Patents by Inventor Hideji Aoki
Hideji Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6530764Abstract: A resin-sealing mold for encapsulating a semiconductor device includes upper and lower molds with a first cavity insert forming a cavity side face portion; a first elastic post supporting the first cavity insert; an elastic plate, built in the first cavity insert, forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. Generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section is prevented, and, consequently, a resin-sealing mold with high reliability is produced.Type: GrantFiled: January 29, 2001Date of Patent: March 11, 2003Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Yoshiyuki Mishima, Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno, Kiyoharu Kato
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Patent number: 6363976Abstract: A semiconductor manufacturing apparatus and a method of manufacturing a semiconductor device are provided. A horizontal driver (111) and a vertical driver (112) are controlled to move a punch holder (110), or an end portion (101T1) of a punch (101), within a plane defined by first and second directions (D1, D2). A tip (101A) of the punch (101) is brought into contact with leads (11), with a punch-side forming surface (101S) and a die-side forming surface (151S) maintained in parallel relationship. A pressurizer (131) is controlled to move the end portion (101T1) in a fourth direction (D4) toward the die-side forming surface (151S), and the punch-side forming surface (101S) and the die-side forming surface (151S) hold the leads (11) therebetween. A pressure detector (121) detects a load placed upon the punch (101).Type: GrantFiled: February 2, 2000Date of Patent: April 2, 2002Assignee: Mitsubishi Electric Engineering Co., Ltd.Inventors: Hideji Aoki, Hidekazu Manabe, Katsuhito Kamachi
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Publication number: 20020012716Abstract: In a resin-sealing mold of a semiconductor device, each of the upper and lower molds is provided with: a first cavity insert for forming a cavity side face portion; a first elastic post for supporting the first cavity insert; an elastic plate, built in the first cavity insert, for forming a cavity bottom portion; a second cavity insert embedded at a position adjacent to the elastic plate on the side opposite to the cavity; a second elastic post for supporting the second cavity insert; a retainer including the first cavity insert and the second cavity insert; and a backing plate to which the first elastic post, the second elastic post and the retainer are attached. It becomes possible to prevent the generation of thin burrs that tend to appear on the periphery of the package and in the vicinity of the cull section, and consequently to provide a resin-sealing mold with high reliability.Type: ApplicationFiled: January 29, 2001Publication date: January 31, 2002Inventors: Yoshiyuki Mishima, Tetsuya Hirose, Hideji Aoki, Hiromichi Yamada, Toru Ueno, Kiyoharu Kato
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Patent number: 6337042Abstract: An object is to reduce mutual interference between a plurality of sets of molds coupled to a common frame stand to improve the processing accuracy. A plurality of sets (e.g. two sets) of molds are driven by servo motors (6a, 6b). The servo motors (6a, 6b) are individually controlled by servo amplifiers (8a, 8b), respectively. A control portion in the servo amplifier (8a) calculates a current (I) so that the measured value (X) of the rotating position of the servo motor (6a) follows a directing value (X0) sent from a CPU through a pulse generator (9). A torque detecting/limiting portion (25) limits the calculated current (I) so that a limit value of the torque sent from the CPU through a DA converter (12) is not exceeded and sends it to the servo motor (6a) through a current amplifier (26). When the torque of the servo motor (6a) reaches the limit value after the molds come in contact, the directing value (X0) is rapidly advanced in the mold-losing direction.Type: GrantFiled: September 14, 1999Date of Patent: January 8, 2002Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Co., Ltd.Inventors: Suekazu Nakashima, Yasuo Kawano, Hideji Aoki
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Patent number: 6242287Abstract: Provided are a method for manufacturing a semiconductor device in which a sealing resin is prevented from being damaged and generation of a resin piece is suppressed, a press die for suppressing the generation of the resin piece, and a guide rail. A frame receiving die (11) includes a cavity (11d) having a rectangular contour shape seen on a plane which serves to house a sealing resin (3) therein, and a remaining gate housing section (11c) provided on any of four corners of the cavity (11d) corresponding to a remaining gate (3b) on a lower face of a corner (2a) of a lead frame (2). A lower gate punch (11a) is provided in a boundary portion between the cavity (11d) and the remaining gate housing section (11c). When the lead frame (2) is mounted on the frame receiving die (11), the sealing resin (3) is housed in the cavity (11d) and the remaining gate (3b) is housed in the remaining gate housing section (11c).Type: GrantFiled: March 20, 1998Date of Patent: June 5, 2001Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Co., Ltd.Inventors: Hideji Aoki, Hidenori Sekiya, Kenichirou Katou, Hiromu Nishitani
