix composite.

Abstract: A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10?6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Abstract: A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

Abstract: A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8×10?6/° C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m·K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.

Abstract: A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

Abstract: A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8×10−6/° C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m·K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.

Abstract: A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.

Abstract: A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8×10−6/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m×K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Abstract: A semiconductor module includes a substrate having opposite surfaces, a semiconductor device, and a plate-shaped lead. The semiconductor device is mounted on the substrate, and has opposite surfaces and electrodes. One of the opposite surfaces is disposed on the substrate. The electrodes are disposed on the other one of the opposite surfaces. The plate-shaped lead has an electrode joint joined to the electrodes, a wiring joint joined to a wiring unit disposed outside the semiconductor device, and a connector connecting the electrode joint and the wiring joint. At least the electrode joint includes a high thermal conductor, and a low expander disposed in the high thermal conductor. The semiconductor module is good in terms of the reliability and assembly easiness when wiring the electrodes of the semiconductor device.

Abstract: In a low expansion plate according to the present invention, a Cu member is made to fill the inside of each of through-holes of a perforated plate made of Invar and also to cover both surfaces of the perforated plate. On both surfaces of the Cu member, a concave portion is formed in each portion corresponding to each of the through-holes of the perforated plate and a convex portion is formed in each portion where Invar constituting the perforated plate exists.

Abstract: A radiator system includes a high temperature body being a thermal source, a receiver with the high-temperature body boarded thereon, and a thermal buffer. The receiver receives heat from the high-temperature body. The thermal buffer is interposed at least between the high-temperature body and the receiver to buffer thermal transmission from the high-temperature body to the receiver, includes a high thermal conductor and a low expander disposed at a position facing the high-temperature body and buried in the high thermal conductor, and has a first bonding area with respect to the high-temperature body and a second bonding area with respect to the receiver. The second bonding area is enlarged greater than the first bonding area. The heat from the high-temperature body is radiated by the receiver or is radiated by way of the receiver. Thus, the thermal expansion difference can be minimized between the high-temperature body and receiver.