Patents by Inventor Hidehito Ishida

Hidehito Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10847776
    Abstract: A conductive module applied to a battery pack includes a connection terminal electrically coupled to an electrode terminal, and a flexible substrate that includes a flexible base film having insulating property, a conductive layer in which a first circuit pattern is configured by a first conductor that electrically couples the connection terminal to a monitoring device, and a reinforcing protective film covering the conductive layer. The reinforcing protective film includes a first exposed portion that exposes a first connection end portion of the first conductor from the reinforcing protective film, and has relatively higher rigidity than rigidity of the flexible base film.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: November 24, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Shigemi Hashizawa, Hidehito Ishida, Mitsuhiro Matsumoto
  • Publication number: 20180248167
    Abstract: A conductive module applied to a battery pack includes a connection terminal electrically coupled to an electrode terminal, and a flexible substrate that includes a flexible base film having insulating property, a conductive layer in which a first circuit pattern is configured by a first conductor that electrically couples the connection terminal to a monitoring device, and a reinforcing protective film covering the conductive layer. The reinforcing protective film includes a first exposed portion that exposes a first connection end portion of the first conductor from the reinforcing protective film, and has relatively higher rigidity than rigidity of the flexible base film.
    Type: Application
    Filed: February 23, 2018
    Publication date: August 30, 2018
    Inventors: Shigemi Hashizawa, Hidehito Ishida, Mitsuhiro Matsumoto
  • Patent number: 5545854
    Abstract: A novel grommet assembly for securely sealing a wire harness or cable to an automotive panel opening is achieved with separate, identical grommet halves whose components are axially assembled. The assembled grommet halves are radially mated over the cable and lockingly inserted into the dash panel opening to provide an airtight seal between the cable and the opening. The grommet assembly includes rigid inner and outer shell portions which are axially locked to sandwich a resilient seal therebetween. The seal essentially fills the space between the inner and outer shells, and is both axially and radially compressed upon assembly of the grommet halves, and further when the grommet halves are mated over the cable. The compressive forces on the seal ensure a secure, airtight sealing interface with the cable, between the components of the grommet assembly, and with the dash panel.
    Type: Grant
    Filed: December 29, 1993
    Date of Patent: August 13, 1996
    Assignee: Yazaki Corporation
    Inventor: Hidehito Ishida