Patents by Inventor HIDEHIRO TAZAWA

HIDEHIRO TAZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10361166
    Abstract: Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: July 23, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Osamu Kakutani, Hidehiro Tazawa, Masahito Tuji
  • Publication number: 20170053889
    Abstract: Provided is a bonding apparatus including a table (52), a first reaction member (58A) and a second reaction member (58B), which are each provided movably in a Y axis direction with respect to a pedestal (41). The first and second reaction members are each configured to move in a direction opposite to the table in the Y axis direction when the table moves in the Y axis direction. As viewed in an X axis direction, the first and second reaction members are arranged on both sides of the table, respectively, with the table being interposed between the first and second reaction members, so that the centers of gravity of the first and second reaction members are positioned based on the center of gravity of the table. Consequently, the bonding apparatus can suppress an increase in space, and can improve a weight balance on the pedestal.
    Type: Application
    Filed: September 1, 2016
    Publication date: February 23, 2017
    Applicant: SHINKAWA LTD.
    Inventors: OSAMU KAKUTANI, HIDEHIRO TAZAWA, MASAHITO TUJI