Abstract: A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit device described herein includes a semiconductor chip and a package on which the semiconductor chip is disposed. The semiconductor chip includes first electrode pads, and the package includes second electrode pads connected to the first electrode pads. The second electrode pads include signal pads and power supply pads, and are arranged in rows along the semiconductor chip. All the power supply pads of the second electrode pads are for supplying power to the semiconductor chip and are disposed in a row positioned farther from the semiconductor chip than another row. Each power supply line that leads out from a second power supply pad has a width not less than a width of the second power supply pad.

Abstract: A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

Abstract: A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.

Abstract: A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.

Abstract: A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

Abstract: A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

Abstract: A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

Abstract: A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.

Abstract: A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.

Abstract: A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

Abstract: A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

Abstract: A cable arranging structure for exchanging electric signals between a pair of printed circuit boards includes at least a pair of electrically conductive members adapted to arrange the cable between them over the entire length thereof. The electrically conductive members show an electric potential substantially equal to that of the ground. Such a structure requires only the two electrically conductive members to be rigidly secured so that radiant noises generated by the cable can be effectively suppressed by means of the structure without the need of deforming the cable.

Abstract: A multilayered printed circuit board includes a first surface layer that includes a semiconductor integrated circuit, a second surface layer that includes a bypass capacitor and that is opposite to the first surface layer, a main power supply wiring layer, and a ground layer between the first and second surface layers. In the multilayered printed circuit board, one terminal of the bypass capacitor is connected to a midpoint of a wiring path from the main power supply wiring layer to a power supply terminal of the semiconductor integrated circuit, and an impedance of a first wiring path from the main power supply wiring layer to the terminal of the bypass capacitor is higher than an impedance of a second wiring path from the terminal of the bypass capacitor to the power supply terminal of the semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit device is provided which comprises a semiconductor chip having wire bonding pads and a package encapsulating the semiconductor chip and connected via bonding wires to the wire bonding pads, wherein wire bonding pads on the semiconductor chip are arranged in two rows in a staggered manner along a periphery of the semiconductor chip, and of the wire bonding pads, power supply pads are arranged in a rear row located close to a semiconductor integrated circuit unit as an active area on the semiconductor chip and in a front row, only signal pads are arranged. Because the power supply pads are provided in the rear row, the line width of a power supply line led out from each power supply pad can be made equal to the width of the pad, thus reducing the impedance of the connection circuit between the semiconductor chip and the package, and suppressing generation of radiation noise, ground bounce and so on.

Abstract: A digital electronic apparatus includes a plurality of units and a cable. The plurality of units have metallic housings and are combined such that surfaces of the metallic housings are opposed to each other. The cable is laid on a surface of the metallic housing of at least one of the units. The surface on which the cable is laid is other than the surfaces of the metallic housings that are opposed to each other.

Abstract: A cable arranging structure for exchanging electric signals between a pair of printed circuit boards comprises at least a pair of electrically conductive members adapted to arrange the cable between them over the entire length thereof. The electrically conductive members show an electric potential substantially equal to that of the ground. Such a structure requires only the two electrically conductive members to be rigidly secured so that radiant noises generated by the cable can be effectively suppressed by means of the structure without the need of deforming the cable.

Abstract: This invention is directed to provide a shielded cable connector that can stabilize electrical connection between a cable-side shield member and a board-side ground pattern. In order to achieve this object, a shielded cable connector to be mounted on a shielded cable having a signal transmission line and a shield member around it includes a metal outer shell member to come into direct contact with the shield member. The outer shell member includes a contact portion extended to come into direct contact with a ground pattern of an electric board to which the shielded cable is to be connected.

Abstract: A shielded cable with a connector, in which the connector is connected to an end portion of the shielded cable formed by covering a plurality of cores with a shielding member, comprises an electrode portion provided with a plurality of electrodes connected to the cores, a conductive inner housing having a fitting portion for fitting to a connector which is to be fitted to the connector, and having the electrode portion therein, and a conductive outer housing which is used in combination with the inner housing and contains cores exposed from the shielded cable, wherein the outer housing is electrically connected to the shielding member, and the outer housing is electrically connected to the inner housing through a conductive connecting portion electrically connected to the fitting portion of the inner housing.