Patents by Inventor Hidehiro Mikura

Hidehiro Mikura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7733664
    Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: June 8, 2010
    Assignee: DENSO CORPORATION
    Inventors: Atsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
  • Publication number: 20080253096
    Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
    Type: Application
    Filed: June 12, 2008
    Publication date: October 16, 2008
    Applicant: DENSO CORPORATION
    Inventors: Atsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
  • Patent number: 7419385
    Abstract: A connector mounting structure includes a circuit board, a surface mount connector mounted to the circuit board, and an electronic component. The connector includes a connector body and a plurality of conductive terminals. The connector body has a base portion placed on a front surface of the circuit board and a tube portion. The terminals are disposed in the base portion of the connector body. The tube portion has a first opening portion for partially receiving the circuit board and a second opening portion for communicating with an external device. The electronic component is mounted to a back surface of the circuit board. A space for the electronic component is provided approximately beneath the base portion, between the back surface of the circuit board and the first opening portion of the tube portion.
    Type: Grant
    Filed: February 27, 2007
    Date of Patent: September 2, 2008
    Assignee: DENSO COPRPORATION
    Inventors: Dai Itou, Hidehiro Mikura, Atsushi Ito, Takayoshi Honda, Tadashi Tsuruzawa
  • Patent number: 7400511
    Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: July 15, 2008
    Assignee: Denso Corporation
    Inventors: Atsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
  • Publication number: 20070218715
    Abstract: A connector mounting structure includes a circuit board, a surface mount connector mounted to the circuit board, and an electronic component. The connector includes a connector body and a plurality of conductive terminals. The connector body has a base portion placed on a front surface of the circuit board and a tube portion. The terminals are disposed in the base portion of the connector body. The tube portion has a first opening portion for partially receiving the circuit board and a second opening portion for communicating with an external device. The electronic component is mounted to a back surface of the circuit board. A space for the electronic component is provided approximately beneath the base portion, between the back surface of the circuit board and the first opening portion of the tube portion.
    Type: Application
    Filed: February 27, 2007
    Publication date: September 20, 2007
    Applicant: DENSO CORPORATION
    Inventors: Dai Itou, Hidehiro Mikura, Atsushi Ito, Takayoshi Honda, Tadashi Tsuruzawa
  • Publication number: 20070193774
    Abstract: An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
    Type: Application
    Filed: February 20, 2007
    Publication date: August 23, 2007
    Applicant: DENSO CORPORATION
    Inventors: Atsushi Ito, Takayoshi Honda, Hidehiro Mikura, Tadashi Tsuruzawa, Takuya Sakuta
  • Patent number: 6303878
    Abstract: A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.
    Type: Grant
    Filed: July 23, 1998
    Date of Patent: October 16, 2001
    Assignee: Denso Corporation
    Inventors: Kenji Kondo, Masayuki Aoyama, Koji Kondo, Masanori Takemoto, Hidehiro Mikura, Tetuhiro Nakano