Patents by Inventor Hidehiro Tsubakihara

Hidehiro Tsubakihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5800193
    Abstract: An electronic component connector used for mounting an electronic component comprises a frame member and an elastic member attached to the frame member. The elastic member includes an elastic member attachment portion, an electronic component pressing portion, and a press-canceling member engagement portion. The elastic member attachment portion is attached to the frame member. The electronic component pressing portion is capable of pressing the electronic component toward the frame member. The press-canceling member engagement portion is integrally attached to the electronic component pressing portion. The electronic component pressing portion is movable in a direction away from the frame member by engaging a press-canceling member with the press-canceling member engagement portion, and moving the press-canceling member in a direction away from the frame member.
    Type: Grant
    Filed: September 19, 1996
    Date of Patent: September 1, 1998
    Assignees: Sumitomo Metal Industries Limited, Enplas Corporation
    Inventors: Hidehiro Tsubakihara, Yasushi Kajiwara, Michihiko Tetsuka
  • Patent number: 5727955
    Abstract: A socket for electronic components for electrically connecting an electronic component with an electronic circuit substrate. The socket has a frame for engaging the electronic component; a film-shaped connector which is retained by the frame and which has a first terminal to be connected to the terminal of the electronic component, a second terminal to be connected to the terminal of the electronic circuit substrate, and a wiring for electrically connecting the first terminal with the second terminal corresponding to the first terminal; and a cover mounted on the frame, for covering the electronic component, to make the terminal of the electronic component come into contact with the first terminal.
    Type: Grant
    Filed: September 24, 1996
    Date of Patent: March 17, 1998
    Assignee: Sumitomo Metal Industries Limited
    Inventor: Hidehiro Tsubakihara