Patents by Inventor Hidehito Okano

Hidehito Okano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Joint forming sheet or tape and method for joint formation using the same
    Patent number: 5342468
    Abstract: A joint forming sheet comprising a substrate having an easy release surface having a contact angle with water of at least 50.degree., having provided on the easy release surface thereof an inorganic thin layer, the interfacial adhesive force of the inorganic thin layer to the substrate surface being greater than the tensile strength of the inorganic thin layer. The inorganic thin layer can be released and transferred to a part on which an electrical joint is to be formed with high precision to form a joint causing no electrical connection failure.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: August 30, 1994
    Assignee: Nitto Denko Corporation
    Inventors: Shozo Kawazoe, Hidehito Okano