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Patent number: 5842257Abstract: A process wherein a lead frame into which a plurality of semiconductor devices are integrated is first supplied to a press unit (21) among three press units (21 to 23) for cutting, to be cut into the respective semiconductor devices. Thereafter the lead frame is successively fed to the press units (22, 23) in the units of the semiconductor devices due to the action of an internal conveyor (33a), thereby being subjected to cutting stepwise. Thus, the press units (21 to 23) are provided at wide spaces, whereby press motors (85a to 85c) requiring high outputs are independently set for the respective press units (21 to 23). Further, the process does not vary the space between molds with the product pitch of the lead frame. Working is enabled by the press motors which are provided for the respective press units. The process copes with various types of semiconductor devices because the space between the molds may not be changed.Type: GrantFiled: December 13, 1995Date of Patent: December 1, 1998Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Takahiro Tashima, Hideji Aoki
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Patent number: 5636127Abstract: In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.Type: GrantFiled: February 26, 1996Date of Patent: June 3, 1997Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hideji Aoki, Hidetaka Yamasaki, Kazuhisa Hiroshige
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Patent number: 5587633Abstract: It is an object to obtain a press apparatus and a press controlling method which apply press working to a processed object with accurate press load and is capable of press working with accurate press load without affected by variations in thickness of the processed objects and variations in shut height of molds. A servo motor (51) is connected concentrically to a rotation transmitter (52), and a screw shaft (53) is provided passing through the center of the rotation transmitter (52). The driving force of the servo motor (51) is converted into a thrusting force of a press ram (54) by combining the rotation transmitter (52) and the screw shaft (53). Correct press load is applied to the processed objects and troubles in the press processing caused by variations in thickness of the processed objects can be prevented.Type: GrantFiled: December 27, 1995Date of Patent: December 24, 1996Assignees: Mitsubishi Denki Kabushiki Kaisha, Mitsubishi Electric Engineering Co., Ltd.Inventors: Hideji Aoki, Takahiro Tashima, Suekazu Nakashima, Yoshiyuki Osako, Hidetaka Yamasaki
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Patent number: 5520276Abstract: In order to efficiently carry and locate a plurality of types of sheet frames having different dimensions, it is possible to change and adjust positions of lower guide rails in response to a width of a supplied lead frame in a shorter-side direction (X). A carrier device and a stop device can adjust and change a carriage distance in a carriage direction and a stop position in response to a longitudinal width of the lead frame respectively. Thus, it is possible to carry and locate sheet frames in response to various dimensions thereof.Type: GrantFiled: April 9, 1993Date of Patent: May 28, 1996Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hideji Aoki, Hidetaka Yamasaki, Kazuhisa Hiroshige
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Patent number: 5177992Abstract: A thin-web frame feeding device for intermittently feeding a thin-web frame at a predetermined pitch along a guide rail has first and second shafts supported by bearing stands for synchronized axial sliding motion in the same direction and for rotation in opposite directions. The first and second shafts are provided with feeding claws rotatable in accordance with the rotation of the shafts into and out of positions where spontaneous portions of the thin-web frame are clamped. The feeding claws are axially moved in accordance with the axial sliding movement of the shafts to feed the thin-web frame.Type: GrantFiled: August 21, 1991Date of Patent: January 12, 1993Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Hideji Aoki, Toshinobu Banjo
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Patent number: 4626960Abstract: A semiconductor device including a ceramic base having a cavity carrying a semiconductor chip, and a ceramic cap covering and sealing the ceramic base. The cap has a metallization pattern covering not only a region where it contacts the base but also the four side surfaces of the cap, which is provided in order to prevent flow or flying out of excess solder toward the outside of the cap and the base and into the cavity.Type: GrantFiled: November 28, 1984Date of Patent: December 2, 1986Assignee: Fujitsu LimitedInventors: Toshio Hamano, Kaoru Tachibana, Hideji Aoki
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Patent number: 4590672Abstract: A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.Type: GrantFiled: July 20, 1982Date of Patent: May 27, 1986Assignee: Fujitsu LimitedInventors: Shokichi Shimizu, Hideji Aoki, Susumu Kida, Yuki Kanazawa
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Patent number: 4558346Abstract: A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip attached to the gold layer so as to ground the terminal metal chips leads, bonding wires, a cap, and glass layers for sealing the device. The terminal metal chip has a lower coating layer made of a gold-silicon type of alloy for attachment. The bond strength of the terminal metal chip is not decreased although a heat treatment is carried out to seal the glass.Type: GrantFiled: March 23, 1983Date of Patent: December 10, 1985Assignee: Fujitsu LimitedInventors: Susumu Kida, Hayato Usami, Hideji Aoki
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Patent number: 4458291Abstract: A package for enclosing semiconductor elements having side surfaces at which cross sections of conductive wires for receiving a voltage to effect electric plating are exposed. The side surfaces are provided with a static electricity-preventing device, such recesses formed in the side surfaces, insulating films formed on the side surfaces or removable frames positioned on the side surfaces, so that a high voltage due to static electricity from an exterior source is not applied to the conductive wires.Type: GrantFiled: July 20, 1982Date of Patent: July 3, 1984Assignee: Fujitsu LimitedInventors: Mamoru Yanagisawa, Hidehiko Akasaki, Hideji Aoki