Abstract: A method of placing a protective member on a workpiece includes a sheet producing step of heating a plate-shaped thermoplastic resin to soften or melt the same while gripping and pulling outer edges of the thermoplastic resin in at least four directions to produce a sheet-like protective member, and after the sheet producing step, an integrating step of heating and bringing the sheet-like protective member into intimate contact with the workpiece to integrate the workpiece and the protective member with each other.

Abstract: Provided is a polishing liquid supply device capable of selectively supplying a plurality of different polishing liquids to a vessel for storing the polishing liquid used in a polishing apparatus. The polishing liquid supply device includes a plurality of ejection nozzles provided according to the plurality of different polishing liquids, a sensor that detects a position corresponding to one of the plurality of ejection nozzles at which a supplied port of the vessel is disposed, a storage device that stores information concerning the polishing liquid selected from the plurality of polishing liquids, and a processing device that performs a control to eject the polishing liquid from the ejection nozzle corresponding to the polishing liquid indicated by the information stored in the storage device.

Abstract: A method of manufacturing a small-diameter wafer from a wafer having one face and the other face, the one face being mirror-polished, is provided. The method includes a protective member covering step of covering the one face of the wafer with a first protective member and the other face of the wafer with a second protective member, a cut-out step of cutting out a plurality of small-diameter wafers from the wafer covered with the first protective member and the second protective member, a chamfering step of chamfering an outer periphery portion of each of the plurality of small-diameter wafers, and a protective member removing step of removing the first protective member and the second protective member from each of the plurality of small-diameter wafers.