Abstract: A production system has a plurality of production apparatuses, a conveyer which conveys to each production apparatus at each lot, a lot management computer which controls the degree of progress of the production process in each lot, apparatus management computers which control each of production apparatuses, and an intensive management computer which detects the degree of progress of the production process in each lot and operating state of each production apparatus. User interface sections are connected to the apparatus management computer and the intensive management computer, respectively. The user interface sections comprise display apparatuses, respectively. In the screen of the display apparatuses, operating state of each production apparatus and the degree of progress of the production process of the lot in each production apparatus are displayed.

Abstract: A production system comprises a plurality of production apparatuses 1, a conveyer 2 which conveys to each production apparatus 1 at each lot, a lot management computer 3 which controls the degree of progress of the production process in each lot, apparatus management computers 4 which control each production apparatuses 1, and an intensive management computer 5 which detect the degree of progress of the production process in each lot and operating state of each production apparatus 1. User interface sections 6 and 7 are connected to the apparatus management computer 4 and the intensive management computer 5, respectively. The user interface sections 6 and 7 comprise display apparatuses, respectively. In the screen of the display apparatuses 7a, operating state of each production apparatus and the degree of progress of the production process of the lot in each production apparatus are displayed.

Abstract: A process flow, in which wafer processing conditions are described for forming a semiconductor through a plurality of processes, is formed for each lot in one type. A wafer processing is formed for each lot in one type of semiconductor in accordance with the process flow. When a different processing condition should be described according to a wafer in the lot in a certain process of the process flow, the process flow forming includes forming a plurality of different flows in that process by defining division/combination locations from a parent flow. When a faulty processing occurs in the wafer processing in a certain process, the process flow associated with that process is reformed, and a reprocessing is performed in accordance with the reformed process flow.