Patents by Inventor Hidehiro Watanbe

Hidehiro Watanbe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High integration semiconductor device
    Patent number: 5248891
    Abstract: A high integration semiconductor device comprises a semiconductor substrate and element separating regions formed on the semiconductor substrate to divide the semiconductor substrate into a plurality of regions to be formed as semiconductor active regions. The semiconductor active regions have contact portions for conducting the semiconductor active regions to other portions. The element separating regions are so constituted that the width of a short side of each of the semiconductor active regions at each contact portion is narrower than the width of a short side of the other portion of the semiconductor active region.
    Type: Grant
    Filed: October 2, 1992
    Date of Patent: September 28, 1993
    Inventors: Hiroshi Takato, Hidehiro Watanbe