Abstract: A hot-air supply structure (1) comprises a hot air generator (20) and a housing (15) formed in the neighborhood of a hot-air inlet (81) of a molded component M in a die (10). A nozzle (21) is formed at the forward end of the hot-air generator, and an ejection port (211b) is formed on the side wall portion of the forward end needle unit (211) of the nozzle. The housing includes a support hole (151) in the nozzle, a relief hole (152), a flow path communication passage (153) and a bypass (154). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path (8) of the molded component through the inlet (81) and the passage (153).

Abstract: The change-over device changes over, to one of three passages, between the runner groove connected to the injection nozzle and the communicating groove communicated with the mold side passage. At the first position, the second passage 372 is communicated with the communicating groove and the temperature of a flow of hot air is measured by the thermocouple and the flow is discharged into the atmosphere. At the second position, the runner groove and the communicating groove are communicated with each other when the runner groove and the communicating groove are open to the second passage 371 and resin material is injected into the mold. At the third position, the material in the injection passage and the material in the runner groove are deposited to each other when the injection passage is shut off from the communicating passage and the third passage 374 is communicated with the runner groove.

Abstract: A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the radiator plate and at least a part of the side surface adjoining the outer main surface are exposed from the molded resin.

Abstract: The device includes: a runner block arranged at a position close to the injection port for resin material for secondary forming; and a slide core moved relatively with the runner block. In the runner block, a guide passage is formed which is communicated with a passage formed when pipe-shaped passages of the primary moldings are butted against each other. A heating medium passage or a resin material passage formed in the slide core are moved so that either the heating medium passage or the resin material passage can be selectively communicated with the guide passage formed in the runner block.

Abstract: A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said semiconductor device and said radiator, wherein an outer main surface of the radiator plate and at least a part of the side surface adjoining the outer main surface are exposed from the molded resin.

Abstract: A hot-air supply structure (1) comprises a hot air generator (20) and a housing (15) formed in the neighborhood of a hot-air inlet (81) of a molded component M in a die (10). A nozzle (21) is formed at the forward end of the hot-air generator, and an ejection port (211b) is formed on the side wall portion of the forward end needle unit (211) of the nozzle. The housing includes a support hole (151) in the nozzle, a relief hole (152), a flow path communication passage (153) and a bypass (154). The ejection port is movable between a first position to discharge the cool or warm air into the atmosphere through the bypass from the relief hole and a second position to introduce hot air into the flow path (8) of the molded component through the inlet (81) and the passage (153).

Abstract: The change-over device changes over, to one of three passages, between the runner groove connected to the injection nozzle and the communicating groove communicated with the mold side passage. At the first position, the second passage 372 is communicated with the communicating groove and the temperature of a flow of hot air is measured by the thermocouple and the flow is discharged into the atmosphere. At the second position, the runner groove and the communicating groove are communicated with each other when the runner groove and the communicating groove are open to the second passage 371 and resin material is injected into the mold. At the third position, the material in the injection passage and the material in the runner groove are deposited to each other when the injection passage is shut off from the communicating passage and the third passage 374 is communicated with the runner groove.

Abstract: The device includes: a runner block arranged at a position close to the injection port for resin material for secondary forming; and a slide core moved relatively with the runner block. In the runner block, a guide passage is formed which is communicated with a passage formed when pipe-shaped passages of the primary moldings are butted against each other. A heating medium passage or a resin material passage formed in the slide core are moved so that either the heating medium passage or the resin material passage can be selectively communicated with the guide passage formed in the runner block.